Plasma etching method and plasma etching apparatus

1. An plasma etching method for etching a film layer of an object to be processed disposed in a processing chamber inside a vacuum container and is made of a member containing silicon, the plasma etching method comprising:

forming a film by repeating a set of steps a plurality of times, the set of steps including

a first step of introducing a gas containing at least hydrogen fluoride into the processing chamber and supplying hydrogen fluoride molecules to a surface of the film layer of the object to be processed,

after said first step, a second step of stopping the supply of the gas containing hydrogen fluoride into said processing chamber, and exhausting the interior of the processing chamber to reduce the gas containing hydrogen fluoride, and

after said second step, starting a third step of supplying hydrogen nitride molecules to the surface of the film layer of the object to be processed to form a compound layer containing nitrogen, hydrogen, and fluorine on the surface of the film layer; and

removing the compound layer formed on the surface of the film layer to be processed after the forming of the film.

2. The plasma etching method according to claim 1 , wherein

the third step includes introducing a gas containing hydrogen nitride into the processing chamber.

3. The plasma etching method according to claim 2 , wherein

the second step is executed after the introduction of the gas containing at least hydrogen fluoride into the processing chamber is stopped and before the introduction of the gas containing hydrogen nitride is started.

4. The plasma etching method according to claim 2 , wherein

the set of steps includes exhausting the interior of the processing chamber before the start of the first step or after the end of the third step to remove a gas containing hydrogen nitride.

5. The plasma etching method according to claim 4 , wherein

a pressure in the processing chamber in the second step or the exhausting step is made lower than a pressure in the processing chamber in the first step and the third step.

6. The plasma etching method according to claim 1 , wherein

the third step includes introducing N 2 gas and H 2 gas into the processing chamber and generating plasma to generate NH 3 molecules.

7. The plasma etching method according to claim 6 , wherein

the second step is executed after the introduction of the gas containing at least hydrogen fluoride into the processing chamber is stopped and before the plasma is generated.

8. The plasma etching method according to claim 6 , wherein

the set of steps includes exhausting the interior of the processing chamber before the start of the first step or after the end of the third step to remove hydrogen nitride gas.

9. The plasma etching method according to claim 8 , wherein

a pressure in the processing chamber in the second step or the exhausting is made lower than a pressure in the processing chamber in the first step and the third step.

10. The plasma etching method according to claim 1 , wherein

the removal of the film includes heating the object to be processed to remove the compound layer.

11. The plasma etching method according to claim 10 , further comprising:

cooling the object to be processed after the removal of the film.

12. An plasma etching apparatus comprising:

a vacuum container in which an object to be processed made of a member containing silicon is disposed;

a first gas source that supplies hydrogen fluoride gas into the vacuum container;

a second gas source that supplies hydrogen nitride gas into the vacuum container;

a heating device that heats the object to be processed; and

a control unit, wherein

the control unit repeats a set of steps a plurality of times, the set of steps including

introducing hydrogen fluoride gas from the first gas source into the processing chamber and supplying hydrogen fluoride molecules to a surface of a film layer of the object to be processed,

exhausting the interior of the processing chamber while stopping the supply of the hydrogen fluoride gas into the processing chamber to reduce the hydrogen fluoride molecules in said processing chamber, and

introducing hydrogen nitride gas from the second gas source into the vacuum container to form a compound layer containing nitrogen, hydrogen, and fluorine on the surface of the film layer, and

heating the object to be processed by the heating device to remove the compound layer formed on the surface of the film layer.

13. An plasma etching apparatus comprising:

a vacuum container in which an object to be processed made of a member containing silicon is disposed;

a first gas source that supplies hydrogen fluoride gas into the vacuum container;

a second gas source that supplies N 2 gas and H 2 gas into the vacuum container;

a plasma device that generates plasma in the vacuum container;

a heating device that heats the object to be processed; and

a control unit, wherein

the control unit repeats a set of steps a plurality of times, the set of steps including

introducing hydrogen fluoride gas from the first gas source into the processing chamber and supplying hydrogen fluoride molecules to a surface of a film layer of the object to be processed,

exhausting the interior of the processing chamber while stopping the supply of the hydrogen fluoride gas into the processing chamber to reduce the hydrogen fluoride molecules in said processing chamber,

introducing N 2 gas and H 2 gas from the second gas source into the vacuum container and generating plasma in the vacuum container by the plasma device to generate NH 3 molecules, and

forming a compound layer containing nitrogen, hydrogen, and fluorine on the surface of the film layer, and

heating the object to be processed by the heating device to remove the compound layer formed on the surface of the film layer.