IP Library Granted Patent US 9,337,074
Granted Patent B2
US 9,337,074 · App. 14/431,902 · Granted May 10, 2016

Attaching device and attaching method

Inventors: Yoshihiro Inao (Kawasaki, JP); Shigeru Kato (Kawasaki, JP); Shugo Tsushima (Kawasaki, JP); Junichi Katsuragawa (Kawasaki, JP); Satoshi Kobari (Kawasaki, JP); Akihiko Nakamura (Kawasaki, JP)
Assignee: TOKYO OHKA KOGYO CO., LTD.
H01L21/6835H01L21/67092B25J11/0095B25J15/0042H01L21/687H01L21/68721H01L2221/68304H01L2221/68327H01L2221/68381Y10T156/10Y10T156/17
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Quick Facts
Patent No.
US 9,337,074
App. No.
14/431,902
Granted
May 10, 2016
Kind
B2
Abstract

An attaching device configured to attach a substrate and a support via an adhesive layer is provided with support holding members. Holding tools of the support holding members are configured to hold the support with oblique surface parts (contact members) of the holding tools without coming into contact with a surface of the support, which is to be attached to the substrate. The attaching device attaches, to the substrate, the support of which the surface is held not to be contacted.

Claims (22)

1. An attaching device configured to attach a substrate and a support configured to support the substrate via an adhesive layer, the attaching device comprising:

a stage configured to have the substrate placed thereon;

a support holder configured to hold the support without coming into contact with a surface of the support that is to be attached to the substrate via the adhesive layer;

a horizontal adjuster configured to horizontally align the surface of the support to be attached to the substrate with the substrate;

a lift configured to vertically move the support holder so as to bring the support toward or away from the substrate; and

a reversal mechanism configured to reverse upper and lower surfaces of the support.

2. The attaching device according to claim 1 , wherein the support holder is configured to hold an end portion of the support upon carrying-in of the support.

3. The attaching device according to claim 1 , wherein the reversal mechanism is configured to reverse the support after positioning of the support is performed.

4. The attaching device according to claim 1 , wherein the support holder doubles as the reversal mechanism.

5. The attaching device according to claim 2 , wherein the support holder has a holding tool having an oblique surface part, the holding tool being configured to hold the support with the oblique surface part without coming into contact with at least the surface of the support.

6. The attaching device according to claim 2 , wherein the support holder has a hoe-shaped holding tool having an oblique surface part and an inverted oblique surface part arranged at a perpendicular upper part to the oblique surface part.

7. A method of attaching a substrate and a support configured to support the substrate via an adhesive layer, the method comprising:

placing the substrate on a stage;

holding the support without coming into contact with a surface of the support that is to be attached to the substrate via the adhesive layer using a support holder;

horizontally aligning the surface of the support to be attached to the substrate with the substrate using a horizontal adjuster;

vertically moving the support holder so as to bring the support toward or away from the substrate using a lift; and

reversing upper and lower surfaces of the support using a reversal mechanism.

8. The method according to claim 7 , further comprising positioning the support.

9. The method according to claim 7 , further comprising holding an end portion of the support upon carrying-in of the support, before holding the support.

10. The method according to claim 7 , further comprising positioning the support, wherein the reversing is performed after the support positioning.

11. The method according to claim 7 , further comprising positioning the substrate.

12. The method according to claim 11 , further comprising holding an end portion of the support upon carrying-in of the support, before holding the support, wherein the substrate positioning is performed before the support carrying-in.

Assignments (3)
CHANGE OF NAME Recorded Apr 11, 2023
From: PROCESS EQUIPMENT BUSINESS SPIN-OFF PREPARATION CO., LTD.
To: AIMECHATEC, LTD.
Reel/Frame 063286/0683 →
CHANGE OF NAME Recorded Mar 28, 2023
From: TOKYO OHKA KOGYO CO., LTD.
To: PROCESS EQUIPMENT BUSINESS SPIN-OFF PREPARATION CO., LTD.
Reel/Frame 063186/0289 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2015
From: INAO, YOSHIHIRO; KATO, SHIGERU; TSUSHIMA, SHUGO; KATSURAGAWA, JUNICHI; KOBARI, SATOSHI; NAKAMURA, AKIHIKO
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 035284/0856 →
Priority Claims (2)
JP 2012-218720 · Sep 28, 2012 · national
JP 2013-020895 · Feb 5, 2013 · national
Continuity (1)
Related Publication 20150262858A1 · Sep 17, 2015