IP Library › Granted Patent US 10,325,650
Granted Patent B2
US 10,325,650 · App. 16/057,113 · Granted Jun 18, 2019

Semiconductor storage device

Inventor: Yuichiro Ishii (Tokyo, JP)
Assignee: RENESAS ELECTRONICS CORPORATION
G11C11/419G11C5/148G11C7/12G11C2207/2227
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Quick Facts
Patent No.
US 10,325,650
App. No.
16/057,113
Granted
Jun 18, 2019
Kind
B2
Abstract

A semiconductor storage device includes an SRAM memory cell composed of a drive transistor, a transfer transistor and a load transistor, an I/O circuit that is connected to bit lines connected to the memory cell, and an operating mode control circuit that switches an operating mode of the I/O circuit between a resume standby mode and a normal operation mode, wherein the I/O circuit includes a write driver that writes data to bit lines, a sense amplifier that reads data from the bit lines, a first switch inserted between the bit lines and the write driver, a second switch inserted between the bit lines and the sense amplifier, a precharge circuit that precharges the bit lines, and a control circuit that controls the first and second switches and the precharge circuit according to a signal from the operating mode control circuit.

Claims (32)

1. A semiconductor device comprising:

a memory cell;

a pair of bit lines electrically coupled with the memory cell;

a word line extending in a direction crossing the pair of bit lines, and electrically coupled with the memory cell;

a precharge circuit electrically coupled with the memory cell via the pair of bit lines;

and

an operating mode control circuit electrically coupled with the precharge circuit via a precharge power supply line,

wherein the operating mode control circuit receives a first control signal and outputs a second control signal to the precharge circuit,

wherein the operating mode control circuit outputs a first potential to the precharge power supply line in a first mode that is set by the first control signal, and outputs a second potential lower than the first potential in a second mode that is set by the first control signal, and

wherein the precharge circuit comprises:

a first MOS transistor having a first source coupled with the precharge power supply line, a first drain coupled with one bit line of the pair of bit lines, and a first gate controlled by the second control signal, and

a second MOS transistor having a second source coupled with the precharge power supply line, a second drain coupled with the other bit line of the pair of bit lines, and a second gate controlled by the second control signal.

2. The semiconductor device of claim 1 , wherein the operating mode control circuit comprises:

a delay circuit which receives the first control signal and outputs a third control signal;

a third MOS transistor having a third gate and a third source both supplied with the first potential, and a third drain coupled with the precharge power supply line; and

a fourth MOS transistor having a fourth gate to receive the third control signal, a fourth source supplied with the first potential, and a fourth drain coupled with the precharge power supply line.

3. The semiconductor device of claim 2 , wherein the delay circuit comprises a plurality of buffers.

4. The semiconductor device of claim 1 , wherein the memory cells comprises:

a flip-flop having a first storage node, a second storage node, a first CMOS inverter having an output coupled to the first storage node and an input coupled to the second storage node, and a second CMOS inverter having an output coupled to the second storage node and an input coupled to the first storage node, the first CMOS inverter including a first load PMOS transistor and a first drive NMOS transistor, the second CMOS inverter including a second load PMOS transistor and a second drive NMOS transistor;

a first transfer NMOS transistor having a source-drain path coupled between the first storage node and the one bit line of the pair of bit lines and having a gate coupled to the word line, and

a second transfer NMOS transistor having a source-drain path coupled between the second storage node and the other bit line of the pair of bit lines and having a gate coupled to the word line,

wherein the first and second load PMOS transistors are supplied with the first potential.

5. The semiconductor device of claim 1 , comprising an I/O circuit connected to the pair of bit lines, wherein the I/O circuit comprises:

the precharge circuit;

a write driver coupled with the pair of bit lines via a first switch; and

a sense amplifier coupled with the pair of bit lines via a second switch.

6. The semiconductor device of claim 5 , wherein the I/O circuit comprises an I/O control circuit that outputs a third control signal.

7. The semiconductor device of claim 6 , wherein the I/O control circuit comprises a first inverter that outputs the third control signal.

8. The semiconductor device of claim 2 ,

wherein the third control signal is a high level in the second mode, and

wherein the third control signal is a low level in the first mode.

9. The semiconductor device of claim 1 , wherein the first mode is a normal operation mode, and the second mode is a resume standby mode.

Priority Claims (1)
JP 2014-040521 · Mar 3, 2014 · national
Continuity (6)
Continuation 15894757 · Feb 12, 2018
Continuation 15619821 · Jun 12, 2017
Continuation 15181175 · Jun 13, 2016
Continuation 14942861 · Nov 16, 2015
Continuation 14634743 · Feb 28, 2015
Related Publication 20180342292A1 · Nov 29, 2018