IP Library Granted Patent US 9,009,398
Granted Patent B2
US 9,009,398 · App. 14/281,432 · Granted Apr 14, 2015

Write operations for defect management in nonvolatile memory

Inventors: Chris Avila (Saratoga, CA); Gautam Dusija (Milpitas, CA); Jian Chen (Menlo Park, CA); Mrinal Kochar (San Jose, CA); Abhijeet Manohar (Karnataka, IN)
Assignee: SanDisk Technologies Inc.
G06F11/1072G11C29/52
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,009,398
App. No.
14/281,432
Granted
Apr 14, 2015
Kind
B2
Abstract

Data that is stored in a higher error rate format in a nonvolatile memory is backed up in a lower error rate format. Data to be stored may be transferred once to on-chip data latches where it is maintained while it is programmed in both the high error rate format and the low error rate format without being resent to the nonvolatile memory.

Claims (47)

1. A method of operating a three dimensional nonvolatile memory formed in two or more physical levels of memory cells disposed above a substrate, comprising:

receiving a portion of data to be stored in the three dimensional nonvolatile memory;

buffering the portion of data in on-chip data latches formed on the substrate;

writing the portion of data from the on-chip data latches as Single Level Cell (SLC) data in a first block in the three dimensional nonvolatile memory while asserting a busy indicator throughout the writing;

subsequently, writing the portion of data from the on-chip data latches as Multi Level Cell (MLC) data in a second block in the three dimensional nonvolatile memory;

suspending the writing of the portion of data as MLC data in the second block;

performing a post write read of a previously programmed MLC block during the suspending;

subsequent to the suspending, resuming the writing of the portion of data as MLC data in the second block;

in parallel with the resumed writing of the portion of data as MLC data in the second block, transferring post write read data from the previously programmed MLC block;

maintaining the portion of data in the on-chip data latches throughout a time that extends from the writing of the portion of data as SLC data in the first block to the writing of the portion of data as MLC data in the second block; and

subsequently erasing the first block only after a post write read confirms that the second block contains data that passes a predetermined standard.

2. The method of claim 1 wherein the post write read is performed only after the second block is full.

3. The method of claim 1 wherein the previously programmed MLC block is a block that shares block select circuits with another previously programmed MLC block and the post write read of data from the previously programmed MLC block is only performed after both the previously programmed MLC block and the other previously programmed MLC block are full.

4. The method of claim 1 wherein the post write read samples data of the previously programmed block so that every word line of a sample string is read and one word line of each string is read.

5. The method of claim 1 further comprising asserting a busy signal throughout an earlier part of the writing the portion of data as MLC data in the second block and asserting a ready signal throughout a later part of the writing the portion of data as MLC data in the second block.

6. A three dimensional nonvolatile memory formed in two or more physical levels of memory cells disposed above a substrate, comprising:

a first plurality of Single Level Cell (SLC) blocks that store data in SLC format;

a second plurality of Multi Level Cell (MLC) blocks that store data in MLC format;

on-chip data latches on the substrate that receive data to be stored in the three dimensional nonvolatile memory;

a write circuit,that is configured to write data from the on-chip data latches to an SLC block of the first plurality of blocks to subsequently write the data from the on-chip data latches to an MLC block of the second plurality of blocks to suspend writing the data from the on-chip data latches to the MLC block prior to completion and to subsequently to resume writing the data from the on-chip data latches to the MLC block;

read circuits in communication with the determination circuits, the read circuits configured to perform a post write read of data from a fully programmed MLC block of the second plurality of MLC blocks while the writing is suspended;

a bus that transfers the post write read data from the fully programmed block in parallel with the resumed writing of the data from the on-chip data latches to the MLC block;

a ready/busy signal circuit that is configured to maintain a busy signal throughout writing from the on-chip data latches to the SLC block;

a determination circuit configured to determine whether programmed data in MLC blocks of the second plurality of MLC blocks meets a standard; and

a reclaim circuit that is configured to erase SLC blocks of the first plurality of SLC blocks in response to the determination circuit determining that a corresponding MLC block of the second plurality of MLC blocks meets the standard.

7. The three dimensional nonvolatile memory of claim 6 wherein the determination circuit is configured to determine whether programmed data in only MLC blocks that are filled with MLC data meet the standard.

8. The three dimensional nonvolatile memory of claim 6 wherein MLC blocks of the second plurality of MLC blocks are arranged in pairs of MLC blocks that share block select circuits and wherein the determination circuit is configured to determine whether programmed data in a pair of fully programmed MLC blocks meets the standard.

9. The three dimensional nonvolatile memory of claim 6 wherein the ready/busy signal circuit is further configured to assert a busy signal throughout an earlier part of the writing the data from the on-chip data latches to the MLC block and to assert a ready signal throughout a later part of the writing the data from the on-chip data latches to the MLC block.

10. The three dimensional nonvolatile memory of claim 6 wherein the read circuits are configured to perform the post write read of data from the fully programmed block by sampling data of the fully programmed block so that every word line of a sample string is read and one word line of each string is read.

11. A method of operating a three dimensional nonvolatile memory formed in two or more physical levels of memory cells disposed above a substrate, comprising:

receiving a portion of data to be stored in the three dimensional nonvolatile memory;

buffering the portion of data in on-chip data latches formed on the substrate;

writing the portion of data from the on-chip data latches as Single Level Cell (SLC) data in a first block in the three dimensional nonvolatile memory while asserting a busy indicator throughout the writing;

subsequently, writing the portion of data from the on-chip data latches as Multi Level Cell (MLC) data in a second block in the three dimensional nonvolatile memory;

maintaining the portion of data in the on-chip data latches throughout a time that extends from the writing of the portion of data as SLC data in the first block to the writing of the portion of data as MLC data in the second block;

interleaving a post write read of a previously programmed MLC block with the writing of the portion of data as MLC data in the second block;

in parallel with the writing of the portion of data as MLC data in the second block, transferring post write read data from the previously programmed MLC block; and

subsequently erasing the first block only after a post write read of the second block confirms that the second block contains data that passes a predetermined standard.

12. A three dimensional nonvolatile memory formed in two or more physical levels of memory cells disposed above a substrate, comprising:

a first plurality of Single Level Cell (SLC) blocks that store data in SLC format;

a second plurality of Multi Level Cell (MLC) blocks that store data in MLC format;

on-chip data latches on the substrate that receive data to be stored in the three dimensional nonvolatile memory;

a write circuit that is configured to write data from the on-chip data latches to an SLC block of the first plurality of blocks and to subsequently write the data from the on-chip data latches to an MLC block of the second plurality of blocks either continuously or with writing suspended and subsequently resumed;

read circuits that are configured to perform a post write read of data from a fully programmed MLC block of the second plurality of MLC blocks while the write circuit suspends writing and subsequently transfer the read data in parallel with resumed writing;

a ready/busy signal circuit that is configured to maintain a busy signal throughout writing from the on-chip data latches to the SLC block;

a determination circuit in communication with the read circuits, the determination circuit configured to determine whether programmed data in MLC blocks of the second plurality of MLC blocks meets a standard; and

a reclaim circuit that is configured to erase SLC blocks of the first plurality of SLC blocks in response to the determination circuit determining that a corresponding fully programmed MLC block of the second plurality of MLC blocks meets the standard.

Assignments (4)
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
CHANGE OF NAME Recorded May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038807/0948 →
Continuity (2)
Continuation 13934013 · Jul 2, 2013
Related Publication 20150012802A1 · Jan 8, 2015