Low resistance source drain contact formation
Techniques for forming Ga-doped source drain contacts in Ge-based transistors are provided. In one aspect, a method for forming Ga-doped source and drain contacts includes the steps of: depositing a dielectric over a transistor; depositing a dielectric over the transistor; forming contact trenches in the dielectric over, and extending down to, source and drain regions of the transistor; depositing an epitaxial material into the contact trenches; implanting gallium ions into the epitaxial material to form an amorphous gallium-doped layer; and annealing the amorphous gallium-doped layer under conditions sufficient to form a crystalline gallium-doped layer having a homogenous gallium concentration of greater than about 5×10 20 at./cm 3 . Transistor devices are also provided utilizing the present Ga-doped source and drain contacts.
1. A method for forming gallium-doped p-type source and drain contacts, the method comprising the steps of:
forming a transistor comprising source and drain regions interconnected by a channel region and at least one gate configured to regulate current flow through the channel region;
depositing a dielectric over the transistor;
forming contact trenches in the dielectric over, and extending down to, the source and drain regions;
depositing an epitaxial material into the contact trenches;
implanting gallium ions into the epitaxial material to form an amorphous gallium-doped layer; and
annealing the amorphous gallium-doped layer under conditions sufficient to form a crystalline gallium-doped layer having a homogenous gallium concentration of greater than about 5×10 20 atoms per cubic centimeter (at./cm 3 ),
wherein the implanting further comprises performing a pocketed ion implant of the gallium ions into the epitaxial material whereby the gallium ions are implanted into only a portion of the epitaxial material such that the annealing produces a layered contact structure comprising three distinct regions including: a first region comprising the crystalline gallium-doped layer, a second region comprising the epitaxial material, and a third region comprising the source and drain regions, wherein the first region, the second region and the third region each comprises a germanium-containing semiconductor with the first region and the second region having a higher percentage of germanium than the third region, and wherein the first region has the homogenous gallium concentration of greater than about 5×10 20 at./cm 3 .
2. The method of claim 1 , further comprising the step of:
performing a surface cleaning within the contact trenches.
3. The method of claim 1 , wherein the source and drain regions comprise boron-doped silicon germanium.
4. The method of claim 1 , wherein the epitaxial material comprises boron-doped silicon germanium.
5. The method of claim 1 , wherein the epitaxial material comprises boron-doped germanium.
6. The method of claim 1 , wherein the epitaxial material comprises gallium-doped germanium.
7. The method of claim 1 , wherein the amorphous gallium-doped layer has a depth in the epitaxial material of from about 5 nanometers to about 10 nanometers, and ranges therebetween.
8. The method of claim 1 , wherein the crystalline gallium-doped layer has a homogenous gallium concentration of from about 6×10 20 at./cm 3 to about 8×10 21 at./cm 3 , and ranges therebetween.
9. The method of claim 1 , wherein the conditions comprise a temperature and a duration.
10. The method of claim 9 , wherein the annealing is performed using solid phase epitaxy laser annealing and wherein the temperature is from about 600° C. to about 800° C., and ranges therebetween, and the duration is from about 50 microseconds to about 5 milliseconds, and ranges therebetween.
11. The method of claim 9 , wherein the annealing is performed using liquid phase epitaxy laser annealing and wherein the temperature is from about 750° C. to about 1,100° C., and ranges therebetween, and the duration is from about 10 nanoseconds to about 1,000 nanoseconds, and ranges therebetween.
12. The method of claim 1 , further comprising the step of:
forming a metal silicide on the crystalline gallium-doped layer.
13. The method of claim 1 , further comprising the step of:
filling the contact trenches with a contact metal.
14. The method of claim 13 , wherein the contact metal comprises a metal selected from the group consisting of tungsten, cobalt, aluminum, and combinations thereof.
15. The method of claim 1 , wherein the first region comprising the crystalline gallium-doped layer is directly in contact with the third region comprising the source and drain regions.
16. The method of claim 1 , wherein the first region comprises gallium (Ga) and boron (B) doped silicon germanium (SiGe) (SiGe y :Ga:B), the second region comprises SiGe y :Ga:B, and the third region comprises Si 1-x Ge x :B, wherein x<y<1, and wherein 0≤x≤0.75.