High density server storage unit
A rack mountable 1U storage unit includes a plurality of memory modules arranged in two groups. The storage unit also has control circuitry. The memory modules have a dedicated exhaust channel to draw heat away from the memory modules. The exhaust channel for the memory modules is disposed over and is physically separated from the exhaust channel for the control circuitry. The storage unit can accommodate up to 42 memory modules due to a unique method of placing the individual memory modules.
1. A storage unit comprising:
an enclosure having a front face, a back face opposing the front face, and two side faces, wherein the enclosure has dimensions of 19 inches wide, 1.75 inches height, and between 17.7 and 21.5 inches depth;
a first section within the enclosure including a first plurality of memory modules;
a second section within the enclosure including a second plurality of memory modules, wherein the first and the second sections abut the back face;
a third section including control circuitry, the third section abutting the front face;
a panel overlying the third section;
a plurality of fans attached to the back face and operable to direct air flow towards the front face;
a first plurality of openings disposed in an upper section of the front face;
a second plurality of opening disposed directly below the first plurality of openings;
a first exhaust channel, the first exhaust channel thermally coupled to the first and the second plurality of memory modules and extending towards the front face over the panel and ending at the first plurality of openings, wherein the first exhaust channel is configured to direct flow of hot air from the first plurality of memory modules to the front face without allowing the hot air to interact with the control circuitry; and
a second exhaust channel thermally coupled to the third section and extending towards the front face underneath the panel and ending at the second plurality of openings.
2. The storage unit of claim 1 wherein each of the first and the second plurality of memory modules includes 21 memory modules.
3. The storage unit of claim 1 wherein each of the memory modules comprises:
a printed circuit board (PCB) including one or more memory devices; and
a stiffener member attached to the PCB, wherein a width of the stiffener member is between 5 mm and 6 mm.
4. The storage unit of claim 3 wherein the one or more memory devices include a multi-level cell (MLC) non-volatile memory devices.
5. The storage unit of claim 1 wherein the second exhaust channel is disposed below the first exhaust channel.
6. The storage unit of claim 1 wherein the first exhaust channel includes the panel that provides a physical barrier between the first exhaust channel and the third section.
7. A storage unit comprising:
a first plurality of memory modules disposed side-by-side to each other; and
a second plurality of memory modules disposed side-by-side to each other,
wherein each of the first and second plurality of memory modules includes 21 memory modules and wherein each memory module further comprises:
a memory board including a plurality of memory devices; and
a stiffener attached to the memory board,
wherein the stiffener has a width of between 5 mm and 6 mm and a pitch between two immediately adjacent stiffeners is between 5.5 mm and 6.5 mm.
8. The storage unit of claim 7 further comprising an enclosure that conforms with 1U specification for a rack mountable unit.
9. The storage unit of claim 7 wherein the memory module includes a pair of anchor points for connection with the stiffener.
10. The storage unit of claim 7 further comprising a first exhaust channel configured to exhaust hot air from the first plurality of memory modules and the second plurality of memory modules.
11. The storage unit of claim 10 further comprising:
control circuitry; and
a second exhaust channel configured to exhaust hot air from the control circuitry, wherein the second exhaust channel is disposed directly below the first exhaust channel.
12. The storage unit of claim 11 comprising a solid panel separating the first and the second exhaust channels.
13. A method for manufacturing a high-density solid-state storage unit, the method comprising:
configuring a first section of an enclosure having a front face, a back face opposing the front face, and two side faces to house a first plurality of memory modules;
configuring a second section of the enclosure to house a second plurality of memory modules, wherein the first and the second sections are configured to abut the back face and wherein a third section including control circuitry is configured to abut the front face;
configuring a panel to overly the third section;
configuring the back face to receive a plurality of fans such that the plurality of fans direct air flow towards the front face;
configuring a first plurality of openings in an upper section of the front face to receive a first exhaust channel, the first exhaust channel thermally coupled to the first and the second plurality of memory modules and extending towards the front face over the panel and ending at the first plurality of openings, wherein the first exhaust channel is configured to direct flow of hot air from the first plurality of memory modules to the front face without allowing the hot air to interact with the control circuitry;
configuring a second plurality of opening disposed directly below the first plurality of openings to receive a second exhaust channel thermally coupled to the third section and extending towards the front face underneath the panel and ending at the second plurality of openings.
14. The method of claim 13 wherein configuring each of the first and the second sections of the enclosure comprises configuring each to accept at least 21 memory modules.
15. The method of claim 13 further comprising configuring a stiffener member to attach to a printed circuit board (PCB) of at least one of the first and second plurality of memory modules, wherein a width of the stiffener member is between 5 mm and 6 mm.
16. The method of claim 13 wherein one or more of the first and second plurality of memory modules includes one or more multi-level cell (MLC) non-volatile memory devices.
17. The method of claim 13 further comprising configuring the second exhaust channel to be disposed below the first exhaust channel.
18. The method of claim 13 further comprising configuring the first exhaust channel to include the panel as a physical barrier between the first exhaust channel and the third section.