Memory device interface methods, apparatus, and systems
Apparatus and systems for memory system are provided. In an example, an interface chip can include a memory controller configured to couple to a processor and to couple to a plurality of stacked memory arrays using a data bus and a maintenance bus, wherein the data bus is separate from the maintenance bus, the plurality of stacked memory arrays forming two or more memory chips, the memory controller configured to control access to memory locations within the plurality of stacked memory arrays.
1. An interface chip comprising:
a memory controller configured to couple to a processor and to couple to a plurality of stacked memory arrays using a data bus and a maintenance bus, wherein the data bus is separate from the maintenance bus, the plurality of stacked memory arrays forming two or more memory chips, the memory controller configured to control access to memory locations within the plurality of stacked memory arrays.
2. The interface chip of claim 1 , including a multiplexer/de-multiplexer coupled to the memory controller and configured to multiplex and de-multiplex data exchanged between the memory controller and the processor.
3. The interface chip of claim 1 , wherein the memory controller includes a dynamic random access memory (DRAM) controller.
4. The interface chip of claim 1 , wherein the plurality of stacked memory arrays include a plurality of stacked dynamic random access memory (DRAM) arrays and the memory controller is configured to translate memory commands and data into control signals for the plurality of stacked DRAM arrays.
5. The interface chip of claim 1 , including input/output (I/O) pads configured to electrically couple the interface chip to an external device.
6. The interface chip of claim 1 , including delayed-locked loop (DLL) circuitry, wherein the memory controller is configured to control access to memory locations within the plurality of stacked memory arrays using the DLL circuitry.
7. The interface chip of claim 1 , including first-in, first-out circuitry configured to provide read and write pointers associated with controlled access to memory locations within the plurality of stacked memory arrays.
8. A memory system comprising:
a memory die stack including:
a first memory die and a second memory die, at least one of the first memory die or the second memory die including a plurality of vias; and
a plurality of through wafer interconnects (TWIs) extending through the plurality of vias; and
an interface chip including a memory controller coupled to the plurality of TWIs, the memory controller configured to control access to memory locations within memory die stack.
9. The memory system of claim 8 , wherein the memory die stack includes a plurality of dynamic random access memory (DRAM) arrays.
10. The memory system of claim 8 , wherein the memory die stack includes a plurality of FLASH memory arrays.
11. The memory system of claim 8 , wherein the memory die stack includes a first stack of dynamic random access memory (DRAM) arrays and a second stack of FLASH memory arrays; and
wherein the memory controller includes:
a DRAM controller configured to control access to memory locations within the first stack of DRAM arrays; and
a FLASH controller configured to control access to memory locations within the second stack of FLASH memory arrays.
12. The memory system of claim 8 , wherein the interface chip includes a multiplexer/de-multiplexer circuit configured to interconnect data between the memory controller and an external device coupled to the interface chip.
13. The memory system of claim 12 , wherein the interface chip includes I/O pads configured to electrically couple the multiplexer/de-multiplexer circuit to the external device.
14. The memory system of claim 8 , wherein the interface chip includes delayed-locked loop (DLL) circuitry, wherein the memory controller is configured to control access to memory locations within the memory die stack using the DLL circuitry.
15. The memory system of claim 8 , wherein the interface chip includes first-in, first-out circuitry to provide read and write pointers associated with memory locations of the memory die stack, wherein the memory controller is configured to control access to the memory locations of the memory die stack using the read and write pointers.
16. The memory system of claim 8 , wherein the interface chip includes a pattern generator configured to provide test pattern signals to the memory die stack; and
wherein the interface chip is configured to calculate timing parameters for each TWI of the plurality of TWIs.
17. A system comprising:
a processor;
a plurality of memory banks, wherein one or more memory banks of the plurality of memory banks includes a plurality of dynamic random access memory (DRAM) arrays, and wherein each memory bank includes a plurality of independent interconnects; and
an interface chip configured to interconnect the plurality of memory banks with the processor, the interface chip including a DRAM controller coupled to at least a portion of the plurality of independent interconnects, the DRAM controller configured to control access to memory locations within the plurality of memory banks.
18. The system of claim 17 , wherein the plurality of memory banks do not include circuitry configured to generate read and write pointers associated with controlled access to memory locations within the plurality of memory banks.
19. The system of claim 17 , wherein the interface chip includes:
a sequencer configured to translate memory commands and data into memory bank control signals; and
a Built in Self-Test (BIST) module configured to forward diagnostic memory commands and data to the sequencer and to generate diagnostic test patterns in accordance with the diagnostic memory commands and data.
20. The system of claim 17 , including a substrate;
wherein at least one of the plurality of memory banks is coupled directly to the substrate, and
wherein the interface chip is embedded within the substrate.