Methods of forming source/drain contact structures on integrated circuit products

1. A method, comprising:

forming a plurality of transistor devices on a semiconductor substrate, each of said transistor devices comprising a sacrificial gate structure, a gate cap, source/drain regions, source/drain epitaxial semiconductor material in said source/drain regions, a contact etch stop layer positioned above said source/drain epitaxial semiconductor material and an insulating material positioned above said contact etch stop layer;

forming a plurality of contact isolation cavities by performing at least one etching process sequence, wherein said etching process sequence is adapted to sequentially remove said insulating material, said contact etch stop layer and said source/drain epitaxial semiconductor material;

forming a contact isolation structure in each of said contact isolation cavities;

after forming said contact isolation structures, removing said sacrificial gate structures so as to form a plurality of replacement gate cavities; and

forming a final gate structure in each of said plurality of replacement gate cavities.

2. The method of claim 1 , further comprising:

removing portions of said insulating material and said contact etch stop layer to expose said source/drain epitaxial semiconductor material in said source/drain regions and thereby form source/drain contact openings that are bounded in at least one direction by a plurality of said contact isolation structures; and

forming a conductive source/drain metallization structure in said source/drain contact openings.

3. The method of claim 1 , wherein said contact isolation structures are comprised of a material that is different than said insulating material such that said insulating material is selectively removable relative to said contact isolation structures by etching.

4. The method of claim 1 , wherein performing said etching process sequence comprises:

performing a first etching process that is adapted to remove said insulating material selectively relative to said contact etch stop layer;

performing a second etching process that is adapted to remove said contact etch stop layer selectively relative to said source/drain epitaxial semiconductor material and said insulating material; and

performing a third etching process that is adapted to remove said source/drain epitaxial semiconductor material selectively relative to said insulating material and said contact etch stop layer.

5. The method of claim 1 , wherein said transistor devices are FinFET devices.

6. The method of claim 1 , further comprising;

forming a gate-cut patterned etch mask above said transistor devices;

forming a plurality of etching processes through said gate-cut patterned etch mask to remove exposed portions of said gate caps and a portion of an axial length of each of said sacrificial gate structures so as to form a plurality of gate-cut cavities that are laterally bounded by a sidewall spacer formed adjacent each of said gate structures; and

forming a gate-cut isolation structure in each of said gate-cut cavities at the same time as said contact isolation structures are formed in said contact isolation cavities.

7. The method of claim 6 , wherein said gate-cut cavities are formed prior to the formation of said contact isolation cavities.

8. The method of claim 2 , wherein said conductive source/drain metallization structures are bounded in at least one direction by said plurality of said contact isolation structures.

9. The method of claim 4 , wherein said first etching process is an anisotropic etching process, said second etching process is an anisotropic etching process and said third etching process is an isotropic etching process.

10. The method of claim 1 , wherein forming said plurality of contact isolation cavities comprises performing said etching process sequence multiple times.

11. The method of claim 1 , wherein said sacrificial gate structure comprises a sacrificial gate insulation layer and a sacrificial gate electrode, said sacrificial gate electrode comprising one of polysilicon or amorphous silicon.

12. The method of claim 1 , wherein forming said plurality of contact isolation cavities comprises:

sequentially forming a plurality of patterned etch masks above said transistor devices; and

after forming each of said patterned etch masks, performing said etching process sequence through said patterned etch masks.

13. A method, comprising:

forming a plurality of transistor devices on a semiconductor substrate, each of said transistor devices comprising a sacrificial gate structure, a gate cap, source/drain regions, source/drain epitaxial semiconductor material in said source/drain regions, a contact etch stop layer positioned above said source/drain epitaxial semiconductor material and an insulating material positioned above said contact etch stop layer;

sequentially forming a plurality of patterned etch masks above said transistor devices;

after forming each of said patterned etch masks, performing an etching process sequence through said patterned etch masks, wherein said etching process sequence is adapted to sequentially remove said insulating material, said contact etch stop layer and said source/drain epitaxial semiconductor material so as to form a plurality of contact isolation cavities;

forming a contact isolation structure in each of said plurality of contact isolation cavities;

after forming said contact isolation structures, removing said sacrificial gate structures so as to form a plurality of replacement gate cavities; and

forming a final gate structure in each of said plurality of replacement gate cavities.

14. The method of claim 13 , further comprising:

removing portions of said insulating material and said contact etch stop layer to expose said source/drain epitaxial semiconductor material in said source/drain regions and thereby form source/drain contact openings that are bounded in at least one direction by a plurality of said contact isolation structures; and

forming a conductive source/drain metallization structure in said source/drain contact openings.

15. The method of claim 13 , wherein said contact isolation structures are comprised of a material that is different than said insulating material such that said insulating material is adapted to be selectively removed relative to said contact isolation structures by etching.

16. The method of claim 14 , wherein sequentially forming said plurality of patterned etch masks above said transistor devices comprises sequentially forming at least three patterned etch masks above said transistor devices and wherein the method comprises performing said etching process sequence at least three times.

17. The method of claim 13 , further comprising:

forming a gate-cut patterned etch mask above said transistor devices;

forming a plurality of etching processes through said gate-cut patterned etch mask to remove exposed portions of said gate caps and a portion of an axial length of each of said sacrificial gate structures so as to form a plurality of gate-cut cavities that are laterally bounded by a sidewall spacer formed adjacent each of said sacrificial gate structures; and

forming a gate-cut isolation structure in each of said gate-cut cavities at the same time as said contact isolation structures are formed in said contact isolation cavities.

18. The method of claim 17 , wherein said gate-cut cavities are formed prior to the formation of said contact isolation cavities.

19. A method, comprising:

forming a plurality of transistor devices on a semiconductor substrate, each of said transistor devices comprising a sacrificial gate structure, a gate cap, source/drain regions, source/drain epitaxial semiconductor material in said source/drain regions, a contact etch stop layer positioned above said source/drain epitaxial semiconductor material and an insulating material positioned above said contact etch stop layer;

forming a patterned etch mask above said transistor devices;

after forming said patterned etch mask, performing an etching process sequence through said patterned etch mask, wherein said etching process sequence is adapted to sequentially remove said insulating material, said contact etch stop layer and said source/drain epitaxial semiconductor material so as to form a plurality of contact isolation cavities;

forming a contact isolation structure in each of said plurality of contact isolation cavities;

after forming said contact isolation structures, removing said sacrificial gate structures so as to form a plurality of replacement gate cavities; and

forming a final gate structure in each of said plurality of replacement gate cavities.

20. The method of claim 19 , further comprising:

forming a gate-cut patterned etch mask above said transistor devices;

forming a plurality of etching processes through said gate-cut patterned etch mask to remove exposed portions of said gate caps and a portion of an axial length of each of said sacrificial gate structures so as to form a plurality of gate-cut cavities that are laterally bounded by a sidewall spacer formed adjacent each of said sacrificial gate structures; and

forming a gate-cut isolation structure in each of said gate-cut cavities at the same time as said contact isolation structures are formed in said contact isolation cavities.