Method of fabricating DRAM
A method of fabricating a DRAM includes providing a substrate. Later, a first mask layer is formed to cover the substrate. The first mask layer includes a hydrogen-containing silicon nitride layer and a silicon oxide layer. The hydrogen-containing silicon nitride layer has the chemical formula: Si x N y H z , wherein x is between 4 and 8, y is between 3.5 and 9.5, and z equals 1. After that, the first mask layer is patterned to form a first patterned mask layer. Next, the substrate is etched by taking the first patterned mask layer as a mask to form a word line trench. Subsequently, the first patterned mask layer is removed entirely. Finally, a word line is formed in the word line trench.
1. A method of fabricating a DRAM, comprising:
providing a substrate; and
forming a first mask layer, wherein the steps of forming the first mask layer comprise:
forming a hydrogen-containing silicon nitride layer to cover the substrate, and forming a silicon oxide layer to cover and contact the hydrogen-containing silicon nitride layer, wherein the hydrogen-containing silicon nitride layer has the chemical formula: Si x N y H z , wherein x is between 4 and 8, y is between 3.5 and 9.5, and z equals 1;
patterning the first mask layer to form a first patterned mask layer;
etching the substrate by taking the first patterned mask layer as a first mask to form a word line trench;
removing the first patterned mask layer entirely; and
forming a word line in the word line trench.
2. The method of fabricating a DRAM of claim 1 , wherein the substrate comprises a semiconductor substrate and a second mask layer covering the semiconductor substrate.
3. The method of fabricating a DRAM of claim 2 , wherein the fabricating steps of the word line comprise:
etching the second mask layer to forma second patterned mask layer by taking the first patterned mask layer as a second mask;
removing the first patterned mask layer;
etching the semiconductor substrate to form the word line trench by taking the second patterned mask layer as a third mask; and
removing the second patterned mask layer.
4. The method of fabricating a DRAM of claim 1 , further comprising:
forming a doping region in the substrate before forming the first mask layer;
forming a capacitor plug to contact the doping region after forming the word line; and
forming a capacitor on the substrate to complete the DRAM after forming the word line, wherein the capacitor electrically connects to the word line through the doping region and the capacitor plug.
5. The method of fabricating a DRAM of claim 1 , wherein the hydrogen-containing silicon nitride layer is formed by a deposition process, and the deposition process comprises:
forming the hydrogen-containing silicon nitride layer by using silane and ammonia as precursors, wherein a flow rate of the silane is between 22.5 and 27.5 SCCM, and a flow rate of the ammonia is between 45 and 55 SCCM.
6. The method of fabricating a DRAM of claim 5 , wherein an operation temperature of the deposition process is between 360 and 440 degrees Celsius, an operation pressure is between 5.4 and 6.6 torrs, and an operation power is between 72 and 88 watts.