Gate cut with high selectivity to preserve interlevel dielectric layer
A method for preserving interlevel dielectric in a gate cut region includes recessing a dielectric fill to expose cap layers of gate structures formed in a device region and in a cut region and forming a liner in the recess on top of the recessed dielectric fill. The liner includes a material to provide etch selectivity to protect the dielectric fill. The gate structures in the cut region are recessed to form a gate recess using the liner to protect the dielectric fill from etching. A gate material is removed from within the gate structure using the liner to protect the dielectric fill from etching. A dielectric gap fill is formed to replace the gate material and to fill the gate recess in the cut region.
1. A method for preserving interlevel dielectric in a gate cut region, comprising:
forming a liner in a recess to be conformal on top of a recessed dielectric fill in a device region and in a cut region corresponding to a non-functioning region, the recessed dielectric fill having a top surface below a top surface of a gate cap layer of a gate structure in the cut region and a gate cap layer of a gate structure of the device region, the liner being formed to the top surfaces of the gate cap layers, and the liner including a material to provide etch selectivity relative to each of the gate cap layers to protect the recessed dielectric fill from being etched during subsequent processing;
recessing the gate cap layer in the cut region to form a gate recess within the cut region using the liner to protect the recessed dielectric fill from being etched;
removing a gate material exposed by the gate recess from within the gate structures using the liner to protect the recessed dielectric fill from being etched; and
forming a dielectric gap fill to replace the gate material and to fill the gate recess in the cut region.
2. The method as recited in claim 1 , wherein forming the liner includes:
conformally depositing the liner over the gate structures and on the top of the recessed dielectric fill; and
planarizing the liner to remove the liner over the gate structures.
3. The method as recited in claim 1 , wherein forming the liner includes forming the liner from TiN.
4. The method as recited in claim 1 , wherein recessing the gate structures in the cut region includes patterning a mask layer to protect the device region.
5. The method as recited in claim 1 , wherein removing the gate material includes removing material from a dummy gate.
6. The method as recited in claim 1 , wherein removing the gate material includes removing material from a gate first structure.
7. The method as recited in claim 1 , wherein forming the dielectric gap fill includes forming the dielectric gap fill between spacers formed in the gate structure.
8. The method as recited in claim 1 , further comprising:
forming the gate structures in the device region and the cut region; and
forming source and drain regions in the device region.
9. The method as recited in claim 8 , wherein forming the source and drain regions in the device region includes epitaxially growing the source and drain regions between the gate structures.
10. The method as recited in claim 1 , further comprising:
depositing and planarizing a dielectric fill to fill in gaps between the gate structures in the device region and the cut region; and
recessing the dielectric fill to form the recessed dielectric fill and to expose a cap layer at a top portion of the gate structures.
11. The method of claim 1 , wherein the gate recess includes a material that provides etch selectivity relative to the liner to protect the recessed dielectric fill from being etched.
12. A method for preserving interlevel dielectric in a gate cut region, comprising:
forming a liner in a recess to be conformal on top of a recessed dielectric fill in a device region and in a cut region corresponding to a non-functioning region by:
conformally depositing the liner over a gate structure in the cut region, a gate structure in the device region, and the recessed dielectric fill; and
planarizing the liner to remove the liner to a top surface of a gate cap layer of the gate structure in the cut region and a top surface of a gate cap layer of the gate structure in the device region, the recessed dielectric fill having a top surface below the top surface of each of the gate cap layers, and the liner including a material to provide etch selectivity relative to each of the gate cap layers to protect the recessed dielectric fill from being etched during subsequent processing; and
recessing the gate cap layer in the cut region to form a gate recess within the cut region exposing a gate material using the liner to protect the recessed dielectric fill from being etched.
13. The method of claim 12 , wherein the gate recess includes a material that provides etch selectivity relative to the liner to protect the recessed dielectric fill from being etched.
14. A method for preserving interlevel dielectric in a gate cut region, comprising:
forming a liner in a recess to be conformal on top of a recessed dielectric fill-in a device region and in a cut region corresponding to a non-functioning region, the liner being formed to a top surface of a gate cap layer of a gate structure in the cut region and a top surface of a gate cap layer of a gate structure in the device region, and the liner including a material to provide etch selectivity relative to each of the gate cap layers to protect the recessed dielectric fill from being etched during subsequent processing;
forming a gate recess within the cut region exposing a gate material using the liner to protect the recessed dielectric fill from being etched by:
patterning a mask layer over the device region to protect the device region; and
etching the gate cap layers in the cut region after patterning the mask layer.
15. The method of claim 14 , wherein the gate recess includes a material that provides etch selectivity relative to the liner to protect the recessed dielectric fill from being etched.