IP Library Granted Patent US 8,882,930
Granted Patent B2
US 8,882,930 · App. 13/151,624 · Granted Nov 11, 2014

Method for processing process-target object

Inventor: Atsushi Miyanari (Kawasaki, JP)
Assignee: Tokyo Ohka Kogyo Co., Ltd.
H01L21/02076
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Quick Facts
Patent No.
US 8,882,930
App. No.
13/151,624
Granted
Nov 11, 2014
Kind
B2
Abstract

Provided is a method including the steps of: carrying out a storage process by causing a processing jig, which has a supply opening for supplying a first processing liquid, to be positioned such that a storage space section into which the supply opening is open is sandwiched by the processing jig and the process-target surface, and by storing the first processing liquid in the storage space section; and carrying out a rotation process by supplying the first processing liquid onto the process-target surface from the supply opening, while supplying a second processing liquid onto the outer peripheral part, in a state where the process-target object is being rotated, in the step for carrying out the rotation process, the processing jig being moved along a direction which is not a direction along which the process-target object is being rotated.

Claims (58)

1. A method for processing a process-target object, the process-target object having a process-target surface and an outer peripheral part which is provided along an outer periphery of the process-target surface,

said method comprising the steps of:

carrying out a storage process by causing a processing jig, which has a supply opening for supplying a first processing liquid, to be positioned such that a space into which the supply opening is open is sandwiched by the processing jig and the process-target surface, and by storing the first processing liquid in said space; and

carrying out a rotation process by supplying the first processing liquid onto the process-target surface from the supply opening, while supplying a second processing liquid onto the outer peripheral part, in a state where the process-target object is being rotated, wherein:

in the step for carrying out the rotation process, the processing jig is moved along a direction which is not a direction along which the process-target object is being rotated;

in the step for carrying out the storage process, a region of the process-target surface which region is in contact with said space is smaller than the entire process-target surface; and

in the step for carrying out the storage process, the processing jig is moved along a direction which is in parallel with the process-target surface.

2. The method as set forth in claim 1 , wherein:

a distance between the processing jig and the process-target surface in the step for carrying out the rotation process is greater than that in the step for carrying out the storage process.

3. The method as set forth in claim 1 , wherein:

in the step for carrying out the rotation process, the process-target object is being rotated at a rotating speed within a range from 100 min −1 or more and less than 1000 min −1 .

4. The method as set forth in claim 1 , wherein:

in the step for carrying out the rotation process, the first processing liquid is supplied from the supply opening at a flow rate greater than that in the step for carrying out the storage process.

5. The method as set forth in claim 1 , wherein:

in the step for carrying out the rotation process, the second processing liquid is supplied onto the outer peripheral part in such a manner that the second processing liquid is supplied to a substantial boundary between the process-target surface and the outer peripheral part.

6. The method as set forth in claim 1 , further comprising the step of, after the step for carrying out the rotation process:

carrying out a spray process by preparing a mixture of the first processing liquid and a gas and by spraying the mixture onto the process-target surface.

7. The method as set forth in claim 1 , further comprising the step of, after the step for carrying out the rotation process:

drying the process-target surface by supplying a gas onto the process-target surface.

8. The method as set forth in claim 1 , wherein:

the step for carrying out the storage process includes:

a center process stage for positioning the processing jig above a center of the process-target surface; and

an outer-edge process stage for positioning the processing jig above an outer edge of the process-target surface, and

a time period taken for the outer-edge process stage is longer than a time period taken for the center process stage.

9. The method as set forth in claim 1 , wherein:

the processing jig has a collection opening which is configured to be, in the step for carrying out the storage process, open into said space so as to collect the first processing liquid; and

in the step for carrying out the storage process, the processing jig is kept so as not to come in contact with the process-target surface.

10. The method as set forth in claim 1 , wherein:

the process-target object is a substrate which is bonded to a support;

the process-target surface is a surface of the substrate; and

the outer peripheral part is an exposed surface of the support.

11. The method as set forth in claim 1 , wherein:

the first processing liquid is a solvent for dissolving an adhesive applied onto the process-target surface, and dissolution residual, which is insoluble in the solvent, remains on the process-target surface in a case where the adhesive is dissolved in the solvent.

12. A method for processing a process-target object, the process-target object having a process-target surface and an outer peripheral part which is provided along an outer periphery of the process-target surface,

said method comprising the steps of:

carrying out a storage process by causing a processing jig, which has a supply opening for supplying a first processing liquid, to be positioned such that a space into which the supply opening is open is sandwiched by the processing jig and the process-target surface, and by storing the first processing liquid in said space; and

carrying out a rotation process by supplying the first processing liquid onto the process-target surface from the supply opening, while supplying a second processing liquid onto the outer peripheral part, in a state where the process-target object is being rotated, wherein:

in the step for carrying out the rotation process, the processing jig is moved along a direction which is not a direction along which the process-target object is being rotated;

the processing jig has a collection opening which is configured to be, in the step for carrying out the storage process, open into said space so as to collect the first processing liquid; and

in the step for carrying out the storage process, the processing jig is kept so as not to come in contact with the process-target surface.

13. The method as set forth in claim 12 , wherein:

a distance between the processing jig and the process-target surface in the step for carrying out the rotation process is greater than that in the step for carrying out the storage process.

14. The method as set forth in claim 12 , wherein:

in the step for carrying out the rotation process, the process-target object is being rotated at a rotating speed within a range from 100 min −1 or more and less than 1000 min −1 .

15. The method as set forth in claim 12 , wherein:

in the step for carrying out the rotation process, the first processing liquid is supplied from the supply opening at a flow rate greater than that in the step for carrying out the storage process.

16. The method as set forth in claim 12 , wherein:

in the step for carrying out the rotation process, the second processing liquid is supplied onto the outer peripheral part in such a manner that the second processing liquid is supplied to a substantial boundary between the process-target surface and the outer peripheral part.

17. The method as set forth in claim 12 , further comprising the step of, after the step for carrying out the rotation process:

carrying out a spray process by preparing a mixture of the first processing liquid and a gas and by spraying the mixture onto the process-target surface.

18. The method as set forth in claim 12 , further comprising the step of, after the step for carrying out the rotation process:

drying the process-target surface by supplying a gas onto the process-target surface.

19. The method as set forth in claim 12 , wherein:

the process-target object is a substrate which is bonded to a support;

the process-target surface is a surface of the substrate; and

the outer peripheral part is an exposed surface of the support.

20. The method as set forth in claim 12 , wherein:

the first processing liquid is a solvent for dissolving an adhesive applied onto the process-target surface, and dissolution residual, which is insoluble in the solvent, remains on the process-target surface in a case where the adhesive is dissolved in the solvent.

Assignments (3)
CHANGE OF NAME Recorded Apr 11, 2023
From: PROCESS EQUIPMENT BUSINESS SPIN-OFF PREPARATION CO., LTD.
To: AIMECHATEC, LTD.
Reel/Frame 063286/0683 →
CHANGE OF NAME Recorded Mar 28, 2023
From: TOKYO OHKA KOGYO CO., LTD.
To: PROCESS EQUIPMENT BUSINESS SPIN-OFF PREPARATION CO., LTD.
Reel/Frame 063186/0289 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 2, 2011
From: MIYANARI, ATSUSHI
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 026378/0488 →
Priority Claims (1)
JP 2010-128903 · Jun 4, 2010 · national
Continuity (1)
Related Publication 20110297190A1 · Dec 8, 2011