Dynamic resource management in circuit bound array architecture
Systems and methods for dynamically assigning memory array die to CMOS die of a plurality of stacked die during memory operations are described. The plurality of stacked die may be vertically stacked and connected together via one or more vertical through-silicon via (TSV) connections. The memory array die may only comprise memory cell structures (e.g., vertical NAND strings) without column decoders, row decoders, charge pumps, sense amplifiers, control circuitry, page registers, or state machines. The CMOS die may contain support circuitry necessary for performing the memory operations, such as read and write memory operations. The one or more vertical TSV connections may allow each memory array die of the plurality of stacked die to communicate with or be electrically connected to one or more CMOS die of the plurality of stacked die.
1. An apparatus, comprising:
a plurality of stacked die including a first memory array die; and
a die mapping control circuit configured to identify a first memory operation for the first memory array die and determine a first set of support circuitry die of the plurality of stacked die for the first memory operation, the die mapping control circuit configured to set configurable electrical connections within the plurality of stacked die such that the first memory array die is electrically connected to memory array support circuitry within the first set of support circuitry die and cause the first memory operation for the first memory array die to be performed using the memory array support circuitry within the first set of support circuitry die.
2. The apparatus of claim 1 , wherein:
the memory array support circuitry within the first set of support circuitry die includes sensing circuitry for sensing memory cell currents associated with memory cells within the first memory array die.
3. The apparatus of claim 1 , wherein:
the die mapping control circuit configured to detect that more than one support circuitry die of the plurality of stacked die should be used during the first memory operation to satisfy a performance metric for the first memory operation and determine the first set of support circuitry die in response to detection that more than one support circuitry die should be used during the first memory operation.
4. The apparatus of claim 3 , wherein:
the first set of support circuitry die comprises two support circuitry die.
5. The apparatus of claim 3 , wherein:
the performance metric for the first memory operation comprises meeting at least a particular read bandwidth.
6. The apparatus of claim 1 , wherein:
the first memory operation comprises a read operation.
7. The apparatus of claim 1 , wherein:
the die mapping control circuit is arranged on one of the first set of support circuitry die.
8. The apparatus of claim 1 , wherein:
the die mapping control circuit is configured to identify a second memory operation for a second memory array die of the plurality of stacked die and determine a second set of support circuitry die of the plurality of stacked die for the second memory operation.
9. The apparatus of claim 7 , wherein:
the die mapping control circuit is configured to cause the second memory operation for the second memory array die to be performed using memory array support circuitry within the second set of support circuitry die, the second memory operation for the second memory array die and the first memory operation for the first memory array die are performed concurrently.
10. The apparatus of claim 1 , wherein:
the first memory array die includes vertical NAND strings.
11. A method, comprising:
identifying a first memory operation for a first memory array die of a plurality of stacked die;
identifying a second memory operation for a second memory array die of the plurality of stacked die;
detecting that a first support circuitry die of the plurality of stacked die should be time shared by the first memory array die and the second memory array die;
setting configurable electrical connections such that memory cells within the first memory array die are electrically connected to memory array support circuitry within the first support circuitry die;
performing the first memory operation for the first memory array die while the memory cells within the first memory array die are electrically connected to the memory array support circuitry within the first support circuitry die;
adjusting the configurable electrical connections such that memory cells within the second memory array die are electrically connected to the memory array support circuitry within the first support circuitry die; and
performing the second memory operation for the second memory array die while the memory cells within the second memory array die are electrically connected to the memory array support circuitry within the first support circuitry die.
12. The method of claim 11 , wherein:
the setting the configurable electrical connections causes sensing circuitry within the first support circuitry die to be electrically connected to the memory cells within the first memory array die.
13. The method of claim 11 , wherein:
the setting the configurable electrical connections includes setting crossbar switches located within one or more of the plurality of stacked die.
14. The method of claim 11 , wherein:
the first memory operation comprises a read operation.
15. The method of claim 14 , wherein:
the second memory operation comprises a programming operation.
16. The method of claim 11 , wherein:
the first memory array die includes vertical NAND strings.
17. An apparatus, comprising:
a plurality of vertically stacked die including a first memory array die and a first CMOS die; and
a control circuit configured to detect that a first memory operation is to be performed using the first memory array die and identify the first CMOS die in response to detection that the first memory operation is to be performed using the first memory array die, the control circuit configured to cause memory cell sensing circuitry arranged on the first CMOS die to be electrically connected to one or more memory cells arranged on the first memory array die, the control circuit configured to cause memory cell currents associated with the one or more memory cells arranged on the first memory array die to be sensed using the memory cell sensing circuitry arranged on the first CMOS die during the first memory operation.
18. The apparatus of claim 17 , wherein:
the memory cell sensing circuitry comprises a sense amplifier.
19. The apparatus of claim 17 , wherein:
the first memory operation comprises a read operation.
20. The apparatus of claim 17 , wherein:
the control circuit is arranged on the first CMOS die.