Three-dimensional memory device having discrete direct source strap contacts and method of making thereof
A planar material layer stack including a lower etch stop dielectric layer, a sacrificial semiconductor layer, and an upper etch stop dielectric layer is formed over a source semiconductor layer on a substrate. An alternating stack of insulating layers and spacer material layers is formed. The spacer material layers are formed as, or are subsequently replaced with, electrically conductive layers. An array of memory stack structures is formed. A source cavity is formed by removing the sacrificial semiconductor layer and portions of the memory films. Source strap structures are formed by a selective semiconductor deposition process on the vertical semiconductor channels and the source semiconductor layer. A dielectric fill material layer fills a remaining volume of the source cavity.
1. A three-dimensional memory device comprising:
a source semiconductor layer comprising a doped semiconductor material and located over a substrate;
a dielectric material layer stack overlying the source semiconductor layer and comprising, from bottom to top, a lower dielectric layer, a dielectric fill material layer, and an upper dielectric layer;
an alternating stack of electrically conductive layers and insulating layers located over the dielectric material layer stack;
an array of memory stack structures that extend through the alternating stack and into an upper portion of the source semiconductor layer, each memory stack structure including a vertical semiconductor channel and a memory film laterally surrounding the vertical semiconductor channel, wherein a bottom end of each memory film terminates above a horizontal plane including a top surface of the upper dielectric layer; and
discrete source strap structures, wherein each of the discrete source strap structures contacts, and laterally surrounds, a respective one of the vertical semiconductor channels of the memory stack structures and contacts the source semiconductor layer.
2. The three-dimensional memory device of claim 1 , wherein the discrete source strap structures are physically spaced from one another by the dielectric fill material layer.
3. The three-dimensional memory device of claim 1 , wherein each of the discrete source strap structures has a greater lateral thickness at a level of the dielectric fill material layer than at levels of the upper dielectric layer and the lower dielectric layer.
4. The three-dimensional memory device of claim 1 , wherein:
each of the memory films has a lateral thickness that is defined between an outer sidewall and a most proximal portion of an inner sidewall; and
a lateral separation distance between each of the vertical semiconductor channels and each of the upper and lower dielectric layers is the same as the lateral thickness of each of the memory films.
5. The three-dimensional memory device of claim 1 , wherein the dielectric fill material layer laterally surrounds, and directly contacts, an outer sidewall of each of the discrete source strap structures.
6. The three-dimensional memory device of claim 1 , wherein:
the upper and lower dielectric layers comprise a dielectric metal oxide; and
the dielectric fill material layer comprises silicon oxide.
7. The three-dimensional memory device of claim 1 , wherein:
the dielectric material layer stack further comprises a lower silicon oxide layer located underneath the lower dielectric layer and an upper silicon oxide layer located over the upper dielectric layer; and
the lower silicon oxide layer is laterally spaced farther from each of the vertical semiconductor channels than a minimum separation distance between the lower dielectric layer and the vertical semiconductor channels.
8. The three-dimensional memory device of claim 1 , further comprising memory material cap portions that underlie, and contact, each of the discrete source strap structures, wherein the memory material cap portions are embedded within the source semiconductor layer.
9. The three-dimensional memory device of claim 8 , wherein each of the memory films comprises a stack including, from one side to another, a blocking dielectric layer, a charge storage layer, and a tunneling dielectric layer.
10. The three-dimensional memory device of claim 1 , further comprising:
a dielectric wall structure vertically extending through the alternating stack and including a convex bottom surface that contacts a concave top surface of the dielectric fill material layer; and
a source select electrode that comprises a doped semiconductor layer located between the alternating stack and the dielectric material layer stack, and laterally surrounding each of the memory stack structures.
11. The three-dimensional memory device of claim 1 , wherein:
the three-dimensional memory device comprises a monolithic three-dimensional NAND memory device;
the electrically conductive layers comprise, or are electrically connected to, a respective word line of the monolithic three-dimensional NAND memory device;
the substrate comprises a silicon substrate;
the monolithic three-dimensional NAND memory device comprises an array of monolithic three-dimensional NAND strings over the silicon substrate;
at least one memory cell in a first device level of the array of monolithic three-dimensional NAND strings is located over another memory cell in a second device level of the array of monolithic three-dimensional NAND strings; and
the silicon substrate contains a peripheral device region comprising an integrated circuit comprising a driver circuit for the memory device located thereon.
12. The three-dimensional memory device of claim 1 , wherein the discrete source strap structures do not directly contact one another.
13. The three-dimensional memory device of claim 12 , wherein each of the discrete source structures contacts a different one of the vertical semiconductor channels.