Source and drain epitaxial semiconductor material integration for high voltage semiconductor devices
A method of forming a semiconductor device that includes providing a first set of fin structures having a first pitch, and a second set of fin structure having a second pitch, wherein the second pitch is greater than the first pitch. An epitaxial semiconductor material on the first and second set of fin structures. The epitaxial semiconductor material on the first fin structures is merging epitaxial material and the epitaxial material on the second fin structures is non-merging epitaxial material. A dielectric liner is formed atop the epitaxial semiconductor material that is present on the first and second sets of fin structures. The dielectric liner is removed from a portion of the non-merging epitaxial material that is present on the second set of fin structures. A bridging epitaxial semiconductor material is formed on exposed surfaces of the non-merging epitaxial material.
1. A semiconductor device comprising:
a substrate having a first region and a second region;
a first plurality of Fin Field Effect Transistors (FinFETs) are present in a first region of the substrate, the first plurality of Fin Field Effect Transistors including a first set of fin structures having a first pitch, and merged epitaxial semiconductor material of a single composition on source and drain region portions of the first set of fin structures; and
a second plurality of Fin Field Effect Transistors (FinFETs) is present in the second region of the substrate, the second plurality of FinFETs include a second set of fin structures having a second pitch that is greater than the first pitch of the first set of fin structures, wherein the second plurality of FinFETs include a composite epitaxial semiconductor material on the source and drain region portions of the second set of fin structures, the composite epitaxial semiconductor material includes a first non-merged portion, and a second bridging portion extending into contact between adjacent fin structures in the second set of fin structures, the second bridging portion having a planar upper surface that extends above an upper surface of the second set of fin structures, and planar sidewalls that are perpendicular to the planar upper surface, wherein the perpendicular relationship of the planar sidewalls and the planar upper surface extends to an edge interface of the planar sidewalls and the planar upper surface.
2. The semiconductor device of claim 1 , wherein the composite epitaxial semiconductor material includes at least two different semiconductor compositions.
3. The semiconductor device of claim 1 , wherein the second plurality of Fin Field Effect Transistors (FinFETs) comprises a second gate structure comprising a second gate dielectric of deposited silicon oxide layer and a hafnium oxide layer.
4. The semiconductor device of claim 3 , wherein the first plurality of Fin Field Effect Transistors (FinFETs) comprises a first gate structure to the first set of fin structures comprises a first gate dielectric of interfacial oxide and a deposited hafnium oxide layer.
5. The semiconductor device of claim 1 , wherein the first plurality of the Field Effect Transistors (FinFETs) have a first applied voltage of 1.2 V or less.
6. The semiconductor device of claim 1 , wherein the second plurality of the Field Effect Transistors (FinFETs) have a second applied voltage of more than 1.2V.
7. The semiconductor device of claim 1 , wherein the first set of fin structures and the second set of fin structures are comprised of a type IV semiconductor.
8. A semiconductor device comprising:
a substrate having a first region and a second region;
a first plurality of Fin Field Effect Transistors (FinFETs) are present in a first region of the substrate, the first plurality of Fin Field Effect Transistors including a first set of fin structures having a first pitch, and merged epitaxial semiconductor material of a single composition on source and drain region portions of the first set of fin structures; and
a second plurality of Fin Field Effect Transistors (FinFETs) is present in the second region of the substrate, the second plurality of FinFETs include a second set of fin structures having a second pitch that is at least 1.5× greater than the first pitch of the first set of fin structures, wherein the second plurality of FinFETs include a composite epitaxial semiconductor material on the source and drain region portions of the second set of fin structures, the composite epitaxial semiconductor material includes a first non-merged portion, and a second bridging portion extending into contact between adjacent fin structures in the second set of fin structures, the second bridging portion having a planar upper surface that extends above an upper surface of the second set of fin structures, and planar sidewalls that are perpendicular to the planar upper surface, wherein the perpendicular relationship of the planar sidewalls and the planar upper surface extends to an edge interface of the planar sidewalls and the planar upper surface.
9. The semiconductor device of claim 8 , wherein the composite epitaxial semiconductor material includes at least two different semiconductor compositions.
10. The semiconductor device of claim 8 , wherein the second plurality of Fin Field Effect Transistors (FinFETs) comprises a second gate structure comprising a second gate dielectric of deposited silicon oxide layer and a hafnium oxide layer.
11. The semiconductor device of claim 10 , wherein the first plurality of Fin Field Effect Transistors (FinFETs) comprises a first gate structure to the first set of fin structures comprises a first gate dielectric of interfacial oxide and a deposited hafnium oxide layer.
12. The semiconductor device of claim 8 , wherein the first plurality of the Field Effect Transistors (FinFETs) have a first applied voltage of 1.2 V or less.
13. The semiconductor device of claim 8 , wherein the second plurality of the Field Effect Transistors (FinFETs) have a second applied voltage of more than 1.2V.
14. The semiconductor device of claim 8 , wherein the first set of fin structures and the second set of fin structures are comprised of a type IV semiconductor.
15. A semiconductor device comprising:
a substrate having a first region and a second region;
a first plurality of Fin Field Effect Transistors (FinFETs) are present in a first region of the substrate, the first plurality of Fin Field Effect Transistors including a first set of fin structures having a first pitch, and merged epitaxial semiconductor material of a single composition on source and drain region portions of the first set of fin structures, wherein the first plurality of the Field Effect Transistors (FinFETs) have a first applied voltage of 1.2 V or less; and
a second plurality of Fin Field Effect Transistors (FinFETs) is present in the second region of the substrate, the second plurality of FinFETs include a second set of fin structures having a second pitch that is at least 1.5× greater than the first pitch of the first set of fin structures, wherein the second plurality of FinFETs include a composite epitaxial semiconductor material on the source and drain region portions of the second set of fin structures, the composite epitaxial semiconductor material includes a first non-merged portion, and a second bridging portion extending into contact between adjacent fin structures in the second set of fin structures, the second bridging portion having a planar upper surface that extends above an upper surface of the second set of fin structures, and planar sidewalls that are perpendicular to the planar upper surface, the perpendicular relationship of the planar sidewalls and the planar upper surface extends to an edge interface of the planar sidewalls and the planar upper surface, wherein the second plurality of the Field Effect Transistors (FinFETs) have a second applied voltage of more than 1.2V.
16. The semiconductor device of claim 15 , wherein the composite epitaxial semiconductor material includes at least two different semiconductor compositions.
17. The semiconductor device of claim 15 , wherein the second plurality of Fin Field Effect Transistors (FinFETs) comprises a second gate structure comprising a second gate dielectric of deposited silicon oxide layer and a hafnium oxide layer.
18. The semiconductor device of claim 17 , wherein the first plurality of Fin Field Effect Transistors (FinFETs) comprises a first gate structure to the first set of fin structures comprises a first gate dielectric of interfacial oxide and a deposited hafnium oxide layer.
19. The semiconductor device of claim 15 , wherein the first set of fin structures and the second set of fin structures are comprised of a type IV semiconductor.
20. The semiconductor device of claim 15 , wherein each fin structure in the first set of fin structures and the second set of fin structures has a width of 20 nm or less.