Printed circuit board
A printed circuit board includes a magnetic member including a magnetic layer, a first coil pattern disposed above the magnetic member, and having a planar spiral structure, and a second coil pattern disposed below the magnetic member, and having a planar spiral structure.
1. A printed circuit board, comprising:
a magnetic member including a magnetic layer;
a first coil pattern disposed above the magnetic member, and including a planar spiral structure;
a second coil pattern disposed below the magnetic member, and including a planar spiral structure;
a core layer having a through portion; and
a build-up layer covering at least a portion of each of the core layer, the magnetic member, and the first coil pattern, and disposed in at least a portion of the through portion.
2. The printed circuit board of claim 1 , wherein the magnetic member is disposed in the through portion.
3. The printed circuit board of claim 1 , wherein the magnetic member is provided as a plurality of magnetic members, and a portion of the plurality of magnetic members are disposed in the through portion, and a portion of remaining magnetic members are disposed outside of the build-up layer.
4. The printed circuit board of claim 1 , wherein the first and second coil patterns are provided with a plurality of the planar spiral structures, respectively, and the plurality of planar spiral structures are stacked in a thickness direction of the printed circuit board.
5. The printed circuit board of claim 4 , wherein each of the plurality of planar spiral structures in the first and second coil patterns is connected to each other by conductive vias.
6. The printed circuit board of claim 1 , wherein the first and second coil patterns comprise two pads for electrical connections, respectively, and the first and second coil patterns are not directly connected.
7. The printed circuit board of claim 1 , wherein the first and second coil patterns are connected to each other by a conductive via.
8. The printed circuit board of claim 7 , wherein the conductive via is disposed to be adjacent to a side surface of the magnetic member.
9. The printed circuit board of claim 8 , wherein the conductive via connects an outermost end portion of each of the first and second coil patterns.
10. The printed circuit board of claim 7 , wherein the conductive via penetrates the magnetic member.
11. The printed circuit board of claim 10 , wherein the conductive via connects an innermost end portion of each of the first and second coil patterns.
12. The printed circuit board of claim 1 , further comprising first and second core wiring layers disposed on one surface and the other surface of the core layer, respectively, and in which at least a portion thereof is covered by the build-up layer, and a core via layer penetrating at least a portion of the core layer.
13. The printed circuit board of claim 1 , wherein each of the magnetic member, the first coil pattern, and the second coil pattern is embedded in the printed circuit board.
14. A printed circuit board, comprising:
a magnetic member including a magnetic layer;
a first coil pattern disposed above the magnetic member, and including a planar spiral structure; and
a second coil pattern disposed below the magnetic member, and including a planar spiral structure,
wherein the magnetic member comprises a base layer and the magnetic layer disposed on the base layer.
15. The printed circuit board of claim 14 , wherein the base layer is a substrate containing silicon (Si).
16. The printed circuit board of claim 14 , wherein the magnetic layer comprises a cobalt-tantalum-zirconium alloy.
17. A printed circuit board, comprising:
a core layer;
a plurality of build-up layers and a plurality of wiring layers disposed on opposing sides of the core layer;
a magnetic member including a magnetic layer and embedded in the core layer; and
a first coil pattern and a second coil pattern each having a planar spiral structure and overlapping the magnetic member in a stacking direction of the plurality of build-up layers,
wherein the first coil pattern is directly disposed on one of the build-up layer on which one of the plurality of wiring layers is directly disposed, and
the second coil pattern is directly disposed on another of the build-up layer on which another of the plurality of wiring layers is directly disposed.
18. The printed circuit board of claim 17 , wherein the first and second coil patterns are connected to each other through a via penetrating through at least the magnetic member.
19. The printed circuit board of claim 17 , wherein the first and second coil patterns are connected to each other through a via extending in the stacking direction in a region outside the magnetic member.
20. A printed circuit board, comprising:
a magnetic member including a magnetic layer;
a first coil pattern disposed above the magnetic member, and including a planar spiral structure; and
a second coil pattern disposed below the magnetic member, and including a planar spiral structure,
wherein the first and second coil patterns comprise two pads for electrical connections, respectively, and the first and second coil patterns are not directly connected.