Arrangement of penetrating electrode interconnections
The present technology relates to a semiconductor apparatus, a production method, and an electronic apparatus that enable semiconductor apparatuses to be laminated and the laminated semiconductor apparatuses to be identified. A semiconductor apparatus that is laminated and integrated with a plurality of semiconductor apparatuses, includes a first penetrating electrode for connecting with the other semiconductor apparatuses and a second penetrating electrode that connects the first penetrating electrode and an internal device, the second penetrating electrode being arranged at a position that differs for each of the laminated semiconductor apparatuses. The second penetrating electrode indicates a lamination position at a time of lamination. An address of each of the laminated semiconductor apparatuses in a lamination direction is identified by writing using external signals after lamination. The present technology is applicable to a memory chip and an FPGA chip.
1. A semiconductor apparatus, comprising:
a first chip, including:
a plurality of first penetrating electrodes; and
a second penetrating electrode, wherein the second penetrating electrode connects a first one of the first penetrating electrodes and an internal device of the first chip; and
a second chip, including:
a plurality of first penetrating electrodes; and
a second penetrating electrode, wherein the second penetrating electrode connects a second one of the first penetrating electrodes and an internal device of the second chip,
wherein the first chip is directly connected to, laminated on and integrated with the second chip,
wherein the first one of the first penetrating electrodes of the first chip is connected to a first one of the first penetrating electrodes of the second chip,
wherein a second one of the first penetrating electrodes of the first chip is connected to the second one of the first penetrating electrodes of the second chip,
wherein the second one of the first penetrating electrodes of the second chip is not connected to the first one of the first penetrating electrodes of the first chip,
wherein the first one of the first penetrating electrodes of the first chip and the first one of the first penetrating electrodes of the second chip taken together are connected to no more than one of the second penetrating electrodes,
wherein the second penetrating electrode of the first chip and the second penetrating electrode of the second chip are arranged at different positions, and
wherein no more than one second penetrating electrode that connects to an internal device is provided in each of the first chip and the second chip in a cross-sectional view.
2. The semiconductor apparatus according to claim 1 , wherein
the second penetrating electrode of the first chip indicates a lamination position at a time of lamination.
3. The semiconductor apparatus according to claim 1 , wherein
an address of each of the laminated chips in a lamination direction is identified by writing using external signals after lamination.
4. The semiconductor apparatus according to claim 1 , wherein
an address in a lamination direction is written by external signals using a combination of a fuse or anti-fuse device of the semiconductor apparatus and the second penetrating electrode.
5. The semiconductor apparatus according to claim 1 , wherein
the semiconductor apparatus is laminated in a wafer state and segmentalized after the first penetrating electrodes and the second penetrating electrodes are formed.
6. The semiconductor apparatus according to claim 1 , wherein
the semiconductor apparatus is a memory, and
a bit position is identified by a combination of a Z address indicating a lamination position of each of the laminated chips and an XY address used in the memory.
7. The semiconductor apparatus according to claim 1 , wherein
the semiconductor apparatus is an FPGA (Programmable Logic Array), and
an arrangement of logic elements for writing a circuit function is specified by an XY address for specifying a position in the semiconductor apparatus and a Z address for specifying a position among the chips.
8. The semiconductor apparatus according to claim 7 , wherein
wiring arrays in a lamination direction are connected via a penetrating electrode to which a programmable selection switch is added, and a network connection in a 3D direction is configured in a logic element unit.
9. The semiconductor apparatus according to claim 7 , further comprising
a switch that controls a flow of signals within the semiconductor apparatus, and
a switch that controls a flow of signals among the chips.
10. The semiconductor apparatus according to claim 1 , wherein
the semiconductor apparatus is laminated with a semiconductor apparatus in which an external connection terminal and a protection device are formed,
the laminated semiconductor apparatuses are mutually connected by the first penetrating electrode, and
the external connection terminal and the protection device are shared by the plurality of laminated semiconductor apparatuses.
11. The semiconductor apparatus according to claim 1 , wherein
an image pickup device is laminated,
the semiconductor apparatus is a memory that stores data of signals captured by the image pickup device,
the memory is laminated plurally below the image pickup device, and
a processing unit that processes signals from the memories is laminated below the memories.
12. The semiconductor apparatus according to claim 1 , wherein each of the first chip and the second chip has only one secondary electrode.
13. The semiconductor apparatus according to claim 1 , wherein an arrangement of the first chip is asymmetrical with an arrangement of the second chip.
14. The semiconductor apparatus according to claim 1 , wherein the second penetrating electrode of the first chip and the second penetrating electrode of the second chip each contacts an underside of the internal devices.
15. A production method for producing a semiconductor apparatus, the method comprising:
forming a plurality of first penetrating electrodes in a first chip for directly connecting with a second chip and a second penetrating electrode that connects a first one of the first penetrating electrodes and an internal device of the first chip;
forming a plurality of first penetrating electrodes in the second chip for connecting with the first chip and a second penetrating electrode that connects a second one of the first penetrating electrodes and an internal device of the second chip,
wherein the first one of the first penetrating electrodes of the first chip and a first one of the first penetrating electrodes of the second chip taken together are connected to no more than one of the second penetrating electrodes,
wherein the second penetrating electrodes are formed at positions that differ for each of the first and second chips, and
wherein no more than one second penetrating electrode that connects to an internal device is provided in each of the first chip and the second chip in a cross-sectional view.
16. The production method for producing a semiconductor apparatus according to claim 15 , wherein each of the first chip and the second chip has only one secondary electrode.
17. The production method for producing a semiconductor apparatus according to claim 15 , wherein an arrangement of the first chip is asymmetrical with an arrangement of the second chip.
18. An electronic apparatus, comprising
a semiconductor apparatus, including:
a first chip, including:
a plurality of first penetrating electrodes; and
a second penetrating electrode, wherein the second penetrating electrode connects a first one of the first penetrating electrodes and an internal device of the first chip; and
a second chip, including:
a plurality of first penetrating electrodes; and
a second penetrating electrode, wherein the second penetrating electrode connects a second one of the first penetrating electrodes and an internal device of the second chip,
wherein the first chip is directly connected to, laminated on and integrated with the second chip,
wherein the first one of the first penetrating electrodes of the first chip is connected to a first one of the first penetrating electrodes of the second chip,
wherein a second one of the first penetrating electrodes of the first chip is connected to the second one of the first penetrating electrodes of the second chip,
wherein the second one of the first penetrating electrodes of the second chip is not connected to the first one of the first penetrating electrodes of the first chip,
wherein the first one of the first penetrating electrodes of the first chip and the first one of the first penetrating electrodes of the second chip taken together are connected to no more than one of the second penetrating electrodes,
wherein the second penetrating electrode of the first chip and the second penetrating electrode of the second chip are arranged at different positions, and
wherein no more than one second penetrating electrode that connects to an internal device is provided in each of the first chip and the second chip in a cross-sectional view.
19. The electronic apparatus according to claim 18 , wherein each of the first chip and the second chip has only one secondary electrode.
20. The electronic apparatus according to claim 18 , wherein an arrangement of the first chip is asymmetrical with an arrangement of the second chip.