Semiconductor device with stacked structure of memory cells over sensing amplifiers, circuit board and electronic device
A semiconductor device with low power consumption or a semiconductor device with a reduced area is provided. The semiconductor device includes a cell array including a first memory cell and a second memory cell; and a sense amplifier circuit including a first sense amplifier and a second sense amplifier. The cell array is over the sense amplifier circuit. The first sense amplifier is electrically connected to the first memory cell through a first wiring BL. The second sense amplifier is electrically connected to the second memory cell through a second wiring BL. The first sense amplifier and the second sense amplifier are electrically connected to a wiring GBL. The sense amplifier circuit is configured to select one of a potential of the first wiring BL and a potential of the second wiring BL and output the selected potential to the wiring GBL.
1. A semiconductor device comprising a memory circuit, the memory circuit comprising:
a cell array comprising a plurality of memory cells; and
a sense amplifier circuit comprising at least first and second sense amplifiers,
wherein a first column of the plurality of memory cells is electrically connected to the first sense amplifier through a first one of a plurality of first bit lines,
wherein a second column of the plurality of memory cells is electrically connected to the first sense amplifier through a first one of a plurality of second bit lines,
wherein the sense amplifier circuit is electrically connected to at least first and second global bit lines,
wherein each of the first and second sense amplifiers comprises a precharge circuit, an amplifier circuit, and a switch circuit,
wherein the number of sense amplifiers included in the sense amplifier circuit is larger than the number of global bit lines included in the semiconductor device,
wherein the cell array is provided over the sense amplifier circuit and the first and second global bit lines, and
wherein the sense amplifier circuit is overlapped with the cell array.
2. The semiconductor device according to claim 1 , wherein the switch circuit in each of the first and second sense amplifiers is electrically connected to the first and second global bit lines.
3. The semiconductor device according to claim 1 ,
wherein the sense amplifier circuit includes a plurality of first transistors, and
wherein each of the plurality of first transistors includes a channel formation region comprising silicon.
4. The semiconductor device according to claim 1 ,
wherein each of the plurality of memory cells comprises a second transistor, and
wherein the second transistor includes a channel formation region comprising an oxide semiconductor.
5. The semiconductor device according to claim 4 ,
wherein each of the plurality of memory cells further comprises a capacitor electrically connected to one of a source and drain of the second transistor, and
wherein the capacitor is provided over the second transistor.
6. The semiconductor device according to claim 4 , wherein the oxide semiconductor includes indium, gallium, and zinc.
7. An electronic device comprising:
the semiconductor device according to claim 1 ; and
at least one of a display portion, a microphone, a speaker, and an operation key.
8. The semiconductor device according to claim 1 , wherein the precharge circuit and the amplifier circuit in the first sense amplifier are electrically connected to the first one of the plurality of first bit lines and the first one of the plurality of second bit lines.
9. A semiconductor device comprising a memory circuit, the memory circuit comprising:
a cell array comprising a plurality of memory cells; and
a sense amplifier circuit comprising at least first and second sense amplifiers,
wherein a first column of the plurality of memory cells is electrically connected to the first sense amplifier through a first one of a plurality of first bit lines,
wherein a second column of the plurality of memory cells is electrically connected to the first sense amplifier through a first one of a plurality of second bit lines,
wherein a third column of the plurality of memory cells is electrically connected to the second sense amplifier through a second one of the plurality of first bit lines,
wherein a fourth column of the plurality of memory cells is electrically connected to the second sense amplifier through a second one of the plurality of second bit lines,
wherein the sense amplifier circuit is electrically connected to at least first and second global bit lines,
wherein each of the first and second sense amplifiers comprises a precharge circuit, an amplifier circuit, and a switch circuit,
wherein the number of sense amplifiers included in the sense amplifier circuit is larger than the number of global bit lines included in the semiconductor device,
wherein the cell array is provided over the sense amplifier circuit and the plurality of first and second global bit lines, and
wherein the sense amplifier circuit is overlapped with the cell array.
10. The semiconductor device according to claim 9 , wherein the switch circuit in each of the first and second sense amplifiers is electrically connected to the first and second global bit lines.
11. The semiconductor device according to claim 9 ,
wherein the sense amplifier circuit includes a plurality of first transistors, and
wherein each of the plurality of first transistors includes a channel formation region comprising silicon.
12. The semiconductor device according to claim 9 ,
wherein each of the plurality of memory cells comprises a second transistor, and
wherein the second transistor includes a channel formation region comprising an oxide semiconductor.
13. The semiconductor device according to claim 12 ,
wherein each of the plurality of memory cells further comprises a capacitor electrically connected to one of a source and drain of the second transistor, and
wherein the capacitor is provided over the second transistor.
14. The semiconductor device according to claim 12 , wherein the oxide semiconductor includes indium, gallium, and zinc.
15. An electronic device comprising:
the semiconductor device according to claim 9 ; and
at least one of a display portion, a microphone, a speaker, and an operation key.
16. The semiconductor device according to claim 9 , wherein the precharge circuit and the amplifier circuit in the first sense amplifier are electrically connected to the first one of the plurality of first bit lines and the first one of the plurality of second bit lines.
17. A semiconductor device comprising a memory circuit, the memory circuit comprising:
a cell array comprising a plurality of memory cells; and
a sense amplifier circuit comprising at least first, second, third, and fourth sense amplifiers,
wherein a first column of the plurality of memory cells is electrically connected to the first sense amplifier through a first one of a plurality of first bit lines,
wherein a second column of the plurality of memory cells is electrically connected to the first sense amplifier through a first one of a plurality of second bit lines,
wherein the sense amplifier circuit is electrically connected to at least first and second global bit lines,
wherein each of the first, second, third, and fourth sense amplifiers comprises a precharge circuit, an amplifier circuit, and a switch circuit,
wherein the number of sense amplifiers included in the sense amplifier circuit is larger than the number of global bit lines included in the semiconductor device,
wherein the cell array is provided over the sense amplifier circuit and the first and second global bit lines, and
wherein the sense amplifier circuit is overlapped with the cell array.
18. The semiconductor device according to claim 17 , wherein the switch circuit in each of the first, second, third, and fourth sense amplifiers is electrically connected to the first and second global bit lines.
19. The semiconductor device according to claim 17 ,
wherein the sense amplifier circuit includes a plurality of first transistors, and
wherein each of the plurality of first transistors includes a channel formation region comprising silicon.
20. The semiconductor device according to claim 17 ,
wherein each of the plurality of memory cells comprises a second transistor, and
wherein the second transistor includes a channel formation region comprising an oxide semiconductor.
21. The semiconductor device according to claim 20 ,
wherein each of the plurality of memory cells further comprises a capacitor electrically connected to one of a source and drain of the second transistor, and
wherein the capacitor is provided over the second transistor.
22. The semiconductor device according to claim 20 , wherein the oxide semiconductor includes indium, gallium, and zinc.
23. An electronic device comprising:
the semiconductor device according to claim 17 ; and
at least one of a display portion, a microphone, a speaker, and an operation key.
24. The semiconductor device according to claim 17 , wherein the precharge circuit and the amplifier circuit in the first sense amplifier are electrically connected to the first one of the plurality of first bit lines and the first one of the plurality of second bit lines.