Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.
1. A lead frame for mounting LED elements, comprising:
a frame body region; and
a large number of package regions arranged in multiple rows and columns in the frame body region, the package regions each including a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a cutting region;
wherein the die pad and lead section in a package region of interest are connected to the die pad and lead section, respectively, in a second package region adjacent to the package region of interest, by a die pad connecting portion and a lead connecting portion, respectively;
wherein the die pad connecting portion and lead connecting portion are connected to each other by a reinforcement piece positioned in the cutting region; and
wherein the reinforcement piece extends only between the lead connecting portion and the die pad connecting portion.
2. The lead frame according to claim 1 , wherein the die pad or lead section in the package region of interest is connected to the die pad or the lead section, respectively, in a third package region adjacent to the package region of interest, by a package region connecting portion.
3. The lead frame according to claim 2 , wherein the package region connecting portion is thinner than the die pad and the lead section.
4. The lead frame according to claim 1 , wherein
each package region includes one die pad and first and second lead sections, the first and second lead sections being positioned across the die pad;
the die pad, the first lead section and the second lead section existing in the package region of interest are connected to the die pad, the first lead section and the second lead section existing in the second package region, by a die pad connecting portion, a first-lead connecting portion and a second-lead connecting portion, respectively; and
between the package region of interest and the second package region adjacent thereto, the reinforcement piece extends only between the first-lead connecting portion, the die pad connecting portion and the second-lead connecting portion.
5. The lead frame according to claim 1 , wherein the die pad connecting portion, the lead connecting portion and the reinforcement piece form a shape of the letter H.
6. The lead frame according to claim 1 , wherein the reinforcement piece includes a main body and a plated layer formed on the main body.
7. A resin-containing lead frame, comprising:
the lead frame according to claim 1 ; and
a reflecting resin disposed on edges of package regions in the lead frame.