IP Library Granted Patent US 10,910,230
Granted Patent B2
US 10,910,230 · App. 16/655,497 · Granted Feb 2, 2021

Semiconductor manufacturing apparatus and method for manufacturing semiconductor device

Inventor: Yoshihide Yamaguchi (Tokyo, JP)
Assignee: HITACHI HIGH-TECH CORPORATION
H01L21/31122H01L21/02181H01L21/02183H01L21/02186H01L21/02189H01L21/02192H01L21/28185H01L21/31144H01L21/67017H01L21/6719H01L21/67069H01L29/517C23C16/45559
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Quick Facts
Patent No.
US 10,910,230
App. No.
16/655,497
Granted
Feb 2, 2021
Kind
B2
Abstract

Provided is a semiconductor manufacturing apparatus including: a container in which a processing chamber is installed; a stage installed in the processing chamber and configured to hold a semiconductor substrate; a gas supply line configured to supply reactive gas to the processing chamber; and a vacuum line configured to exhaust the processing chamber, wherein the semiconductor substrate includes a high-k insulating film, and as the reactive gas, mixed gas including complex-forming gas forming a volatile organometallic complex by reacting with a metal element included in the high-k insulating film and complex stabilizing material gas that increases stability of the organometallic complex is supplied.

Claims (12)

1. A semiconductor manufacturing apparatus, comprising: a container in which a processing chamber is installed; a stage installed in the processing chamber and configured to hold a semiconductor substrate; a gas supply line configured to supply reactive gas to the processing chamber; a vacuum line configured to exhaust the processing chamber; a trap installed in the vacuum line and configured to recover the reactive gas and organometallic complex exhausted from the processing chamber, wherein the semiconductor substrate includes a high-k insulating film, and as the reactive gas, mixed gas including complex-forming gas forming a volatile organometallic complex by reacting with a metal element included in the high-k insulating film and complex stabilizing material gas that increases stability of the organometallic complex is supplied, and a collecting and sorting device configured to react the reactive gas and the organometallic complex collected by the trap with an acid treatment liquid to regenerate a raw material for the complex-forming gas and a raw material for the complex stabilizing material gas.

2. The semiconductor manufacturing apparatus according to claim 1 , wherein the metal element included in the high-k insulating film is a metal element classified in a fifth period and the following periods of a periodic table.

3. The semiconductor manufacturing apparatus according to claim 1 , wherein the metal element included in the high-k insulating film is a rare earth element.

4. The semiconductor manufacturing apparatus according to claim 1 , further comprising:

a first vaporizer connected to the gas supply line,

wherein the first vaporizer vaporizes a mixed chemical liquid of a chemical stock solution of the complex-forming gas and a chemical stock solution of the complex stabilizing material gas under a predetermined temperature and pressure condition.

5. The semiconductor manufacturing apparatus according to claim 4 , further comprising:

a chemical liquid tank connected to the first vaporizer and filled with the mixed chemical liquid; and

a mixed chemical liquid composition adjustment unit configured to monitor a composition of the mixed chemical liquid filled in the chemical liquid tank and adjust the composition of the mixed chemical liquid.

6. The semiconductor manufacturing apparatus according to claim 4 , further comprising:

a second vaporizer connected to the gas supply line,

wherein the second vaporizer vaporizes a chemical stock solution different from that of the first vaporizer under the predetermined temperature and pressure condition.

Assignments (1)
CHANGE OF NAME Recorded Mar 25, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052225/0894 →
Priority Claims (1)
JP 2017-085910 · Apr 25, 2017 · national
Continuity (2)
Division 15904878 · Feb 26, 2018
Related Publication 20200051828A1 · Feb 13, 2020