IP Library › Granted Patent US 10,978,581
Granted Patent B2
US 10,978,581 · App. 16/387,874 · Granted Apr 13, 2021

Guard rings for cascode gallium nitride devices

Inventors: Woochul Jeon (Phoenix, AZ); Chun-Li Liu (Scottsdale, AZ); Ali Salih (Mesa, AZ)
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
H01L29/778H01L23/4952H01L23/49537H01L23/585H01L27/0883H01L29/0619H01L29/0623H01L29/16H01L29/2003H01L29/402H01L29/41758H01L29/42316H01L29/1066
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Quick Facts
Patent No.
US 10,978,581
App. No.
16/387,874
Granted
Apr 13, 2021
Kind
B2
Abstract

Implementations of semiconductor devices may include: a plurality of drain fingers and a plurality of source fingers interdigitated with one another; at least one gate; and at gate bus formed to completely surround the plurality of drain fingers and the plurality of source fingers; wherein the gate bus is mechanically and electrically coupled to the at least one gate.

Claims (32)

1. A semiconductor device comprising:

a depletion mode (D-mode) transistor comprising one or more source fingers, one or more drain fingers and one or more gate pads;

an enhanced mode (E-mode) transistor comprising one or more source pads, one or more drain pads and one or more gate pads; and

a guard ring;

wherein the one or more gate pads of the D-mode transistor couple with the one or more source pads of the E-mode transistor, an electrical ground, and the guard ring.

2. The semiconductor device of claim 1 , wherein the D-mode transistor is a gallium nitride (GaN) high electron mobility transistor (HEMT).

3. The semiconductor device of claim 1 , wherein the E-mode transistor is a silicon (Si) field effect transistor (FET).

4. The semiconductor device of claim 1 , further comprising a gate bus formed as the guard ring.

5. The semiconductor device of claim 1 , wherein the D-mode transistor is coupled to a first conductive lead frame and the E-mode transistor is coupled to a second conductive lead frame.

6. The semiconductor device of claim 1 , further comprising a pin out from each of the drain of the D-mode transistor and a gate and a source of the E-mode transistor.

7. The semiconductor device of claim 1 , wherein a source of the D-mode transistor is coupled to a drain of the E-mode transistor.

8. The semiconductor device of claim 1 , wherein a source of the D-mode transistor and a drain of the E-mode transistor are coupled together through a wire bond.

9. A semiconductor device comprising:

a depletion mode (D-mode) transistor comprising one or more source fingers, one or more drain fingers and one or more gate pads;

an enhanced mode (E-mode) transistor comprising one or more source pads, one or more drain pads and one or more gate pads; and

a guard ring;

wherein the one or more gate pads of the D-mode transistor couple with the one or more source pads of the E-mode transistor, an electrical ground, and the guard ring St; and

wherein the source is not grounded.

10. The semiconductor device of claim 9 , wherein the D-mode transistor is a gallium nitride (GaN) high electron mobility transistor (HEMT).

11. The semiconductor device of claim 9 , wherein the E-mode transistor is a silicon (Si) field effect transistor (FET).

12. The semiconductor device of claim 9 , further comprising a gate bus formed as the guard ring.

13. The semiconductor device of claim 9 , wherein the D-mode transistor is coupled to a first conductive lead frame and the E-mode transistor is coupled to a second conductive lead frame.

14. The semiconductor device of claim 9 , further comprising a pin out from each of the drain of the D-mode transistor and a gate and a source of the E-mode transistor.

15. The semiconductor device of claim 9 , wherein of a source of the D-mode transistor is coupled to a drain of the E-mode transistor.

16. The semiconductor device of claim 9 , wherein a source of the D-mode transistor and a drain of the E-mode transistor are coupled together through a wire bond.

17. A semiconductor device comprising:

a depletion mode (D-mode) transistor comprising one or more source fingers, one or more drain fingers and one or more gate pads;

an enhanced mode (E-mode) transistor comprising one or more source pads, one or more drain pads and one or more gate pads; and

a second guard ring surrounding an outer perimeter of a first guard ring, the first guard ring coupled with the one or more gate pads of at least the D-mode transistor;

wherein the one or more gate pads of the D-mode transistor couple with the one or more source pads of the E-mode transistor and an electrical ground.

18. The semiconductor device of claim 17 , further comprising a gate bus formed as the first guard ring of the D-mode transistor.

19. The semiconductor device of claim 17 , wherein the D-mode transistor is coupled to a first conductive lead frame and the E-mode transistor is coupled to a second conductive lead frame.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL 050156, FRAME 0421 Recorded Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0639 →
SECURITY INTEREST Recorded Aug 23, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 050156/0421 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 18, 2019
From: JEON, WOOCHUL; SALIH, ALI; LIU, CHUN-LI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 048926/0587 →
Continuity (3)
Continuation 15955555 · Apr 17, 2018
Division 15208466 · Jul 12, 2016
Related Publication 20190245072A1 · Aug 8, 2019