Semiconductor device and a method of manufacturing the same
To provide a technique capable of positioning of a semiconductor chip and a mounting substrate with high precision by improving visibility of an alignment mark. In a semiconductor chip constituting an LCD driver, a mark is formed in an alignment mark formation region over a semiconductor substrate. The mark is formed in the same layer as that of an uppermost layer wiring (third layer wiring) in an integrated circuit formation region. Then, in the lower layer of the mark and a background region surrounding the mark, patterns are formed. At this time, the pattern P 1 a is formed in the same layer as that of a second layer wiring and the pattern P 1 b is formed in the same layer as that of a first layer wiring. Further, the pattern P 2 is formed in the same layer as that of a gate electrode, and the pattern P 3 is formed in the same layer as that of an element isolation region.
1. A semiconductor device comprising:
a semiconductor substrate;
an integrated circuit region in which a plurality of MISFETs are formed;
an alignment mark region in which an alignment mark is formed;
a first wiring layer formed over the integrated circuit region and the alignment mark region;
a second wiring layer formed over the first wiring layer; and
a plurality of STI regions formed in the semiconductor substrate and in the alignment mark region,
wherein the first wiring layer comprises:
a plurality of first wirings formed in the integrated circuit region, and which are electrically coupled to the plurality of MISFETs; and
a plurality of dummy wiring regions formed in the alignment mark region, and which are not electrically coupled to the plurality of MISFETs,
wherein the second wiring layer comprises:
the alignment mark formed in the alignment mark region; and
a plurality of second wirings formed in the integrated circuit region,
wherein the plurality of dummy wiring regions comprises:
a first dummy wiring region disposed to overlap with the alignment mark; and
a second dummy wiring region disposed to not overlap with the alignment mark, and
wherein the plurality of STI regions comprises:
a first STI region disposed to overlap with the alignment mark; and
a second STI region disposed to not overlap with the alignment mark.
2. A semiconductor device according to claim 1 ,
wherein the second wiring layer is an uppermost layer of a plurality of wiring layers of the semiconductor device.
3. A semiconductor device according to claim 1 ,
wherein the dummy wiring regions are not connected to any of other wirings respectively.
4. A semiconductor device according to claim 1 ,
wherein a planar area size of each one of the dummy wiring regions is smaller than that of the alignment mark, and
wherein a planar area size of each one of the STI regions is smaller than that of the alignment mark.
5. A semiconductor device according to claim 1 , further comprising:
a bump electrode formed over the second wiring layer and electrically connected to any one of the second wirings.
6. A semiconductor device according to claim 1 ,
wherein the plurality of first dummy wiring regions and the plurality of STI regions are arranged so as to be shifted respectively in a plan view.
7. A semiconductor device according to claim 1 ,
wherein the respective first dummy wiring regions are dot-shaped.