Integrated circuit packaging system with perimeter antiwarpage structure and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system comprising: providing a package carrier; mounting an integrated circuit to the package carrier; and forming a perimeter antiwarpage structure on and along a perimeter of the package carrier.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a package carrier;
mounting an integrated circuit to one side of the package carrier with an integrated circuit electrical connector;
forming a perimeter antiwarpage structure on another side of the package carrier opposite from the integrated circuit and along a perimeter of the package carrier, the perimeter antiwarpage structure external to the package carrier; and
forming an external connector on the side of the package carrier opposite from the integrated circuit and within a border of the perimeter antiwarpage structure, the external connector electrically connected to the integrated circuit electrical connectors on the opposite side of the package carrier from the integrated circuit, and the external connector extending below a bottom of a surface of the perimeter antiwarpage structure.
2. The method as claimed in claim 1 wherein forming the perimeter antiwarpage structure on the package carrier includes forming the perimeter antiwarpage structure on two opposing sides along the perimeter of the package carrier.
3. The method as claimed in claim 1 wherein forming the perimeter antiwarpage structure on the package carrier includes forming the perimeter antiwarpage structure along the perimeter of the package carrier and not in the corners.
4. The method as claimed in claim 1 wherein forming the perimeter antiwarpage structure on the package carrier includes forming the perimeter antiwarpage structure at a corner of the package carrier.
5. The method as claimed in claim 1 wherein forming the perimeter antiwarpage structure includes forming the perimeter antiwarpage structure with a side support at a perimeter on both sides of the package carrier.
6. A method of manufacture of an integrated circuit packaging system comprising:
providing a package carrier;
mounting an integrated circuit to one side of the package carrier with an integrated circuit electrical connector;
forming a perimeter antiwarpage structure on another side of the package carrier opposite from the integrated circuit and along a perimeter of the package carrier, the perimeter antiwarpage structure external to the package carrier;
forming an external connector on the side of the package carrier opposite from the integrated circuit and within a border of the perimeter antiwarpage structure, the external connector electrically connected to the integrated circuit electrical connectors on the opposite side of the package carrier from the integrated circuit, and the external connector extending below a bottom of a surface of the perimeter antiwarpage structure; and
mounting a mounting integrated circuit packaging system above the integrated circuit packaging system.
7. The method as claimed in claim 6 wherein forming the perimeter antiwarpage structure on the package carrier includes forming a center cross support on the package carrier.
8. The method as claimed in claim 6 wherein forming the perimeter antiwarpage structure on the package carrier includes forming the perimeter antiwarpage structure around the entire perimeter of the package carrier and not in the corners.
9. The method as claimed in claim 6 wherein forming the perimeter antiwarpage structure on the package carrier includes forming the perimeter antiwarpage structure at a corner of the package carrier.
10. The method as claimed in claim 6 further comprising forming the perimeter antiwarpage structure on the package carrier includes forming the perimeter antiwarpage structure at a perimeter on both sides of the package carrier.