IP Library Granted Patent US 10,090,825
Granted Patent B2
US 10,090,825 · App. 15/454,928 · Granted Oct 2, 2018

Acoustic wave device

Inventor: Takuma Kuroyanagi (Tokyo, JP)
Assignee: TAIYO YUDEN CO., LTD.
H03H9/64H01L23/528H01L23/5226H01L23/53214H01L23/53228H01L23/53242H03H9/14544H01L2224/73257H01L2224/97
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Quick Facts
Patent No.
US 10,090,825
App. No.
15/454,928
Granted
Oct 2, 2018
Kind
B2
Abstract

An acoustic wave device includes: a first substrate; a first acoustic wave filter located on a first surface of the first substrate; a pad that is located on the first surface and electrically separated from the first acoustic wave filter in the first surface; a ground pattern that is located on the first surface, and is located between the pad and the first acoustic wave filter in the first surface; and a second acoustic wave filter that is electrically connected to the pad, and at least partially overlaps with the first acoustic wave filter in plan view.

Claims (42)

1. An acoustic wave device comprising:

a first substrate;

a first acoustic wave filter located on a first surface of the first substrate;

a pad that is located on the first surface and electrically separated from the first acoustic wave filter in the first surface;

a ground pattern that is located on the first surface, and is located between the pad and the first acoustic wave filter in the first surface; and

a second acoustic wave filter that is electrically connected to the pad, and at least partially overlaps with the first acoustic wave filter in plan view.

2. The acoustic wave device according to claim 1 , further comprising:

a first signal terminal that is located on a third surface, which is an opposite surface of the first substrate from the first surface, and is electrically connected to the first acoustic wave filter;

a second signal terminal that is located on the third surface, and is electrically connected to the second acoustic wave filter through the pad;

a ground terminal that is located on the third surface, and is electrically connected to the ground pattern; and

a second substrate that is mounted above the first surface of the first substrate, wherein

the second acoustic wave filter is located on a second surface of the second substrate.

3. The acoustic wave device according to claim 2 , wherein

the second substrate is mounted above the first surface so that the second surface faces the first surface across an air gap, and

the second acoustic wave filter and the pad are electrically connected through a bump.

4. The acoustic wave device according to claim 3 , further comprising

a sealing portion that is located on the first substrate so as to surround the first acoustic wave filter, the pad, and the ground pattern, and seals the first acoustic wave filter and the second acoustic wave filter in the air gap.

5. The acoustic wave device according to claim 2 , wherein

the second substrate is mounted above the first surface so that an opposite surface of the second substrate from the second surface faces the first surface.

6. The acoustic wave device according to claim 2 , further comprising:

a first via wiring that penetrates through the first substrate, and electrically connects the first acoustic wave filter and the first signal terminal; and

a second via wiring that penetrates through the first substrate, and electrically connects the pad and the second signal terminal.

7. The acoustic wave device according to claim 1 , further comprising:

a second substrate including a third surface;

a first signal terminal that is located on the third surface, and is electrically connected to the first acoustic wave filter;

a second signal terminal that is located on the third surface, and is electrically connected to the second acoustic wave filter through the pad; and

a ground terminal that is located on the third surface, and is electrically connected to the ground pattern, wherein

the first substrate is mounted above the second substrate, and

the second acoustic wave filter is located on a second surface that is an opposite surface of the first substrate from the first surface.

8. The acoustic wave device according to claim 7 , wherein

the first substrate is mounted above the second substrate so that the first surface faces an opposite surface of the second substrate from the third surface.

9. The acoustic wave device according to claim 1 , wherein

the ground pattern surrounds the pad on the first surface.

10. The acoustic wave device according to claim 1 , wherein

the ground pattern electrically separates from the first acoustic wave filter on the first surface.

11. The acoustic wave device according to claim 2 , wherein

one of the first acoustic wave filter and the second acoustic wave filter is a transmit filter connected between a common terminal and a transmit terminal,

another one of the first acoustic wave filter and the second acoustic wave filter is a receive filter connected between the common terminal and a receive terminal,

the first signal terminal is one of the transmit terminal and the receive terminal, and

the second signal terminal is another one of the transmit terminal and the receive terminal.

12. The acoustic wave device according to claim 1 , wherein

the first acoustic wave filter and the second acoustic wave filter have different passbands.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2017
From: KUROYANAGI, TAKUMA
To: TAIYO YUDEN CO., LTD.
Reel/Frame 041533/0077 →
Priority Claims (1)
JP 2016-097206 · May 13, 2016 · national
Continuity (1)
Related Publication 20170331455A1 · Nov 16, 2017
Cited By (21)
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