Semiconductor device bonded by anisotropic conductive film
A semiconductor device including a first connecting member including a first electrode; a second connecting member including a second electrode; and an anisotropic conductive film between the first connecting member and the second connecting member, the anisotropic conductive film bonding the first electrode to the second electrode, wherein the anisotropic conductive film exhibits linear indentations in an inter-terminal space of the second connecting member after pre-compression and primary compression of the anisotropic conductive film onto the first and second connecting members.
1. A semiconductor device, comprising:
a first connecting member including a first electrode;
a second connecting member including a second electrode; and
an anisotropic conductive film between the first connecting member and the second connecting member, the anisotropic conductive film bonding the first electrode to the second electrode,
wherein the anisotropic conductive film exhibits linear indentations in an inter-terminal space of the second connecting member after pre-compression and primary compression of the anisotropic conductive film onto the first and second connecting members,
wherein the linear indentations are in an area occupying about 30% or less of an overall area of the inter-terminal space while sharing a centerline of the inter-terminal space, and
wherein the anisotropic conductive film includes:
about 10 wt % to about 70 wt % of an acrylic copolymer resin;
about 1 wt % to about 50 wt % of a polyurethane resin;
about 1 wt % to about 40 wt % of a radical polymerizable material; and
about 1 wt % to about 30 wt % of conductive particles, all wt % being based on a total weight of the anisotropic conductive film in terms of solid content.
2. The semiconductor device as claimed in claim 1 , wherein the first connecting member has a film shape and the second connecting member has a substrate shape.
3. The semiconductor device as claimed in claim 1 , wherein:
the pre-compression is performed at a temperature of about 50° C. to about 70° C. under a load of about 1.0 MPa to about 5.0 MPa for about 1 to about 5 seconds, and
the primary compression is performed at a temperature of about 110° C. to about 150° C. under a load of about 1.0 MPa to about 4.0 MPa for about 1 to about 7 seconds.
4. The semiconductor device as claimed in claim 3 , wherein the anisotropic conductive film has an adhesive strength of about 800 gf/cm or more as measured after the pre-compression and the primary compression.
5. The semiconductor device as claimed in claim 1 , wherein the acrylic copolymer resin includes repeating units derived from a hydroxyl group-substituted alkyl (meth)acrylate monomer.
6. The semiconductor device as claimed in claim 5 , wherein the hydroxyl group-substituted alkyl (meth)acrylate monomer is hydroxyethyl (meth)acrylate.
7. The semiconductor device as claimed in claim 5 , wherein the repeating units derived from the hydroxyl group-substituted alkyl (meth)acrylate monomer are present in an amount of about 10 wt % to about 50 wt %, based on a total weight of the acrylic copolymer resin.
8. The semiconductor device as claimed in claim 1 , wherein the acrylic copolymer resin is prepared by copolymerization of a hydroxyl group-substituted alkyl (meth)acrylate monomer and at least one of an aliphatic alkyl(meth)acrylate monomer or an alicyclic alkyl(meth)acrylate monomer.
9. The semiconductor device as claimed in claim 1 , wherein the acrylic copolymer resin includes repeating units derived from cyclohexyl (meth)acrylate, methyl (meth)acrylate, and hydroxyethyl (meth)acrylate monomers.
10. The semiconductor device as claimed in claim 1 , wherein the acrylic copolymer resin has a glass transition temperature of about 70° C. or higher.
11. The semiconductor device as claimed in claim 1 , wherein the anisotropic conductive film has an adhesive strength of about 1,000 gf/cm or greater.
12. The semiconductor device as claimed in claim 1 , wherein the anisotropic conductive film has an adhesive strength of 1130 gf/cm to 1280 gf/cm.