Chip substrate comprising a groove portion and chip package using the chip substrate
Disclosed is a chip substrate. The chip substrate includes: conductive portions laminated in one direction to constitute the chip substrate; insulation portions alternately laminated with the conductive portions to electrically isolate the conductive portions; a cavity formed at a predetermined depth in a recessed shape in a region including the insulation portions on an upper surface of the chip substrate; and a groove portion disposed outside the cavity in a spaced-apart relationship with the cavity and formed at a predetermined depth in a recessed shape. According to the present invention, an adhesive agent is applied in a groove portion formed in advance. It is therefore possible to prevent the adhesive agent from being exposed to the light emitted from optical elements and to prevent the adhesive agent from being denatured. This makes it possible to enhance the reliability of lens bonding. Furthermore, there is no need to use an expensive resistant adhesive agent. An existing typical adhesive agent may be used as it is. This provides an effect of saving costs. Thus, there is an advantage in that a low-priced existing bonding material may be applied to a high-priced UV-C (deep-UV) package.
1. A chip package, comprising:
a chip substrate which includes conductive portions laminated in one direction to constitute the chip substrate, insulation portions alternately laminated with the conductive portions to electrically isolate the conductive portions, a cavity depressed inward of the conductive portions in a region including the insulation portions, and a groove portion disposed outside the cavity in a spaced-apart relationship with the cavity and formed at a predetermined depth in a recessed shape;
an optical element mounted within the cavity; and
a sealing member bonded to the chip substrate by an adhesive agent disposed within the groove portion in order to seal the cavity, the sealing member including a shielding portion formed on one surface corresponding to the groove portion,
wherein the groove portion is formed on partial regions of the conductive portions and partial regions of the insulation portions, and the adhesive agent is disposed on the partial regions of the conductive portions and the partial regions of the insulation portions.
2. The chip package of claim 1 , wherein the groove portion is formed to continuously extend along an outer periphery of the cavity.
3. The chip package of claim 1 , further comprising:
an outer wall formed between the cavity and the groove portion to isolate the groove portion from the cavity.
4. The chip package of claim 3 , wherein a height of the outer wall is determined by a thickness of the sealing member.
5. The chip package of claim 1 , wherein the conductive portions or the insulation portions are formed in a plural number and the cavity is formed in a recessed shape in a region including at least two or more of the conductive portions and at least one or more of the insulation portions.
6. The chip package of claim 1 , wherein each of the insulation portions is bonded to each of the conductive portions through an anodizing layer formed on at least one surface of each of the conductive portions and is configured to electrically isolate the conductive portions.
7. The chip package of claim 1 , further comprising:
bumps formed at a predetermined height within the cavity on surfaces of the conductive portions isolated by the insulation portions, the bumps bonded to electrode portions formed in chips mounted on the chip substrate.
8. The chip package of claim 1 , wherein the sealing member further includes:
a sealing portion configured to seal the cavity.
9. The chip package of claim 8 , wherein a thickness of the shielding portion is determined in view of a thickness of the groove portion and a spaced-apart distance between the cavity and the groove portion.
10. The chip package of claim 8 , wherein the shielding portion is formed on one surface of the sealing portion at a thickness including the groove portion in order to prevent entry into the groove portion of light reflected by one surface of the sealing portion.
11. The chip package of claim 8 , wherein the shielding portion is made of a material for shielding light reflected by one surface of the sealing portion in order to prevent entry into the groove portion of the light.
12. The chip package of claim 8 , wherein the shielding portion is formed on a surface of the sealing portion which is bonded to the chip substrate.