Fin cut for taper device
A method of making a semiconductor device includes patterning a fin in a substrate; performing a first etching process to remove a portion of the fin to cut the fin into a first cut fin and a second cut fin, the first cut fin having a first fin end and a second fin end and the second cut fin having a first fin end and a second fin end; forming an oxide layer along an endwall of the first fin end and an endwall of the second fin end of the first cut fin, and an endwall of the first fin end and an endwall of the second fin end of the second cut fin; disposing a liner onto the oxide layer disposed onto the endwall of the first fin end of the first cut fin to form a bilayer liner; and performing a second etching process to remove a portion of the second cut fin.
1. A method of making a semiconductor device, the method comprising:
patterning a fin in a substrate;
performing an anisotropic etch process to remove a portion of the fin to cut the fin into a first cut fin and a second cut fin, the first cut fin having a first fin end and a second fin end, and the second cut fin having a first fin end and a second fin end;
performing a thermal a thermal oxidation process at a temperature in a range from about 300 to about 1100° C. to form an oxide layer on an endwall of the first fin end and an endwall of the second fin end of the first cut fin, and an endwall of the first fin end and an endwall of the second fin end of the second cut fin;
disposing a liner comprising an insulating material onto the oxide layer disposed on the endwall of the first fin end of the first cut fin to form a bilayer liner comprising the liner and the oxide layer; and
performing an isotropic etch process comprising a chemical etchant to remove a portion of the second cut fin.