Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.
1. A leadframe, comprising:
a die pad for mounting an LED element or a semiconductor element; and
a lead section adjacent to the die pad;
wherein a spatial gap is formed between the die pad and the lead section, a lower-surface side of the spatial gap being larger than upper-surface side of the spatial gap,
the die pad has a thin portion extending toward the lead section side,
the die pad has a first opposing surface opposing the lead section side,
the lead section has a second opposing surface opposing the die pad side,
the second opposing surface of the lead section having a curve portion in cross section, and
the first opposing surface of the die pad and the second opposing surface of the lead section are formed asymmetrically to each other.
2. A semiconductor device comprising:
a die pad;
a lead section adjacent to the die pad;
an LED element or a semiconductor element mounted on the die pad;
an electroconductive portion connecting the lead section and the LED element or the semiconductor element; and
a sealing resin sealing the LED element or the semiconductor element, and the electroconductive portion;
wherein a spatial gap is formed between the die pad and the lead section, a lower-surface side of the spatial gap being larger than an upper-surface side of the spatial gap,
the die pad has a thin portion extending toward the lead section side,
the die pad has a first opposing surface opposing the lead section side,
the lead section has a second opposing surface opposing the die pad side, the second opposing surface of the lead section having a curve portion in cross section, and
the first opposing surface of the die pad and the second opposing surface of the lead section are formed asymmetrically to each other.
3. A resin-attached leadframe, comprising:
a die pad for mounting an LED element;
a lead section adjacent to the die pad;
a connecting portion connected to the die pad or the lead section; and
a reflector disposed on the die pad and the lead section;
wherein the connecting portion has a recess on a lower-surface side,
on an upper-surface side of the leadframe, two non-through grooves are formed on the connecting portion in cross section, and
the recess and both non-through grooves are filled with the reflector.
4. A semiconductor device comprising:
a die pad;
a lead section adjacent to the die pad;
a connecting portion connected to the die pad or the lead section;
a reflector disposed on the die pad and the lead section;
an LED element mounted on the die pad;
an electroconductive portion connecting the lead section and the LED element; and
a sealing resin sealing the LED element, and the electroconductive portion;
wherein the connecting portion has a recess on a lower-surface side, the connecting portion being exposed to the outside of the semiconductor device,
on an upper-surface side of the die pad or the lead section, a non-through groove is formed on the connecting portion in a cross section, and the non-through groove being encapsulated in the semiconductor device, and
the recess and the non-through groove are filled with the reflector.
5. A semiconductor device comprising:
a die pad;
a lead section adjacent to the die pad;
a connecting portion connected to the die pad or the lead section;
a reflector disposed on the die pad and the lead section;
an LED element mounted on the die pad;
an electroconductive portion connecting the lead section and the LED element; and
a sealing resin sealing the LED element, and the electroconductive portion;
wherein the connecting portion is exposed to the outside of the semiconductor device,
a plated layer is formed on an upper-surface side or on a lower-side of the die pad or of the lead section, and is not formed on a portion of the connecting portion which is exposed to the outside of the semiconductor device,
the connecting portion has a recess on a lower-surface side, and
the plated layer further formed in the recess of the connecting portion.