Wrap around stressor formation
For the formation of a stressor on one or more of a source and drain defined on a fin of FINFET semiconductor structure, a method can be employed including performing selective epitaxial growth (SEG) on one or more of the source and drain defined on the fin, separating the fin from a bulk silicon substrate at one or more of the source and drain, and further performing SEG on one or more of the source and drain to form a wrap around epitaxial growth stressor that stresses a channel connecting the source and drain. The formed stressor can be formed so that the epitaxial growth material defining a wrap around configuration connects to the bulk substrate. The formed stressor can increase mobility in a channel connecting the defined source and drain.
1. A method comprising:
performing selective epitaxial growth (SEG) on one or more of a source or drain defined on a fin extending from a bulk silicon substrate of a FINFET semiconductor device;
with the fin remaining connected to the bulk silicon substrate at an area of a channel connecting the source and drain, separating the fin from the bulk silicon substrate at one or more of the source or drain; and
further performing SEG on one or more of the source or drain to form a wrap around epitaxial growth stressor that stresses the channel connecting the source and drain.
2. The method of claim 1 , wherein the further performing SEG includes further performing the SEG so that the epitaxial growth stressor connects to the bulk silicon substrate.
3. The method of claim 1 , wherein the epitaxial growth stressor comprises Si.
4. The method of claim 1 , wherein the epitaxial growth stressor comprises one or more of SiGe and SiC.
5. The method of claim 1 , wherein the separating comprises using an anisotropic wet Si-etching method.
6. The method of claim 1 , wherein the performing includes terminating the performing after an epitaxial growth material surface of a diamond shape is defined on a fin.
7. The method of claim 1 , wherein the performing includes terminating the performing when selective epitaxial growth material reaches an epitaxial growth surface of a neighboring wrap around stressor.
8. The method of claim 1 , wherein the further performing SEG includes further performing SEG so that the epitaxial growth stressor merges with an epitaxial growth stressor at a neighboring fin.
9. The method of claim 1 , wherein the separating includes etching for removal of oxide of an oxide layer over the bulk silicon substrate and etching for removal of material defining the fin.
10. The method of claim 1 , wherein the method includes doping the wrap around epitaxial growth stressor so that the wrap around epitaxial growth stressor induces compressive stress in the channel.
11. The method of claim 1 , wherein the method includes doping the wrap around epitaxial growth stressor so that the wrap around epitaxial growth stressor induces tensile stress in the channel.
12. The method of claim 1 , wherein the performing includes terminating the performing after an epitaxial growth material surface of a diamond shape is defined on a fin, wherein the separating includes etching for removal of oxide of an oxide layer over the bulk silicon substrate and etching for removal of material defining the fin, and wherein the further performing SEG includes further performing the SEG so that the epitaxial growth stressor connects to the bulk silicon substrate.
13. A semiconductor device comprising:
a bulk silicon substrate;
an oxide layer;
a fin extending from the bulk silicon substrate, the fin defining a source and drain, and a channel connecting the source and drain; and
a wrap around stressor comprising epitaxial growth material formed at an area of the fin defining one or more of the source or drain, the wrap around stressor wrapping 360 degrees around the area of the fin defining one or more of the source or drain.
14. The semiconductor device of claim 13 , wherein the wrap around stressor connects to the bulk silicon substrate.
15. The semiconductor device of claim 13 , wherein the wrap around stressor merges with a wrap around stressor of a neighboring fin.
16. The semiconductor device of claim 13 , wherein the wrap around stressor induces compressive stress in the channel.
17. The semiconductor device of claim 13 , wherein the wrap around stressor induces tensile stress in the channel.
18. The semiconductor device of claim 13 , wherein semiconductor device includes means for inducing compressive stress in the channel.
19. The semiconductor device of claim 13 , wherein semiconductor device includes means tensile stress in the channel.
20. The semiconductor device of claim 13 , wherein the one or more of a source and drain includes a top bottom and sides and wherein the wrap around stressor wraps around the top, bottom and sides of the one or more of the source and drain.