Polishing apparatus
A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
1. A top ring comprising:
an upper member;
a lower member held under the upper member, the lower member being configured to press a substrate against a polishing surface;
a first elastic membrane that has an inner end and an outer end, both of the inner end and the outer end are fixed in place relative to the upper member, the first elastic membrane forming a pressure chamber;
a ring member configured to surround the lower member and the substrate, the ring member configured to press against the polishing surface according to a supply of a pressurized fluid into the pressure chamber independently of the lower member,
wherein the first elastic membrane has a bent portion, the ring member is connected to the first elastic membrane such that the bent portion folds over an upper portion of the ring member when an inner pressure in the pressure chamber decreases, and the ring member is connected to the first elastic membrane such that when the inner pressure in the pressure chamber increases the bent portion rolls out to push the ring member against the polishing surface.
2. The top ring according to claim 1 , further comprising a cylinder and a holder, the holder configured to press the inner end and the outer end against the cylinder.
3. The top ring according to claim 1 , wherein at least a part of the holder is placed in the pressure chamber.
4. The top ring according to claim 1 , further comprising a holding member fixed to the upper member, the holder being fixed to the holding member.
5. The top ring according to claim 1 , further comprising a second elastic membrane held on a lower surface of the lower member, the second elastic membrane having a plurality of ripples adapted to form a chamber therebetween.
6. The top ring according to claim 5 , wherein the ripples form a plurality of chambers, each of the chambers is supplied with fluids adjusted respectively.
7. The top ring according to claim 5 , wherein the ripples are fixed to the lower member by ripple holders.
8. The top ring according to claim 5 , wherein one of the ripples has a vertical portion, a horizontal portion and a bend portion between the vertical portion and the horizontal portion.
9. The top ring according to claim 5 , wherein one of the ripples has an incline portion which is inclined with respect to the vertical direction.
10. The top ring according to claim 5 , wherein a root portion of the ripple is thinner than the other portion of the ripple.
11. The top ring according to claim 1 , wherein the ring member comprises an upper ring member and a lower ring member, a lower surface of the upper ring member and an upper surface of the lower ring member in contact with each other.
12. The top ring according to claim 11 , wherein heights of an inner end and an out end of the lower surface of the upper ring member are different from each other.
13. The top ring according to claim 11 , wherein heights of an inner end and an out end of the upper surface of the lower ring member are different from each other.
14. The top ring according to claim 11 , wherein the lower surface of the upper ring member and the upper surface of the lower ring member have a taper portion respectively, the taper portion of the lower surface of the upper ring member and the taper portion of the upper surface of the lower ring member contact each other.
15. The top ring of claim 1 , wherein the upper portion of the ring member is connected to the first elastic membrane, the upper portion is further connected to a lower portion of the ring member, and when the inner pressure in the pressure chamber increases the bent portion rolls out to push the lower portion of the ring member against the polishing surface.