Method of manufacturing rigid-flexible printed circuit board
A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.
1. A multilayer rigid flexible printed circuit board having a rigid portion and a flexible portion, the multilayer rigid flexible printed circuit board comprising:
a first flexible film including a first circuit pattern on one or both surfaces;
a second flexible film disposed on the first flexible film and including a second circuit pattern on a portion of the second flexible film, positioned in the rigid portion;
a bonding sheet between the first flexible film and the second flexible film;
a pattern stack disposed on a part of the portion of the second flexible film to be adjacent to the flexible portion, and having a metal pattern and a protective pattern on the metal pattern;
a first insulating layer disposed on the portion of the second flexible film and covering the pattern stack and including a third circuit pattern on the first insulating layer.
2. The multilayer rigid flexible printed circuit board according to claim 1 , wherein the metal pattern includes substantially the same material as that of the second circuit pattern.
3. The multilayer rigid flexible printed circuit board according to claim 1 , wherein the metal pattern and the second circuit pattern include a metal-plating layer.
4. The multilayer rigid flexible printed circuit board according to claim 1 , wherein the metal pattern is exposed on a side surface of the rigid portion facing the flexible portion.
5. The multilayer rigid flexible printed circuit board according to claim 1 , wherein the multilayer rigid flexible printed circuit board has a thickness of the rigid portion being greater than that of the flexible portion thereof.
6. The multilayer rigid flexible printed circuit board according to claim 1 , wherein the bonding sheet includes at least one of an epoxy thermosetting resin and a prepreg material.
7. The multilayer rigid flexible printed circuit board according to claim 1 , further comprising a bonding material layer between the second flexible film and the protective pattern.
8. The multilayer rigid flexible printed circuit board according to claim 1 , wherein the protective pattern comprises a polymer material.
9. The multilayer rigid flexible printed circuit board according to claim 8 , wherein the protective pattern comprises an adhesive material including polyimide.
10. The multilayer rigid flexible printed circuit board according to claim 1 , wherein the second flexible film is disposed on an entire area of the first flexible film.
11. The multilayer rigid flexible printed circuit board according to claim 1 , wherein the first insulating layer is disposed in contact with the protective pattern of the pattern stack.
12. The multilayer rigid flexible printed circuit board according to claim 1 , wherein the second flexible film is disposed in contact with the metal pattern of the pattern stack.
13. The multilayer rigid flexible printed circuit board according to claim 1 , wherein the metal pattern is physically isolated from the second circuit pattern.
14. The multilayer rigid flexible printed circuit board according to claim 1 , further comprising a through hole penetrating the first flexible film and the second flexible film and a plating layer disposed on an inner wall of the through hole.
15. A multilayer rigid flexible printed circuit board having a rigid portion and a flexible portion, the multilayer rigid flexible printed circuit board comprising:
a first flexible film having upper and lower surfaces and including a first circuit pattern on at least one of the upper and lower surfaces;
second upper and lower flexible films disposed on the upper and lower surfaces of the first flexible film, respectively, each of the second upper and lower flexible films including a second circuit pattern on portions of the second upper and lower flexible films, positioned in the rigid portion;
first and second bonding sheets disposed between the first flexible film and the second upper flexible film, and between the first flexible film and the second lower flexible film, respectively;
first and second pattern stacks disposed on parts of the portions of the second upper and lower flexible films to be adjacent to the flexible portion, respectively, each of the first and second pattern stacks having a metal pattern and a protective pattern on the metal pattern;
first and second insulating layers disposed on the portions of the second upper and lower flexible film to cover the first and second pattern stacks, respectively; and
a third circuit pattern disposed on each of the first and second insulating layers.
16. The multilayer rigid flexible printed circuit board according to claim 15 , wherein the metal pattern includes substantially the same material as that of the second circuit pattern.
17. The multilayer rigid flexible printed circuit board according to claim 16 , wherein the metal pattern and the second circuit pattern include a metal-plating layer.
18. The multilayer rigid flexible printed circuit board according to claim 15 , wherein the metal pattern is exposed on a side surface of the rigid portion facing the flexible portion.
19. The multilayer rigid flexible printed circuit board according to claim 15 , wherein the protective pattern comprises an adhesive material including polyimide.
20. The multilayer rigid flexible printed circuit board according to claim 15 , further comprising a third insulating layer disposed on at least one of the first and second insulating layers and including a fourth circuit pattern on the third insulating layer.