Substrate washing device
A substrate washing device includes a substrate holding mechanism 70 that holds a substrate W, a substrate rotating mechanism 72 that rotates the substrate W held by the substrate holding mechanism 70 , and a two-fluid nozzle 46 that ejects a two-fluid jet toward a surface of the rotating substrate W. The two-fluid nozzle 46 is formed of a conductive material. Accordingly, the electrification amount of droplets ejected as the two-fluid jet from the two-fluid nozzle 46 can be suppressed.
1. A substrate washing device comprising:
a substrate holding mechanism that holds a substrate;
a substrate rotating mechanism that rotates the substrate held by the substrate holding mechanism; and
a two-fluid nozzle that ejects a two-fluid jet including droplets toward a surface of the rotating substrate, wherein
the two-fluid nozzle has a nozzle leading end formed of a conductive material and a nozzle base end formed of a non-conductive material, the conductive material being conductive carbon PEEK or conductive carbon PTFE, wherein the nozzle leading end is configured to discharge liquid external to the nozzle,
the two-fluid nozzle is configured to eject the droplets together with carrier gas, the droplets being positively electrified without adding charge from an external source, wherein the carrier gas and the liquid are mixed to form the droplets inside the nozzle and wherein
the substrate washing device further comprises an oscillation arm having the two-fluid nozzle on its leading end, the two-fluid nozzle being moved by the oscillation arm and facing the substrate.
2. The substrate washing device according to claim 1 , wherein the ejection speed of the two-fluid jet is at lowest 200 m/sec or higher, and preferably, 250 m/sec or higher.
3. The substrate washing device according to claim 1 , wherein the two-fluid nozzle is moved along a circular movement trajectory on the substrate,
the oscillation arm has a support shaft on its base end, the support shaft being connected with the oscillation arm rotatably.
4. The substrate washing device according to claim 3 , wherein
the oscillation arm further comprising a pencil-type washing tool on its base end.
5. The substrate washing device according to claim 1 , further comprising a control unit which controls the substrate washing device.
6. A substrate processing apparatus, comprising:
a plurality of polishing units;
a first washing unit and a second washing unit that wash the polished substrate; and
a drying unit that dries the washed substrate;
wherein the second washing unit comprises the substrate washing device according to claim 1 .
7. A substrate processing apparatus according to claim 6 , wherein the first washing unit and the second washing unit are housed in a washing part;
wherein the washing part has a two-stage structure composed of the first washing unit and the second washing unit, respectively, wherein the first washing unit and the second washing unit are arranged vertically to each other.