Substrate cleaning method and substrate processing method
A substrate cleaning method includes holding and rotating a substrate by a rotation holder and cleaning a back surface of the substrate held by the rotation holder. The holding and rotating the substrate includes holding the substrate by a holder provided at a rotator and rotating the rotator about a rotation axis. The cleaning includes moving a cleaning tool by a mover while pressing the cleaning tool against the back surface of the substrate held by the holder, removing foreign matter on the back surface of the substrate by polishing with the cleaning tool, and further cleaning the back surface of the substrate, which has been cleaned or is being cleaned by the cleaning tool, by a cleaning brush.
1. A substrate cleaning method for cleaning a back surface of a substrate including:
holding and rotating the substrate by a rotation holder; and
cleaning the back surface of the substrate held by the rotation holder, wherein
the holding and rotating the substrate includes:
holding the substrate by a holder provided at a rotator, and
rotating the rotator about a rotation axis,
a rotation center of the substrate coincides with a rotation center of the rotator, and the cleaning includes:
moving a cleaning tool by a mover while pressing the cleaning tool against the back surface of the substrate held by the holder,
removing foreign matter on the back surface of the substrate by polishing with the cleaning tool, and
further cleaning the back surface of the substrate, which has been cleaned or is being cleaned by the cleaning tool, by a cleaning brush.
2. A substrate processing method including:
forming a coating film on a surface to be processed of a substrate by supplying a coating liquid to the surface to be processed;
supplying a removal liquid for removing the coating film formed on a peripheral portion of the surface to be processed of the substrate to the peripheral portion of the substrate; and
cleaning a back surface of the substrate from which the coating film on the peripheral portion of the surface to be processed is removed by using the substrate cleaning method according to claim 1 .