3D semiconductor device and structure
A 3D semiconductor device, the device including: a first single crystal layer including a plurality of first transistors and a first metal layer, where the first metal layer includes interconnecting the first transistors forming, at least in part a plurality of logic gates; a plurality of second transistors overlaying, at least in part the first single crystal layer; a plurality of third transistors overlaying, at least in part the second transistors; a second metal layer overlaying, at least in part the third transistors; Input/Output pads to provide connection to external devices, a local power grid to distribute power to the logic gates, where the third transistors are aligned to the first transistors with less than 40 nm misalignment, where the first single crystal layer includes a Phase Lock Loop (“PLL”) structure connected to at least one of the Input/Output pads, where a memory cell includes at least one of the third transistors.
1. A 3D semiconductor device, the device comprising:
a first level comprising: (i) a first single crystal layer,
wherein said first single crystal layer includes a plurality of first transistors and (ii) a first metal layer,
wherein said first metal layer comprises interconnections between said first transistors, and
wherein at least a portion of said first transistors form a plurality of logic gates;
a second level comprising a plurality of second transistors,
wherein said second transistors are atop said first metal layer;
a second metal layer overlaying, at least in part said second transistors;
Input/Output pad structures to provide connections to external devices;
a global power grid configured to distribute power to said device,
wherein at least part of said global power grid is disposed above said second metal layer; and
a local power grid configured to distribute power to said plurality of logic gates,
wherein said second transistors are aligned to said first transistors with less than 40 nm misalignment,
wherein said first single crystal layer comprises an electrostatic discharge (“ESD”) structure connected to at least one of said Input/Output pad structures,
wherein said local power grid is disposed underneath said second level,
wherein said global power grid is connected to said local power grid by a plurality of vias,
wherein said global power grid includes a first conductor comprising a first current carrying capacity and said local power grid includes a second conductor comprising a second current carrying capacity,
wherein said first current carrying capacity is at least twice said second current carrying capacity,
wherein at least one of said plurality of vias has a radius of less than 200 nm,
wherein at least one of said second transistors comprises a source, a drain, and a transistor channel,
wherein said source, said drain and said transistor channel comprise a same dopant type,
wherein a memory cell comprises at least one of said second transistors, and
wherein said memory cell is at least partially atop at least one of said logic gates.
2. The 3D semiconductor device according to claim 1 ,
wherein at least a portion of said plurality of vias are configured to remove heat from said second level.
3. The 3D semiconductor device according to claim 1 , further comprising:
a connective path from said second transistors to said first transistors,
wherein said path comprises a through-layer via, and
wherein said through-layer via comprises tungsten.
4. The 3D semiconductor device according to claim 1 ,
wherein said second transistors comprise polysilicon.
5. The 3D semiconductor device according to claim 1 , further comprising:
a first guard ring; and
a second guard ring,
wherein said first guard ring surrounds said plurality of first transistors and said second guard ring surrounds said plurality of second transistors.
6. The 3D semiconductor device according to claim 1 ,
wherein at least one of said second transistors at least partially overlays at least one of said first transistors.
7. A 3D semiconductor device, the device comprising:
a first level comprising: (i) a first single crystal layer
wherein said first single crystal layer includes a plurality of first transistors and (ii) a first metal layer,
wherein said first metal layer comprises interconnections between said first transistors, and
wherein at least a portion of said first transistors form a plurality of logic gates;
a second level comprising a plurality of second transistors,
wherein said second transistors are atop said first metal layer;
a second metal layer overlaying, at least in part said second transistors; and
Input/Output pad structures to provide connections to external devices,
wherein said second transistors are aligned to said first transistors with less than 40 nm misalignment,
wherein said first single crystal layer comprises an electrostatic discharge (“ESD”) structure connected to at least one of said Input/Output pad structures,
wherein at least one of said second transistors comprises a source, a drain, and a transistor channel,
wherein said source, said drain and said transistor channel comprise a same dopant type,
wherein a memory cell comprises at least one of said second transistors,
wherein said local power grid is disposed underneath said second level,
wherein said global power grid is connected to said local power grid by a plurality of vias.
8. The 3D semiconductor device according to claim 7 ,
wherein at least one of said vias has a radius of less than 200 nm.
9. The 3D semiconductor device according to claim 7 , further comprising: further comprising:
a connective path from said second transistors to said first transistors,
wherein said path comprises a through-layer via, and
wherein said through-layer via comprises tungsten.
10. The 3D semiconductor device according to claim 7 ,
wherein said second transistors comprise polysilicon.
11. The 3D semiconductor device according to claim 7 , further comprising:
a Phase Lock Loop (“PLL”) structure connected to at least one of said input/output pad structures.
12. The 3D semiconductor device according to claim 7 ,
wherein at least one of said second transistors at least partially overlays at least one of said first transistors.
13. The 3D semiconductor device according to claim 7 , further comprising:
a connective path from said second transistors to said first transistors,
wherein said path comprises a through-layer via,
wherein said through-layer via contacts to said second transistor source or drain.
14. The 3D semiconductor device according to claim 7 ,
wherein at least a portion of said plurality of vias are configured to remove heat from said second level.
15. A 3D semiconductor device, the device comprising:
a first level comprising: (i) a first single crystal layer,
wherein said first single crystal layer includes a plurality of first transistors and iii) a first metal layer,
wherein said first metal layer comprises interconnections between said first transistors, and
wherein at least a portion of said first transistors form a plurality of logic gates;
a second level comprising a plurality of second transistors,
wherein said second transistors are atop said first metal layer;
a second metal layer overlaying, at least in part said second transistors; and
Input/Output pad structures to provide connections to external devices,
wherein said second transistors are aligned with less than 40 nm misalignment to said first transistors, and
wherein said first single crystal layer comprises an electrostatic discharge (“ESD”) structure connected to at least one of said Input/Output pad structures,
wherein at least one of said second transistors comprises a source, a drain, and a transistor channel,
wherein said source, said drain and said transistor channel comprise a same dopant type, and
wherein said second metal layer has a current carrying capacity at least twice a current carrying capacity than said first metal layer.
16. The 3D semiconductor device according to claim 15 ,
wherein said third transistors comprise polysilicon.
17. The 3D semiconductor device according to claim 15 , further comprising:
a connective path from said second transistors to said first transistors,
wherein said path comprises a through-layer via,
wherein said through-layer via contacts to said second transistor source or drain.
18. The 3D semiconductor device according to claim 15 , further comprising:
a plurality of vias connecting said second metal layer to said first metal layer,
wherein at least one of said plurality of vias comprises tungsten.
19. The 3D semiconductor device according to claim 15 , further comprising:
a Phase Lock Loop (“PLL”) structure connected to at least one of said Input/Output pad structures.
20. The 3D semiconductor device according to claim 15 ,
wherein at least one of said plurality of vias has a radius of less than 200 nm.