Stacked carbon-based FETs
Methods and systems for forming stacked transistors. Such methods include forming a lower channel layer on a substrate; forming a pair of vertically aligned gate regions over the lower channel layer; forming a pair of vertically aligned source regions and a pair of vertically aligned drain regions on the lower channel material, each pair separated by an insulator; forming an upper channel material over the source regions, drain regions, and gate regions; and providing electrical access to the source, drain, and gate regions.
1. A method for forming stacked transistors, comprising:
forming a lower channel layer on a substrate;
forming a pair of vertically aligned gate regions over the lower channel layer;
forming a pair of vertically aligned source regions and a pair of vertically aligned drain regions on the lower channel material, each pair separated by an insulator;
forming an upper gate dielectric over the source regions, drain regions, and gate regions;
forming an upper channel material over the upper gate dielectric; and
providing electrical access to the source, drain, and gate regions.
2. The method of claim 1 , wherein the upper and lower channel layers are carbon-based.
3. The method of claim 1 , wherein the upper channel layer is carbon-based and the lower channel material is silicon based.
4. The method of claim 1 , further comprising forming a lower gate dielectric layer on the lower channel layer.
5. The method of claim 1 , wherein the step of forming a pair of vertically aligned gate regions comprises:
forming a lower gate material on a lower gate dielectric layer; and
forming an upper gate material on the lower gate material, wherein the upper gate material has a different work function than the lower gate material.
6. The method of claim 5 , wherein the step of forming a pair of vertically aligned gate regions comprises:
forming a capping layer on the lower gate material;
etching the lower gate material and the capping layer to expose the lower gate dielectric layer outside of the gate regions to form a gate stack;
forming spacers on sidewalls of the gate stack; and
removing the remaining capping layer.
7. The method of claim 1 , wherein the steps of forming a pair of vertically aligned source and drain regions comprises:
forming lower source and drain extensions in the substrate before forming the lower channel layer;
forming lower source and drain regions on the channel layer in electrical contact with the respective lower source and drain extensions;
forming source and drain insulators on the respective lower source and drain regions; and
forming upper source and drain regions on the respective source and drain insulators.
8. The method of claim 1 , further comprising forming an electrical connection between at least two of the upper and lower source and drain regions.
9. The method of claim 8 , wherein the electrical connection forms the stacked transistors into a device selected from the group consisting of a NAND gate, an XOR gate, a static random access memory cell, and a multiplexer.
10. A method for forming stacked transistors, comprising:
forming a lower carbon-based channel layer on a substrate;
forming a lower gate dielectric layer on the lower channel layer;
forming a pair of vertically aligned gate regions on the lower gate dielectric layer;
forming a pair of vertically aligned source regions and a pair of vertically aligned drain regions on the lower channel material, each pair separated by an insulator;
forming an upper gate dielectric over the source regions, drain regions, and gate regions;
forming an upper carbon-based channel material on the upper gate dielectric; and
providing electrical access to the source, drain, and gate regions, including forming an electrical connection between at least two of the upper and lower source and drain regions.
11. The method of claim 10 , wherein the steps of forming a pair of vertically aligned source and drain regions comprises:
forming lower source and drain extensions in the substrate before forming the lower channel layer;
forming lower source and drain regions on the channel layer in electrical contact with the respective lower source and drain extensions;
forming source and drain insulators on the respective lower source and drain regions; and
forming upper source and drain regions on the respective source and drain insulators.
12. The method of claim 10 , further comprising forming an electrical connection between at least two of the upper and lower source and drain regions to form the stacked transistors into a device selected from the group consisting of a NAND gate, an XOR gate, a static random access memory cell, and a multiplexer.
13. A method for forming stacked transistors, comprising:
forming a lower channel layer on a substrate;
forming a pair of vertically aligned gate regions over the lower channel layer, comprising:
forming a lower gate material on a lower gate dielectric layer;
forming a capping layer on the lower gate material;
etching the lower gate material and the capping layer to expose the lower gate dielectric layer outside of the gate regions to form a gate stack;
forming spacers on sidewalls of the gate stack;
removing the remaining capping layer; and
forming an upper gate material on the lower gate material, wherein the upper gate material has a different work function than the lower gate material;
forming a pair of vertically aligned source regions and a pair of vertically aligned drain regions on the lower channel material, each pair separated by an insulator;
forming an upper channel material over the source regions, drain regions, and gate regions; and
providing electrical access to the source, drain, and gate regions.
14. The method of claim 13 , wherein the upper and lower channel layers are carbon-based.
15. The method of claim 13 , wherein the steps of forming a pair of vertically aligned source and drain regions comprises:
forming lower source and drain extensions in the substrate before forming the lower channel layer;
forming lower source and drain regions on the channel layer in electrical contact with the respective lower source and drain extensions;
forming source and drain insulators on the respective lower source and drain regions; and
forming upper source and drain regions on the respective source and drain insulators.
16. The method of claim 13 , further comprising forming an electrical connection between at least two of the upper and lower source and drain regions to form the stacked transistors into a device selected from the group consisting of a NAND gate, an XOR gate, a static random access memory cell, and a multiplexer.
17. A method for forming stacked transistors, comprising:
forming a lower channel layer on a substrate;
forming a pair of vertically aligned gate regions over the lower channel layer;
forming a pair of vertically aligned source regions and a pair of vertically aligned drain regions on the lower channel material, each pair separated by an insulator, comprising:
forming lower source and drain extensions in the substrate before forming the lower channel layer;
forming lower source and drain regions on the channel layer in electrical contact with the respective lower source and drain extensions;
forming source and drain insulators on the respective lower source and drain regions; and
forming upper source and drain regions on the respective source and drain insulators;
forming an upper channel material over the source regions, drain regions, and gate regions; and
providing electrical access to the source, drain, and gate regions.
18. The method of claim 17 , wherein the upper and lower channel layers are carbon-based.
19. The method of claim 17 , wherein the step of forming a pair of vertically aligned gate regions comprises:
forming a lower gate material on a lower gate dielectric layer;
forming a capping layer on the lower gate material;
etching the lower gate material and the capping layer to expose the lower gate dielectric layer outside of the gate regions to form a gate stack;
forming spacers on sidewalls of the gate stack; and
removing the remaining capping layer; and
forming an upper gate material on the lower gate material, wherein the upper gate material has a different work function than the lower gate material.
20. The method of claim 17 , further comprising forming an electrical connection between at least two of the upper and lower source and drain regions to form the stacked transistors into a device selected from the group consisting of a NAND gate, an XOR gate, a static random access memory cell, and a multiplexer.