IP Library Granted Patent US 10,374,142
Granted Patent B2
US 10,374,142 · App. 15/041,120 · Granted Aug 6, 2019

Surface acoustic wave device and manufacturing method therefor

Inventors: Daisuke Ajima (Nagaokakyo, JP); Seiji Kai (Nagaokakyo, JP)
Assignee: Murata Manufacturing Co., Ltd.
H01L41/107H01L23/10H01L41/29H03H3/08H03H9/059H01L2224/11H01L2924/0002
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Quick Facts
Patent No.
US 10,374,142
App. No.
15/041,120
Granted
Aug 6, 2019
Kind
B2
Abstract

In a surface acoustic wave device, a conductor pattern is located on a main surface of a piezoelectric substrate and includes a surface acoustic wave element pattern, a pad and a feed line that is electrically connected to the pad and extends up to an outer peripheral edge of the main surface. The piezoelectric substrate and a cover are bonded to each other with a support layer therebetween that includes a frame extending along the outer peripheral edge of the main surface so that a gap is provided between the frame and the outer peripheral edge and includes a pad adjacent portion on the pad. Thus, a closed space is surrounded by the piezoelectric substrate, the cover and the frame. The support layer further includes a reinforcement portion that intersects a feed line at or near an intersection portion in which a separated portion of the frame that is separated from the pad adjacent portion intersects the feed line.

Claims (21)

1. A surface acoustic wave device comprising:

a piezoelectric substrate including a main surface;

a conductor pattern located on the main surface and including a surface acoustic wave element pattern, a pad and a feed line that is electrically connected to the pad and extends up to an outer peripheral edge of the main surface;

a support layer including a frame that is located on the main surface and has a frame-shaped structure that extends along the outer peripheral edge of the main surface and so that a gap is provided between the frame and the outer peripheral edge, and a pad adjacent portion that is located on the pad;

a cover that is bonded to the support layer and faces the main surface; and

a through conductor that is electrically connected to the pad and is located inside a through hole that penetrates through the pad adjacent portion of the support layer in a direction in which the main surface is viewed in plan; wherein

a closed space is provided and surrounded by the piezoelectric substrate, the cover and the support layer;

the feed line includes a separated feed line that intersects a separated portion of the frame that is separated from the pad adjacent portion; and

the support layer further includes a reinforcement portion that is located on the main surface and intersects the separated feed line close to the separated portion.

2. The surface acoustic wave device according to claim 1 , wherein the reinforcement portion is located on an outer side of the frame; and

a width of the reinforcement portion, which is a dimension in a direction in which the reinforcement portion intersects the separated feed line, progressively becomes larger toward the frame.

3. The surface acoustic wave device according to claim 1 , wherein

the reinforcement portion is located on an outer side of the frame; and

a width of the reinforcement portion, which is a dimension in a direction in which the reinforcement portion intersects the separated feed line, becomes larger in a stepwise manner toward the frame.

4. The surface acoustic wave device according to claim 1 , wherein the reinforcement portion is located outside the frame and is separated from the frame.

5. The surface acoustic wave device according to claim 1 , wherein the reinforcement portion is integrated with the frame on an outer side of the frame.

6. The surface acoustic wave device according to claim 1 , wherein the reinforcement portion includes a plurality of reinforcement portions provided only in portions of the support layer.

7. The surface acoustic wave device according to claim 1 , wherein the reinforcement portion includes a plurality of reinforcement portions integrated with the frame on an outer same of the frame.

8. The surface acoustic wave device according to claim 7 , wherein a width of each of the reinforcement portions, which is a dimension in a direction in which the plurality of reinforcement portions intersect the separated feed line, progressively becomes larger toward the frame.

9. The surface acoustic wave device according to claim 7 , wherein the reinforcement portion is integrated with the frame on an outer same of the frame, and a width of the reinforcement portion, which is a dimension in a direction in which the plurality of reinforcement portions intersect the separated feed line, progressively becomes larger in a stepwise manner toward the frame.

10. The surface acoustic wave device according to claim 7 , wherein the separated feed line is one of a single layer feed line and a two layer feed line.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2016
From: AJIMA, DAISUKE; KAI, SEIJI
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 037706/0721 →
Priority Claims (1)
JP 2013-170116 · Aug 20, 2013 · national
Continuity (2)
Continuation PCTJP2014067228 · Jun 27, 2014
Related Publication 20160163957A1 · Jun 9, 2016
Cited By (2)
US 12,230,556 US 12,237,256