Substrate cleaning apparatus comprising a second jet nozzle surrounding a first jet nozzle

1. A substrate cleaning apparatus comprising:

a substrate holder configured to hold a substrate; and

a two-fluid nozzle configured to deliver fluid onto a surface of the substrate,

wherein the two-fluid nozzle includes:

a liquid container having a liquid chamber and a chamber inlet in communication with the liquid chamber,

a first jet nozzle in communication with the liquid chamber and having a first gas inlet, the first jet nozzle being configured to emit a first two-fluid jet, the first two-fluid jet comprising a gas from the first gas inlet and a liquid from the liquid container, and

a second jet nozzle in communication with the liquid chamber and having a second gas inlet, the second jet nozzle being configured to emit a second two-fluid jet at a velocity higher than a velocity of the first two-fluid jet, the second two-fluid jet comprising a gas from the second gas inlet and the liquid from the liquid container the second jet nozzle surrounding the first jet nozzle.

2. The substrate cleaning apparatus according to claim 1 , wherein the velocity of the second two-fluid jet is not less than a speed of sound.

3. The substrate cleaning apparatus according to claim 1 , further comprising:

a nozzle moving mechanism configured to move the two-fluid nozzle in a radial direction of the substrate.

4. The substrate cleaning apparatus according to claim 1 , further comprising:

a distance adjuster configured to change a distance between the two-fluid nozzle and the surface of the substrate.

5. The substrate cleaning apparatus according to claim 1 , further comprising:

a third jet nozzle disposed inside the first jet nozzle and configured to emit a third two-fluid jet at a velocity higher than the velocity of the first two-fluid jet.

6. The substrate cleaning apparatus according to claim 5 , wherein the velocity of the third two-fluid jet is not less than a speed of sound.

7. The substrate processing apparatus according to claim 1 , further comprising a polishing unit configured to polish the substrate.

8. The substrate processing apparatus according to claim 1 , further comprising at least one oscillator that is to come in contact with the substrate to vibrate the substrate.

9. The substrate cleaning apparatus according to claim 8 , wherein the oscillator is configured to rotate together with the substrate while vibrating the substrate.

10. The substrate cleaning apparatus according to claim 8 , wherein the oscillator includes a piezoelectric element, and a contact member that is mounted to the piezoelectric element and is to come in contact with the substrate.

11. The substrate cleaning apparatus according to claim 8 , wherein the oscillator is configured to vibrate the substrate in a direction perpendicular to the surface of the substrate.

12. The substrate cleaning apparatus according to claim 8 , wherein the oscillator is configured to vibrate the substrate in a direction parallel to the surface of the substrate.

13. The substrate cleaning apparatus according to claim 8 , wherein the at least one oscillator comprises at least one first oscillator configured to vibrate the substrate in a direction perpendicular to the surface of the substrate and at least one second oscillator configured to vibrate the substrate in a direction parallel to the surface of the substrate.

14. The substrate cleaning apparatus according to claim 8 , wherein the at least one oscillator comprises a plurality of oscillators, and at least two of the plurality of oscillators are configured to vibrate the substrate at different frequencies and/or different amplitudes.

15. The substrate cleaning apparatus according to claim 8 , further comprising:

a cleaning-liquid nozzle configured to supply a cleaning liquid onto a lower surface of the substrate; and

an ultrasonic transducer configured to vibrate the cleaning liquid.

16. The substrate processing apparatus according to claim 8 , further comprising a polishing unit configured to polish the substrate.

17. The substrate cleaning apparatus according to claim 1 , wherein:

the first jet nozzle receives liquid from the liquid chamber via first liquid inlet, and

the second jet nozzle receives liquid from the liquid chamber via a second liquid inlet.

18. The substrate cleaning apparatus according to claim 17 , wherein the first jet nozzle extends through the liquid chamber and the first liquid inlet is in direct fluid communication with the liquid chamber.

19. A substrate cleaning apparatus comprising:

a substrate holder configured to hold a substrate; and

a two-fluid nozzle configured to deliver fluid onto a surface of the substrate,

wherein the two-fluid nozzle includes:

a liquid container having a liquid chamber and a chamber inlet in communication with the liquid chamber,

a first jet nozzle in communication with the liquid chamber and having a first gas inlet, the first jet nozzle being configured to emit a two-fluid jet, the two-fluid jet comprising a gas from the first gas inlet and a liquid from the liquid container, and

a second jet nozzle having a second gas inlet, the second jet nozzle being configured to emit a gas jet at a velocity higher than a velocity of the two-fluid jet, the gas jet comprising a gas from the second gas inlet the second jet nozzle surrounding the first jet nozzle.

20. The substrate processing apparatus according to claim 19 , further comprising a polishing unit configured to polish the substrate.

21. The substrate cleaning apparatus according to claim 19 , wherein the first jet nozzle receives liquid from the liquid chamber via a first liquid inlet.

22. A two-fluid nozzle for use in a substrate cleaning apparatus, comprising:

a liquid container having a liquid chamber and a chamber inlet which are in communication with each other;

a first jet nozzle in communication with the liquid chamber and having a first gas inlet, the first jet nozzle being configured to emit a first two-fluid jet, the first two-fluid jet comprising a gas from the first gas inlet and a liquid from the liquid container; and

a second jet nozzle in communication with the liquid chamber and having a second gas inlet, the second jet nozzle being configured to emit a second two-fluid jet, the second two-fluid jet comprising a gas from the second gas inlet and the liquid from the liquid containerm, and the second jet nozzle surronding the first jet nozzle.

23. The two-fluid nozzle according to claim 22 , further comprising:

a third jet nozzle disposed inside the first jet nozzle.

24. The substrate cleaning apparatus according to claim 22 , wherein:

the first jet nozzle receives liquid from the liquid chamber via a first liquid inlet, and

the second jet nozzle receives liquid from the liquid chamber via a second liquid inlet.

25. The substrate cleaning apparatus according to claim 24 , wherein the first jet nozzle extends through the liquid chamber and the first liquid inlet is in direct fluid communication with the liquid chamber.