finFET isolation by selective cyclic etch
Etching interleaved structures of semiconductor material forming fins of finFETs and local isolation material interposed between the fins is performed alternately and cyclically by alternating etchants cyclically such as by alternating gases during reactive ion etching. Etchants are preferably alternated when one of the semiconductor material and the local isolation material protrudes above the other by a predetermined distance. Since protruding surfaces are etched more rapidly than recessed surfaces, the overall etching process is accelerated and completed in less time such that erosion of other materials to which the etchants are less than optimally selective is reduced and allow improved etching of trenches for improved isolation structures to be formed.
1. A method for forming a trench for an isolation structure from a structure including excess fins formed from a layer of semiconductor material with local isolation material deposited between said fins, said method comprising steps of
depositing hard mask material over a portion of said local isolation material and selected ones of said fins,
patterning said hard mask material, and
cyclically etching said excess fins selectively to said hard mask material and said local isolation material alternately with etching said local isolation material selectively to said excess fins and said hard mask material in respective etching cycles of a plurality of etching cycles to form a trench between said selected ones of said fins while limiting height of protrusion of portions of said excess fins above portions of said local isolation material and limiting height of protrusion of portions of said local isolation material above said portions of said excess fins.
2. The method as recited in claim 1 , further including a step of
etching said semiconductor material beyond a base of a said fin in accordance with said hard mask.
3. The method as recited in claim 2 , wherein said step of etching said semiconductor material in accordance with said hard mask provides a substantially planar surface of a bottom of said trench.
4. The method as recited in claim 3 , wherein respective cycles of said cyclic etching are begun and terminated when one of said fins and said local isolation material protrudes above the other of said fins and said local isolation material by a predetermined distance.
5. The method as recited in claim 1 , wherein respective cycles of said cyclic etching are begun and terminated when one of said fins and said local isolation material protrudes above the other of said fins and said local isolation material by a predetermined distance.
6. The method as recited in claim 1 , further comprising a step of
depositing isolation material in said trench.
7. The method as recited in claim 6 , further including a step of
etching said semiconductor material in accordance with said hard mask.
8. The method as recited in claim 7 , wherein said step of etching said semiconductor material in accordance with said hard mask provides a substantially planar surface of a bottom of said trench.
9. The method as recited in claim 8 , wherein respective cycles of said cyclic etching are begun and terminated when one of said fins and said local isolation material protrudes above the other of said fins and said local isolation material by a predetermined distance.
10. The method as recited in claim 1 , wherein said fins are formed by a sidewall image transfer technique.
11. The method as recited in claim 1 , wherein said fins are formed by a split pitch lithography technique.