Single and double diffusion breaks on integrated circuit products comprised of FinFET devices

1. An integrated circuit product, comprising:

a plurality of FinFET devices;

a single diffusion break (SDB) isolation structure positioned in a first trench defined in a semiconductor substrate between first and second active regions;

a first sidewall spacer that contacts and engages opposite sidewall surfaces of said SDB isolation structure, wherein an uppermost surface of said SDB isolation structure has a height greater than a lowermost surface of said first sidewall spacer;

a double diffusion break (DDB) isolation structure positioned in a second trench defined in said semiconductor substrate between third and fourth active regions; and

second and third sidewall spacers, said second sidewall spacer engaging and contacting a first sidewall surface of said DDB isolation structure, said third sidewall spacer engaging and contacting a second sidewall surface of said DDB isolation structure opposite said first sidewall surface, wherein an uppermost surface of said DDB isolation structure has a height greater than lowermost surfaces of said second and third sidewall spacers.

2. The product of claim 1 , wherein each of said FinFET devices comprises a gate structure comprising a high-k gate insulation material and at least one layer of metal and wherein said SDB isolation structure further comprises said high-k gate insulation material and said at least one layer of metal.

3. The product of claim 2 , wherein said first sidewall spacer contacts and engages said high-k gate insulation material.

4. The product of claim 1 , wherein said SDB isolation structure comprises a conformal liner layer comprising an insulating material that is positioned on and in contact with said semiconductor substrate within said first trench.

5. The product of claim 4 , wherein said first sidewall spacer contacts and engages said conformal liner layer.

6. The product of claim 1 , wherein said DDB isolation structure comprises an insulating material that substantially fills said second trench.

7. The product of claim 2 , wherein said DDB isolation structure comprises an insulating material that substantially fills said second trench.

8. The product of claim 2 , wherein said SDB isolation structure further comprises an insulating material positioned in a bottom of said first trench, wherein said high-k gate insulation material and said at least one layer of metal are positioned within said first trench vertically above said insulating material.

9. The product of claim 1 , wherein said first sidewall spacer is positioned adjacent a first gate structure positioned above said substrate, said second sidewall spacer is positioned adjacent a second gate structure positioned above said substrate and said third sidewall spacer is positioned adjacent a third gate structure positioned above said substrate.

10. The product of claim 1 , wherein said SDB isolation structure comprises an insulating material that substantially fills said first trench.

11. The product of claim 6 , wherein said SDB isolation structure comprises an insulating material that substantially fills said first trench.

12. The product of claim 4 , wherein a conformal high-k gate insulation material is formed above said conformal liner layer and at least one layer of metal is formed above said conformal high-k gate insulation layer.

13. The product of claim 1 , wherein said SDB isolation structure comprises an insulating material positioned in a bottom of said first trench and a conductive material positioned within said first trench vertically above said insulating material, wherein said first sidewall spacer contacts opposite sidewall surfaces of said conductive material.

14. The product of claim 13 , wherein said conductive material comprises polysilicon.

15. An integrated circuit product, comprising:

a plurality of FinFET devices;

a single diffusion break (SDB) isolation structure positioned in a first trench defined in a semiconductor substrate between first and second active regions, wherein said SDB isolation structure comprises a conformal liner layer comprising a first insulating material that is positioned on and in contact with said semiconductor substrate within said first trench, a second layer of a second insulating material different than said first insulating material, and a conductive material formed above said second layer;

a first sidewall spacer that contacts and engages opposite sidewall surfaces of said conformal liner layer of said SDB isolation structure, wherein an uppermost surface of said SDB isolation structure has a height greater than a lowermost surface of said first sidewall spacer;

a double diffusion break (DDB) isolation structure positioned in a second trench defined in said semiconductor substrate between third and fourth active regions; and

second and third sidewall spacers, said second sidewall spacer engaging and contacting a first sidewall surface of said DDB isolation structure, said third sidewall spacer engaging and contacting a second sidewall surface of said DDB isolation structure opposite said first sidewall surface, wherein an uppermost surface of said DDB isolation structure has a height greater than lowermost surfaces of said second and third sidewall spacers.

16. The product of claim 15 , wherein each of said FinFET devices comprises a gate structure comprising a high-k gate insulation material and at least one layer of metal and wherein said second layer further comprises said high-k gate insulation material and said conductive material comprises said at least one layer of metal.

17. The product of claim 15 , wherein said DDB isolation structure comprises an insulating material that substantially fills said second trench.

18. The product of claim 15 , wherein said first sidewall spacer is positioned adjacent a first gate structure positioned above said substrate, said second sidewall spacer is positioned adjacent a second gate structure positioned above said substrate and said third sidewall spacer is positioned adjacent a third gate structure positioned above said substrate.

19. An integrated circuit product, comprising:

a plurality of FinFET devices;

a single diffusion break (SDB) isolation structure positioned in a first trench defined in a semiconductor substrate between first and second active regions, wherein said SDB isolation structure comprises an insulating material positioned in a bottom of said first trench and a conductive material positioned within said first trench vertically above said insulating material;

a first sidewall spacer that contacts and engages opposite sidewall surfaces of said conformal liner layer of said SDB isolation structure, wherein an uppermost surface of said SDB isolation structure has a height greater than a lowermost surface of said first sidewall spacer, and said first sidewall spacer contacts opposite sidewall surfaces of said conductive material;

a double diffusion break (DDB) isolation structure positioned in a second trench defined in said semiconductor substrate between third and fourth active regions; and

second and third sidewall spacers, said second sidewall spacer engaging and contacting a first sidewall surface of said DDB isolation structure, said third sidewall spacer engaging and contacting a second sidewall surface of said DDB isolation structure opposite said first sidewall surface, wherein an uppermost surface of said DDB isolation structure has a height greater than lowermost surfaces of said second and third sidewall spacers.

20. The product of claim 19 , wherein said conductive material comprises polysilicon.