Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.
1. A semiconductor device comprising:
a lead frame including a die pad and a lead section adjacent to the die pad;
an LED element mounted on the die pad;
an electroconductive portion connecting the lead section and the LED element;
a reflecting resin filling a spatial gap between the die pad and the lead section; and
a sealing resin sealing the LED element and the electroconductive portion;
wherein an inclined reinforcement piece is connected to the die pad or the lead section of the lead frame, and
wherein the die pad and the lead section are arranged side by side in a direction of X, a direction of Y is perpendicular to the direction of X, and the inclined reinforcement piece is inclined with regard to both the direction of X and the direction of Y in a plane view.
2. The semiconductor device according to claim 1 , wherein the inclined reinforcement piece is connected to the die pad, and an additional inclined reinforcement piece is connected to the lead section.
3. The semiconductor device according to claim 2 , wherein the inclined reinforcement piece and the additional inclined reinforcement piece are positioned in parallel with each other.
4. The semiconductor device according to claim 1 , wherein a plurality of inclined reinforcement pieces are connected to the die pad or the lead section.
5. The semiconductor device according to claim 4 , wherein the plurality of inclined reinforcement pieces are positioned in parallel with each other.
6. The semiconductor device according to claim 1 , wherein the die pad and the lead section have a rectangular shape and a plurality of inclined reinforcement pieces are connected to a same side of the die pad or the lead section.
7. The semiconductor device according to claim 1 , wherein the inclined reinforcement piece is exposed outwardly at a corner of the semiconductor device.
8. A semiconductor device comprising:
a lead frame including a die pad and a lead section adjacent to the die pad;
an LED element mounted on the die pad;
an electroconductive portion connecting the lead section and the LED element;
a reflecting resin filling a spatial gap between the die pad and the lead section; and
a sealing resin sealing the LED element and the electroconductive portion;
wherein an inclined reinforcement piece is connected to the die pad or the lead section of the lead frame, and
wherein in a plane view, the inclined reinforcement piece crosses an extension line in a lengthwise direction of the spatial gap.
9. A semiconductor device comprising:
a lead frame including a die pad and a lead section adjacent to the die pad;
an LED element mounted on the die pad;
an electroconductive portion connecting the lead section and the LED element;
a reflecting resin filling a spatial gap between the die pad and the lead section; and
a sealing resin sealing the LED element and the electroconductive portion;
wherein an inclined reinforcement piece is connected to the die pad or the lead section of the lead frame, and
wherein the die pad and the lead section have a rectangular shape and the inclined reinforcement piece is inclined with regard to a side of the die pad or the lead section in a plane view.
10. A semiconductor device comprising:
a lead frame including a die pad and a lead section adjacent to the die pad;
an LED element mounted on the die pad;
an electroconductive portion connecting the lead section and the LED element;
a reflecting resin filling a spatial gap between the die pad and the lead section; and
a sealing resin sealing the LED element and the electroconductive portion;
wherein an inclined reinforcement piece is connected to the die pad or the lead section of the lead frame, and
wherein the inclined reinforcement piece is formed as an elongated rod linearly extended.
11. A semiconductor device comprising:
a lead frame including a die pad and a lead section adjacent to the die pad;
a semiconductor element mounted on the die pad;
an electroconductive portion connecting the lead section and the semiconductor element; and
a sealing resin sealing the semiconductor element and the electroconductive portion;
wherein an inclined reinforcement piece is connected to the die pad or the lead section of the lead frame, and
wherein in a plane view, the inclined reinforcement piece crosses an extension line in a lengthwise direction of the spatial gap.
12. A semiconductor device comprising:
a lead frame including a die pad and a lead section adjacent to the die pad;
a semiconductor element mounted on the die pad;
an electroconductive portion connecting the lead section and the semiconductor element; and
a sealing resin sealing the semiconductor element and the electroconductive portion;
wherein an inclined reinforcement piece is connected to the die pad or the lead section of the lead frame, and
wherein the die pad and the lead section are arranged side by side in a direction of X, a direction of Y is perpendicular to the direction of X, and the inclined reinforcement piece is inclined with regard to both the direction of X and the direction of Y in a plane view.
13. The semiconductor device according to claim 12 , wherein the inclined reinforcement piece is connected to the die pad, and an additional inclined reinforcement piece is connected to the lead section.
14. The semiconductor device according to claim 13 , wherein the inclined reinforcement piece and the additional inclined reinforcement piece are positioned in parallel with each other.
15. The semiconductor device according to claim 12 , wherein a plurality of inclined reinforcement pieces are connected to the die pad or the lead section.
16. The semiconductor device according to claim 15 , wherein the plurality of inclined reinforcement pieces are positioned in parallel with each other.
17. The semiconductor device according to claim 12 , wherein the die pad and the lead section have a rectangular shape and a plurality of inclined reinforcement pieces are connected to a same side of the die pad or the lead section.
18. The semiconductor device according to claim 12 , wherein the inclined reinforcement piece is exposed outwardly at a corner of the semiconductor device.
19. A semiconductor device comprising:
a lead frame including a die pad and a lead section adjacent to the die pad;
a semiconductor element mounted on the die pad;
an electroconductive portion connecting the lead section and the semiconductor element; and
a sealing resin sealing the semiconductor element and the electroconductive portion;
wherein an inclined reinforcement piece is connected to the die pad or the lead section of the lead frame, and
wherein the die pad and the lead section have a rectangular shape and the inclined reinforcement piece is inclined with regard to a side of the die pad or the lead section in a plane view.
20. A semiconductor device comprising:
a lead frame including a die pad and a lead section adjacent to the die pad;
a semiconductor element mounted on the die pad;
an electroconductive portion connecting the lead section and the semiconductor element; and
a sealing resin sealing the semiconductor element and the electroconductive portion;
wherein an inclined reinforcement piece is connected to the die pad or the lead section of the lead frame, and
wherein the inclined reinforcement piece is formed as an elongated rod linearly extended.