Substrate cleaning device, substrate processing apparatus, substrate cleaning method and substrate processing method
An outer peripheral end of a substrate is held with a plurality of chuck pins provided at a spin plate abutting against a plurality of portions of the outer peripheral end of the substrate, and the spin plate is rotated about a rotation axis. A cleaning head is moved by a head moving mechanism while being pressed against a back surface of the substrate held by the plurality of chuck pins by the head moving mechanism, and foreign matter on the back surface of the substrate is removed by polishing with the cleaning head. A reaction force against a load applied to the back surface of the substrate by the cleaning head is generated in the substrate by auxiliary pins. Alternatively, the back surface of the substrate, which has been cleaned or is being cleaned by the cleaning head, is further cleaned by a cleaning brush.
1. A substrate cleaning method for cleaning a back surface of a substrate including:
holding and rotating the substrate by a rotation holder; and
cleaning the back surface of the substrate held by the rotation holder by a cleaner, wherein
the holding and rotating the substrate include:
making a plurality of holders provided at a rotator abut against and hold a plurality of portions of an outer peripheral end of the substrate, and
rotating the rotator about a rotation axis by a motor having a rotation shaft,
a rotation center of the substrate coincides with a rotation center of the rotator, and
the cleaning includes:
moving a cleaning tool by a mover while pressing the cleaning tool against the back surface of the substrate held by the plurality of holders by the mover,
removing foreign matter on the back surface of the substrate by polishing with the cleaning tool, and
applying a force to the substrate in a direction perpendicular to the back surface or a different surface of the substrate by a reaction force generator to generate a reaction force in the substrate against a load applied to the back surface of the substrate by the cleaning tool.
2. A substrate processing method including:
forming a coating film on a surface to be processed by supplying a coating liquid to the surface to be processed of a substrate;
supplying a removal liquid for removing the coating film formed on a peripheral portion of the surface to be processed of the substrate to the peripheral portion of the substrate; and
cleaning a back surface of the substrate from which the coating film on the peripheral portion of the surface to be processed is removed by using the substrate cleaning method according to claim 1 .
3. The substrate cleaning method according to claim 1 , wherein
the reaction force generator includes a plurality of abutments provided at the rotator to abut against the plurality of portions of the outer peripheral end of the substrate, and
the applying a force to the substrate in a direction perpendicular to the back surface or a different surface of the substrate by the reaction force generator includes generating, when a load is applied to the back surface of the substrate by the cleaning tool, a reaction force in the outer peripheral end of the substrate against the load by the plurality of abutments.
4. The substrate cleaning method according to claim 3 , wherein
the outer peripheral end of the substrate has a bevel portion close to a surface to be processed, a bevel portion close to the back surface and an end surface, and
each of the plurality of abutments has an abutment surface that abuts against a plurality of portions of the bevel portion close to the surface to be processed of the substrate.
5. The substrate cleaning method according to claim 1 , wherein the cleaning further includes cleaning, with a cleaning brush, the back surface of the substrate, which has been cleaned or is being cleaned by the cleaning tool.