Silicon carbide semiconductor substrate, method for manufacturing silicon carbide semiconductor substrate, and method for manufacturing silicon carbide semiconductor device where depression supression layer is formed on backside surface of base substrate opposite to main surface on which epitaxial layer is formed
A silicon carbide semiconductor substrate includes: a base substrate that has a main surface having an outer diameter of not less than 100 mm and that is made of single-crystal silicon carbide; an epitaxial layer formed on the main surface; and a deformation suppression layer formed on a backside surface of the base substrate opposite to the main surface. In this way, the deformation suppression layer suppresses the substrate from being deformed (for example, warped during high-temperature treatment). This can reduce a risk of causing defects such as crack in the silicon carbide semiconductor substrate during the manufacturing process in performing a method for manufacturing a silicon carbide semiconductor device using the silicon carbide semiconductor substrate.
1. A silicon carbide semiconductor substrate comprising:
a base substrate that has a main surface having an outer diameter of not less than 100 mm and that is made of single-crystal silicon carbide;
an epitaxial layer formed on said main surface; and
a deformation suppression layer formed on a backside surface of said base substrate opposite to said main surface,
wherein said silicon carbide semiconductor substrate has an amount of warpage of not less than −100 μm and not more than 100 μm when a substrate temperature is a room temperature, and has an amount of warpage of not less than −1.5 mm and not more than 1.5 mm when the substrate temperature is 400° C.
2. The silicon carbide semiconductor substrate according to claim 1 , wherein said deformation suppression layer has a thermal expansion coefficient, which is not more than 90% or not less than 110% of a thermal expansion coefficient of the single-crystal silicon carbide.
3. The silicon carbide semiconductor substrate according to claim 1 , wherein said deformation suppression layer has a thickness of not more than 5 μm.
4. The silicon carbide semiconductor substrate according to claim 1 , wherein said deformation suppression layer is made of at least one material selected from a group consisting of silicon oxide, carbon, aluminum, titanium, nickel, platinum, and gold.
5. A method for manufacturing a silicon carbide semiconductor substrate comprising steps of:
preparing a base substrate that has a main surface having an outer diameter of not less than 100 mm and that is made of single-crystal silicon carbide;
forming an epitaxial layer on said main surface; and
forming a deformation suppression layer on a backside surface of said base substrate opposite to said main surface,
wherein the step of forming the deformation suppression layer is performed before implanting an impurity ion into the epitaxial layer.
6. The method for manufacturing the silicon carbide semiconductor substrate according to claim 5 , wherein in the step of forming said deformation suppression layer, said deformation suppression layer is formed to have a thermal expansion coefficient smaller than a thermal expansion coefficient of the single-crystal silicon carbide when said main surface of said base substrate is warped in a form of a recess after the step of forming said epitaxial layer, and said deformation suppression layer is formed to have a thermal expansion coefficient larger than the thermal expansion coefficient of the single-crystal silicon carbide when said main surface of said base substrate is warped in a form of a projection after the step of forming said epitaxial layer.
7. The method for manufacturing the silicon carbide semiconductor substrate according to claim 6 , wherein in the step of forming said deformation suppression layer, said deformation suppression layer having the thermal expansion coefficient smaller than the thermal expansion coefficient of the single-crystal silicon carbide is made of at least one of silicon oxide and carbon, and said deformation suppression layer having the thermal expansion coefficient larger than the thermal expansion coefficient of the single-crystal silicon carbide is made of at least one selected from a group consisting of aluminum, titanium, nickel, platinum, and gold.
8. The method for manufacturing the silicon carbide semiconductor substrate according to claim 5 , wherein in the step of forming said deformation suppression layer, said deformation suppression layer is formed to have a thermal expansion coefficient, which is not more than 90% or not less than 110% of the thermal expansion coefficient of the single-crystal silicon carbide.
9. A method for manufacturing a silicon carbide semiconductor device comprising steps of:
preparing a base substrate that has a main surface having an outer diameter of not less than 100 mm and that is made of single-crystal silicon carbide;
forming an epitaxial layer on said main surface;
preparing a silicon carbide semiconductor substrate by forming a deformation suppression layer on a backside surface of said base substrate opposite to said main surface; and
implanting an impurity ion into said silicon carbide semiconductor substrate,
wherein the impurity ion is implanted after forming the deformation suppression layer.