Semiconductor package
A semiconductor package includes a die pad, a semiconductor die mounted on the die pad, rows of terminal leads disposed around the die pad; a surface mount device (SMD) mounted and bonded with a bond wire in the semiconductor package; and a molding compound encapsulating the semiconductor die and the SMD, the bond wire, and at least partially encapsulating the die pad and the terminal leads. The SMD may be mounted in the semiconductor package by using a non-conductive paste or a conductive paste. The die pad, the tie bars and the terminal leads are coplanar.
1. A semiconductor package, comprising:
a die pad having a top surface and a bottom surface;
a semiconductor die mounted on the top surface of the die pad;
rows of terminal leads having a top surface and a bottom surface disposed around the die pad;
a ground bar disposed between the terminal leads and the die pad;
a plurality of tie bars connecting the ground bar with the die pad;
a surface mount device (SMD) comprising a first terminal and a second terminal mounted in the semiconductor package, wherein a first bond wire is bonded to the first terminal or the second terminal; and
a molding compound encapsulating the semiconductor die and the SMD, and at least partially encapsulating the die pad and the terminal leads, wherein the bottom surfaces of the die pad and the terminal leads are exposed outside the semiconductor package.
2. The semiconductor package according to claim 1 , wherein each of the tie bars is half-etched or partially etched so as to form a notch.
3. The semiconductor package according to claim 1 , wherein the SMD is disposed between the die pad and the terminal leads.
4. The semiconductor package according to claim 1 , wherein the SMD is mounted on the die pad.
5. The semiconductor package according to claim 1 , wherein the SMD is mounted on the terminal leads.
6. The semiconductor package according to claim 1 , wherein the SMD is mounted on the semiconductor die.
7. The semiconductor package according to claim 1 , wherein a second bond wire is bonded to the first terminal or the second terminal.
8. The semiconductor package according to claim 7 , wherein the first terminal and the second terminal of the SMD are plated with noble metal comprising gold (Au), silver (Ag), platinum (Pt), tin (Sn), or palladium (Pd).
9. The semiconductor package according to claim 1 , wherein the SMD comprises a resistor, an inductor, a capacitor, an RLC (resistor-inductor-capacitor) device, an ESD (electrostatic discharge) device, an IPD (integrated passive device), or a crystal oscillator device.
10. The semiconductor package according to claim 1 further comprising:
a power bar disposed between the terminal leads and the die pad or between the ground bar and the terminal leads.
11. The semiconductor package according to claim 10 , wherein the SMD is mounted between the die pad and the power bar or mounted between the ground bar and the power bar.
12. The semiconductor package according to claim 10 , wherein the first terminal is electrically connected to a ground pad on the semiconductor die, the ground bar, the die pad, or a ground lead of the terminal leads.
13. The semiconductor package according to claim 12 , wherein the second terminal is electrically connected to a power pad on the semiconductor die, the power bar, or a power lead of the terminal leads.
14. The semiconductor package according to claim 10 , wherein the die pad, the ground bar, the power bar and the terminal leads are coplanar.
15. A semiconductor package, comprising:
a die pad having a top surface and a bottom surface;
a semiconductor die mounted on the top surface of the die pad;
rows of terminal leads having a top surface and a bottom surface disposed around the die pad;
a surface mount device (SMD) mounted on at least one of the terminal leads, wherein the terminal lead is bonded with a bond wire in the semiconductor package;
a ground bar disposed between the terminal leads and the die pad;
a plurality of tie bars connecting the ground bar with the die pad; and
a molding compound encapsulating the semiconductor die and the SMD, and at least partially encapsulating the die pad and the terminal leads, wherein the bottom surface of the die pad and terminal leads are exposed outside the semiconductor package.
16. The semiconductor package according to claim 15 , wherein each of the tie bars is half-etched or partially etched so as to form a notch.
17. The semiconductor package according to claim 15 further comprising:
a power bar disposed between the terminal leads and the die pad or between the ground bar and the terminal leads.
18. The semiconductor package according to claim 17 , wherein the die pad, the ground bar, the power bar and the terminal leads are coplanar.
19. The semiconductor package according to claim 15 , wherein the SMD is mounted between the die pad and the terminal lead or mounted between the ground bar and the terminal lead.
20. The semiconductor package according to claim 15 , wherein the SMD comprises a first terminal and a second terminal, and a second bond wire is bonded to the first terminal or the second terminal.
21. The semiconductor package according to claim 20 , wherein the first terminal is electrically connected to a ground pad on the semiconductor die, the ground bar, the die pad, or a ground lead of the terminal leads.
22. The semiconductor package according to claim 20 , wherein the second terminal is electrically connected to a power pad on the semiconductor die, the power bar, or a power lead of the terminal leads.
23. The semiconductor package according to claim 15 , wherein the SMD comprises a resistor, an inductor, a capacitor, an RLC (resistor-inductor-capacitor) device, an ESD (electrostatic discharge) device, an IPD (integrated passive device), or a crystal oscillator device.