Method for manufacturing semiconductor device
It is an object to provide a highly reliable semiconductor device which includes a thin film transistor having stable electric characteristics. It is another object to manufacture a highly reliable semiconductor device at lower cost with high productivity. In a method for manufacturing a semiconductor device which includes a thin film transistor where a semiconductor layer having a channel formation region, a source region, and a drain region are formed using an oxide semiconductor layer, heat treatment (heat treatment for dehydration or dehydrogenation) is performed so as to improve the purity of the oxide semiconductor layer and reduce impurities such as moisture. Moreover, the oxide semiconductor layer subjected to the heat treatment is slowly cooled under an oxygen atmosphere.
1. A semiconductor device comprising:
a first conductive film over a substrate;
a first insulating film over the first conductive film;
a first oxide semiconductor film over the first insulating film;
a second oxide semiconductor film over the first oxide semiconductor film;
a second conductive film and a third conductive film over the first oxide semiconductor film and the second oxide semiconductor film;
an oxide insulating film over the second conductive film and the third conductive film; and
a fourth conductive film over the oxide insulating film,
wherein the oxide insulating film is in contact with part of the first oxide semiconductor film and part of the second oxide semiconductor film,
wherein the fourth conductive film overlaps the first conductive film, the first oxide semiconductor film and the second oxide semiconductor film, and
wherein the first conductive film and the fourth conductive film are configured to be supplied with a same potential.
2. The semiconductor device according to claim 1 ,
wherein the first oxide semiconductor film comprises a region which has a carrier density of less than 1×10 18 /cm 3 .
3. The semiconductor device according to claim 1 ,
wherein the second oxide semiconductor film comprises a nanocrystal.
4. The semiconductor device according to claim 1 ,
wherein each of the second conductive film and the third conductive film has a stacked structure comprising a film containing copper.
5. The semiconductor device according to claim 1 ,
wherein the fourth conductive film comprises a transparent conductive film.
6. The semiconductor device according to claim 1 ,
wherein the first oxide semiconductor film is thicker than the second oxide semiconductor film.
7. The semiconductor device according to claim 1 ,
wherein at least one of the first oxide semiconductor film and the second oxide semiconductor film comprises indium, gallium, and zinc.
8. The semiconductor device according to claim 1 ,
wherein at least one of the first oxide semiconductor film and the second oxide semiconductor film comprises indium, tin, and zinc.
9. The semiconductor device according to claim 1 ,
wherein at least one of the first oxide semiconductor film and the second oxide semiconductor film comprises indium, aluminum, and zinc.
10. The semiconductor device according to claim 1 ,
wherein at least one of the first oxide semiconductor film and the second oxide semiconductor film comprises tin and zinc.
11. The semiconductor device according to claim 1 ,
wherein at least one of the first oxide semiconductor film and the second oxide semiconductor film comprises tin, gallium, and zinc.
12. The semiconductor device according to claim 1 ,
wherein at least one of the first oxide semiconductor film and the second oxide semiconductor film comprises tin, aluminum, and zinc.
13. An electronic device comprising the semiconductor device according to claim 1 .