Method for forming ceramic coating having improved plasma resistance and ceramic coating formed thereby
The present invention relates to a method for forming a ceramic coating having improved plasma resistance and a ceramic coating formed thereby. The present invention discloses the method for forming the ceramic coating having improved plasma resistance and the ceramic coating formed thereby, comprising the steps of: receiving, from a powder supply portion, a plurality of ceramic powders having a first powder particle size range, and transporting the powders using a transport gas; and forming a ceramic coating in which a plurality of first ceramic particles within a first coating particle size range and a plurality of second ceramic particles within a second coating particle size range, which is larger than the first coating particle size range, by causing the transported ceramic powders to collide with a substrate inside a process chamber, at the speed of 100 to 500 m/s so as to be pulverized.
1. A ceramic coating layer having improved plasma resistance, the ceramic coating layer comprising:
multiple first ceramic particles having a first grain size; and
multiple second ceramic particles having a second grain size larger than the first grain size,
wherein the multiple first and second ceramic particles are mixed to then be coated on a base material to form a ceramic coating layer, the first grain size of the first ceramic particles ranges from 200 nm to 900 nm, the second grain size of the second ceramic particles ranges from 900 nm to 10 μm, the first and second ceramic particles are the same material, the base material is a component exposed to a plasma environment, and the first and second ceramic particles include yttrium-based oxide,
wherein the maximum number of the first ceramic particles exists between 250 nm and 350 nm in the first grain size scale and the maximum number of the second ceramic particles exists between 1.0 μm and 1.2 μm in the second grain size scale.
2. The ceramic coating layer of claim 1 , wherein the maximum number of the first ceramic particles is greater than the maximum number of the second ceramic particles.
3. The ceramic coating layer of claim 1 , wherein the porosity of the ceramic coating layer is in the range of 0.01% to 1.0%.
4. The ceramic coating layer of claim 1 , wherein the cross-sectional ratio of the first ceramic particles to the second ceramic particles is in the range of 9:1 to 5:5.
5. The ceramic coating layer of claim 1 , wherein the component is an internal component of a processing chamber for manufacturing a semiconductor or a display.
6. The ceramic coating layer of claim 5 , wherein the component includes one selected from the group consisting of an electro static chuck, a heater, a chamber liner, a shower head, a boat for chemical vapor deposition (CVD), a focus ring, a wall liner, a shield, a cold pad, a source head, an outer liner, a deposition shield, an upper liner, an exhaust plate, an edge ring, and a mask frame.