Substrate aligning apparatus, substrate bonding apparatus, substrate aligning method and substrate bonding method
A substrate aligning apparatus comprising: an aligning section that aligns a first substrate and a second substrate together; an acquiring section that acquires positional information on at least one of the first substrate and the second substrate, by the time the first substrate and the second substrate which have been aligned in the aligning section are carried out from the aligning section; a judging that judges misalignment of the first substrate and the second substrate, based on information acquired by the acquiring section.
1. A substrate aligning apparatus comprising:
an aligning section that aligns a first substrate and a second substrate together;
an acquiring section that acquires positional information on at least one of the first substrate and the second substrate; and
a judging section that judges misalignment of the first substrate and the second substrate, based on whether an amplitude of the positional information acquired by the acquiring section is less than a threshold for judging occurrence of misalignment.
2. The substrate aligning apparatus according to claim 1 , further comprising:
a holding section that holds at least one of the first substrate and the second substrate, wherein
the positional information includes information on a position of the holding section.
3. The substrate aligning apparatus according to claim 2 , wherein
the positional information includes information on a signal that shows light intensity due to interference of light reflected from a reflective member fixed to the holding section or the substrate.
4. The substrate aligning apparatus according to claim 3 , wherein
the judging section judges whether a maximum value of amplitude of the signal is not less than the threshold, and judges that misalignment will occur, if the maximum value is not less than the threshold.
5. The substrate aligning apparatus according to claim 3 , wherein
the positional information includes a waveform of the signal, and
the judging section judges that misalignment will occur by comparing the waveform and a waveform that is seen when misalignment occurs.
6. The substrate aligning apparatus according to claim 1 , wherein
based on the positional information, the judging section presumes at least one of whether misalignment will occur on the first substrate and the second substrate after detecting the positional information, and a factor of occurrence of the misalignment.
7. The substrate aligning apparatus according to claim 1 , wherein
the judging section judges misalignment from the positional information in at least one of timings: when the first substrate and the second substrate which have been aligned gets in contact with each other; when a carrying section carrying out the first substrate and the second substrate which have been aligned from the aligning section gets in contact with at least one of the first substrate and the second substrate; and when the first substrate and the second substrate which have been aligned are clamped by a clamping section.
8. The substrate aligning apparatus according to claim 1 , comprising:
a moving section which moves at least one of the first substrate and the second substrate; and
a drive control section that drives the moving section to align the first substrate and the second substrate, wherein
the drive control section aligns the first substrate and the second substrate again, if the judging section judges that the misalignment has occurred, or judges that the misalignment will occur.
9. The substrate aligning apparatus according to claim 1 , wherein
information on the first substrate and the second substrate includes information on temporal change in positions of the first substrate and the second substrate.
10. A substrate aligning apparatus comprising:
an aligning section that aligns a pair of substrates;
a holding section that holds at least one of the pair of substrates; and
a judging section that judges whether there is misalignment of the pair of substrates which has been aligned by the aligning section, based on whether an amplitude of positional information of the holding section is less than a threshold for judging occurrence of misalignment.
11. The substrate aligning apparatus according to claim 1 , wherein
the aligning section temporarily stacks the first substrate and the second substrate.
12. The substrate aligning apparatus according to claim 1 , wherein
the aligning section electrically stacks a first circuit provided on the first substrate and a second circuit provided on the second substrate.
13. A substrate bonding apparatus comprising:
the substrate aligning apparatus according to claim 1 ; and
a stacking section that stacks the first substrate and the second substrate together which have been aligned on the aligning apparatus.
14. A substrate aligning method comprising:
aligning a first substrate and a second substrate together in an aligning section;
acquiring positional information on at least one of the first substrate and the second substrate; and
judging misalignment of the first substrate and the second substrate based on whether an amplitude of the positional information acquired in the acquisition is less than a threshold for judging occurrence of misalignment.
15. The substrate aligning method according to claim 14 , wherein
the positional information includes information on at least one of a position of a holding section that holds at least one of the first substrate and the second substrate, and a signal that shows light intensity due to interference of light reflected from a reflective member fixed to the holding section or the substrate.
16. The substrate aligning method according to claim 15 , wherein
the judging judges whether a maximum value of amplitude of the signal is not less than the threshold, and judges that misalignment will occur, if the maximum value is not less than the threshold.
17. The substrate aligning method according to claim 15 , wherein
the positional information includes a waveform of the signal, and
the judging judges that misalignment will occur by comparing the waveform and a waveform that is seen when misalignment occurs.
18. The substrate aligning method according to claim 14 , wherein
based on the positional information, the judging presumes whether misalignment will occur on the first substrate and the second substrate after detecting the positional information.
19. The substrate aligning method according to claim 14 , wherein
the judging judges misalignment from the positional information in at least one of timings: when the first substrate and the second substrate which have been aligned get in contact with each other; when a carrying section carrying out the first substrate and the second substrate which have been aligned from the aligning section gets in contact with at least one of the first substrate and the second substrate; and when the first substrate and the second substrate which have been aligned are clamped by a clamping section.
20. The substrate aligning method according to claim 14 , further comprising:
drive controlling by driving a moving section to move at least one of the first substrate or the second substrate to align the first substrate and the second substrate, wherein
if the judging judges that the misalignment has occurred, or judges that the misalignment will occur, the first substrate and the second substrate are aligned again by the drive controlling.
21. The substrate aligning method according to claim 14 , wherein
information on the first substrate and the second substrate in the aligning section includes information on temporal change in positions of the first substrate and the second substrate.
22. A substrate aligning method comprising:
aligning a first substrate and second substrate in an aligning section;
judging whether there is misalignment of the first substrate and the second substrate that have been aligned in the aligning, based on whether an amplitude of positional information of a holding section that holds at least one of the first substrate and the second substrate is less than a threshold for judging occurrence of misalignment.
23. The substrate aligning method according to claim 14 , wherein
the aligning includes temporarily stacking the first substrate and the second substrate.
24. The substrate aligning method according to claim 14 , wherein
the aligning includes electrically stacking a first circuit provided on the first substrate and a second circuit provided on the second substrate.
25. A substrate bonding method comprising:
the substrate aligning method according to claim 14 ; and
stacking the first substrate and the second substrate together that have been aligned by the aligning method.