IP Library Granted Patent US 10,872,750
Granted Patent B2
US 10,872,750 · App. 15/892,041 · Granted Dec 22, 2020

Plasma processing apparatus and plasma processing system

Inventors: Ryoji Asakura (Tokyo, JP); Shota Umeda (Tokyo, JP); Daisuke Shiraishi (Tokyo, JP); Akira Kagoshima (Tokyo, JP); Satomi Inoue (Tokyo, JP)
Assignee: HITACHI HIGH-TECH CORPORATION
H01J37/32926G01J3/443H01L21/67069H01L21/67253H01J2237/334
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Quick Facts
Patent No.
US 10,872,750
App. No.
15/892,041
Granted
Dec 22, 2020
Kind
B2
Abstract

The plasma processing apparatus includes a plasma processing unit that performs plasma processing of a sample and a control unit that controls the plasma processing. The control unit selects one of a plurality of the prediction models for predicting a result of the plasma processing based on a state of the plasma processing unit, and predicts the result of the plasma processing by using a selected prediction model.

Claims (15)

1. A plasma processing apparatus comprising:

a plasma processing unit that performs plasma processing of a sample; and

a control unit that controls the plasma processing,

wherein the control unit selects one of a plurality of prediction models for predicting a result of the plasma processing for each of a plurality of divided data of a management value based on a state of the plasma processing unit, and predicts the result of the plasma processing by using the selected prediction model selected for each said divided data,

wherein the divided data is data divided based on a threshold of the management value indicating a state of the plasma processing unit.

2. The plasma processing apparatus according to claim 1 ,

wherein the management value is a number of times of plasma processing of the sample.

3. The plasma processing apparatus according to claim 1 ,

wherein the result of the plasma processing is a dimension of a pattern formed on the sample and etched by the plasma.

4. The plasma processing apparatus according to claim 1 , further comprising:

an output unit that displays a predicted value for predicting the plasma processing result in association with the prediction model.

5. The plasma processing apparatus according to claim 1 , further comprising: a storage unit that stores a past history in the result of the plasma processing and a past history in light emission data, wherein the control unit obtains the threshold of the management value based on a correlation between the past history in the result of the plasma processing and the past history in the light emission data.

6. The plasma processing apparatus according to claim 1 , further comprising:

a processing result acquiring unit that acquires an index of result of the plasma processing by an inspection device,

wherein the control unit selects the prediction model based on the index.

Assignments (2)
CHANGE OF NAME Recorded Mar 25, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052225/0894 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 8, 2018
From: ASAKURA, RYOJI; UMEDA, SHOTA; SHIRAISHI, DAISUKE; KAGOSHIMA, AKIRA; INOUE, SATOMI
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 045146/0160 →
Priority Claims (1)
JP 2017-152921 · Aug 8, 2017 · national
Continuity (1)
Related Publication 20190051502A1 · Feb 14, 2019