Semiconductor devices including enlarged contact hole and methods of forming the same

1. A semiconductor device comprising:

a plurality of line patterns on a substrate, the plurality of line patterns comprising a first line pattern and a second line pattern that is directly adjacent to the first line pattern, the first line pattern comprising a first side facing the second line pattern, and the second line pattern comprising a second side facing the first line pattern;

a first spacer structure on the first side of the first line pattern and a second spacer structure on the second side of the second line pattern, the first spacer structure and the second spacer structure defining first and second openings therebetween, the second opening being on the first opening, and the second opening having a width greater than a width of the first opening;

a first conductor in the first opening, an upper surface of the first conductor being lower than uppermost surfaces of the first and second line patterns;

a second conductor in the second opening on the first conductor; and

a capacitor on the second conductor, the capacitor including a lower electrode, an upper electrode, and a dielectric layer between the lower electrode and the upper electrode,

wherein a portion of the second conductor is between the uppermost surface of the first line pattern and the lower electrode and separates the first line pattern from the lower electrode, and

wherein a width of the second conductor is greater than a width of the first conductor.

2. The semiconductor device of claim 1 , wherein the first line pattern comprises:

a conductive line; and

an insulating pattern on the conductive line,

wherein a lowermost end of the second conductor is higher than an upper surface of the conductive line.

3. The semiconductor device of claim 2 , wherein the first spacer structure comprises:

an outer spacer on the first side of the first line pattern; and

an intermediate spacer between the first line pattern and the outer spacer, the intermediate spacer being thicker than the outer spacer,

wherein upper surfaces of the outer spacer and the intermediate spacer are in contact with the second conductor.

4. The semiconductor device of claim 3 , wherein the upper surfaces of the outer spacer and the intermediate spacer are higher than the upper surface of the conductive line.

5. The semiconductor device of claim 4 , wherein the upper surfaces of the outer spacer and the intermediate spacer are higher than the upper surface of the first conductor.

6. The semiconductor device of claim 4 , wherein the upper surface of the intermediate spacer is lower than the upper surface of the outer spacer.

7. The semiconductor device of claim 6 , wherein the upper surface of the intermediate spacer is lower than the upper surface of the first conductor.

8. The semiconductor device of claim 3 , wherein the outer spacer comprises a nitride layer, and

wherein the intermediate spacer comprises a silicon oxide layer.

9. The semiconductor device of claim 3 , further comprising a capping spacer between the first line pattern and the second conductor.

10. The semiconductor device of claim 9 , wherein a lower surface of the capping spacer is in contact with the intermediate spacer.

11. The semiconductor device of claim 9 , wherein the first spacer structure further comprises an inner spacer between the first line pattern and the intermediate spacer,

wherein the inner spacer extends between the first line pattern and the capping spacer.

12. The semiconductor device of claim 3 , wherein the first spacer structure further comprises an inner spacer between the first line pattern and the intermediate spacer,

wherein the inner spacer extends between the first line pattern and the second conductor.

13. The semiconductor device of claim 1 , wherein the upper surface of the first conductor faces the second conductor, and the second conductor comprises a lowermost surface contacting the first conductor, and

wherein the upper surface of the first conductor has a first width, and the lowermost surface of the second conductor has a second width that is wider than the first width.

14. The semiconductor device of claim 1 , further comprising an interlayer insulating film on the second line pattern,

wherein the interlayer insulating film extends into the second line pattern and the second spacer structure, and

wherein the interlayer insulating film is in contact with a sidewall of the second conductor.

15. The semiconductor device of claim 14 , wherein a bottom of the interlayer insulating film is closer to the substrate than an uppermost end of the second line pattern.

16. A semiconductor device comprising:

a substrate;

a plurality of line patterns on the substrate, the plurality of line patterns comprising a first line pattern and a second line pattern that is directly adjacent to the first line pattern, the first line pattern comprising a first side facing the second line pattern, and the second line pattern comprising a second side facing the first line pattern;

a first spacer structure on the first side of the first line pattern and a second spacer structure on the second side of the second line pattern, the first spacer structure and the second spacer structure defining first and second openings therebetween, the second opening being on the first opening, and the second opening having a width greater than a width of the first opening;

a first conductor in the first opening, an upper surface of the first conductor being lower than upper surfaces of the first and second line patterns;

a second conductor in the second opening on the first conductor; and

a capacitor on the second conductor,

wherein a width of the second conductor is greater than a width of the first conductor,

wherein the first line pattern comprises:

a bit line; and

an insulating pattern on the bit line,

wherein a lowermost end of the second conductor is higher than an upper surface of the bit line,

wherein the first spacer structure comprises:

an outer spacer on the first side of the first line pattern;

an intermediate spacer between the first line pattern and the outer spacer, the intermediate spacer being thicker than the outer spacer; and

 an inner spacer between the first line pattern and the intermediate spacer,

wherein an upper surface of the inner spacer is coplanar with the upper surface of the first line pattern,

wherein upper surfaces of the outer spacer and the intermediate spacer are in contact with the second conductor, and

wherein the upper surfaces of the outer spacer and the intermediate spacer are higher than the upper surface of the first conductor.

17. The semiconductor device of claim 16 , further comprising a capping spacer between the first line pattern and the second conductor,

wherein a lower surface of the capping spacer is in contact with the intermediate spacer.

18. A semiconductor device comprising:

a substrate;

a plurality of line patterns on the substrate, the plurality of line patterns comprising a first line pattern and a second line pattern that is directly adjacent to the first line pattern, the first line pattern comprising a first side facing the second line pattern, and the second line pattern comprising a second side facing the first line pattern;

a first spacer structure on the first side of the first line pattern and a second spacer structure on the second side of the second line pattern, the first spacer structure and the second spacer structure defining first and second openings therebetween, the second opening being on the first opening, and the second opening having a width greater than a width of the first opening;

a first conductor in the first opening, an upper surface of the first conductor being lower than upper surfaces of the first and second line patterns;

a second conductor in the second opening on the first conductor; and

a capacitor on the second conductor,

wherein a width of the second conductor is greater than a width of the first conductor,

wherein the first line pattern comprises:

a bit line; and

an insulating pattern on the bit line,

wherein a lowermost end of the second conductor is higher than an upper surface of the bit line,

wherein the first spacer structure comprises:

an outer spacer on the first side of the first line pattern; and

an intermediate spacer between the first line pattern and the outer spacer, the intermediate spacer being thicker than the outer spacer,

wherein upper surfaces of the outer spacer and the intermediate spacer are in contact with the second conductor,

wherein the upper surface of the intermediate spacer comprises a recess, and a lowermost end of the upper surface of the intermediate spacer is lower than the upper surface of the outer spacer, and

wherein the upper surfaces of the outer spacer and the intermediate spacer are higher than the upper surface of the bit line.

19. The semiconductor device of claim 18 , wherein the upper surface of the intermediate spacer is lower than the upper surface of the first conductor.

20. The semiconductor device of claim 1 , wherein the portion of the second conductor directly contacts the uppermost surface of the first line pattern.