Method for removing a contamination layer by an atomic layer etching process
A method for at least partially removing a contamination layer ( 24 ) from an optical surface ( 14 a ) of an optical element ( 14 ) that reflects EUV radiation includes: performing an atomic layer etching process for at least partially removing the contamination layer ( 24 ) from the optical surface ( 14 a ), which, in turn, includes: exposing the contamination layer ( 24 ) to a surface-modifying reactant ( 44 ) in a surface modification step, and exposing the contamination layer ( 24 ) to a material-detaching reactant ( 45 ) in a material detachment step. The optical element ( 14 ) is typically taken, before the atomic layer etching process is performed, from an optical arrangement, in particular from an EUV lithography system, in which the optical surface ( 14 a ) of the optical element ( 14 ) is exposed to EUV radiation ( 6 ), during which the contamination layer ( 24 ) is formed.
1. Method for at least partially removing a contamination layer from an optical surface of an optical element that reflects extreme ultraviolet (EUV) radiation, comprising:
taking the optical element from a selected optical arrangement, in which the optical surface of the optical element is exposed to EUV radiation, into a process chamber of an atomic layer etching apparatus, which process chamber is external to the selected optical arrangement;
subsequent to said taking step, performing an atomic layer etching process in the process chamber, for at least partially removing the contamination layer from the optical surface, wherein said performing step comprises:
in a surface modification step, exposing the contamination layer to a surface-modifying reactant, and
in a material detachment step, exposing the contamination layer to a material-detaching reactants, and
wherein at least one of said surface modification step and said material detachment step is plasma-assisted; and
subsequent to said performing step, installing the optical element in a further optical arrangement.
2. Method according to claim 1 , wherein the selected optical arrangement is the further optical arrangement.
3. Method according to claim 1 , wherein said taking step comprises removing the optical element from an EUV lithography system in which the optical surface of the optical element is exposed to the EUV radiation.
4. Method according to claim 3 , wherein said installing step comprises installing the optical element in a further EUV lithography system, in which the optical surface of the optical element is exposed to the EUV radiation.
5. Method according to claim 1 , wherein the atomic layer etching process comprises a spatial atomic layer etching process.
6. Method according to claim 1 , wherein the contamination layer contains at least one chemical element selected from the group comprising: Zn, Sn, P, As, B, Si, In, Pb, Mg, Na, Ge, Cu, Ag, and Au.
7. Method according to claim 1 , wherein the contamination layer is at least partially removed from a capping layer of a reflective coating forming the optical surface of the reflective optical element.
8. Method according to claim 1 , wherein, in said surface modification step, the surface-modifying reactant comprises at least one of a hydrocarbon and a halogen, and wherein, in said material detachment step, the material-detaching reactant comprises hydrogen (H 2 ).
9. Method according to claim 8 , wherein, in said surface modification step, the surface-modifying reactant comprises at least one of chlorine, arsenic and boron.
10. Method according to claim 1 , further comprising generating the plasma in an atomic layer etching head.
11. Method according to claim 10 , wherein said generating comprises generating the plasma at a pressure between 100 mbar and 2000 mbar.
12. Method according to claim 10 , wherein the plasma is generated in a dielectric barrier discharge plasma source of the atomic layer etching head.
13. Method according to claim 1 , wherein, in said surface modification step, the surface-modifying reactant comprises oxygen (O 2 ) supplied to the contamination layer as a gas composition comprising at least one of O 2 , N 2 O, H 2 O, H 2 O 2 added to a carrier gas.
14. Method according to claim 1 , wherein, in said material detachment step, the material-detaching reactant, comprises hydrogen (H 2 ) supplied to the contamination layer as a gas composition comprising at least one of H 2 , NH 3 or hydrocarbons added to a carrier gas.
15. Method according to claim 1 , further comprising producing a temperature change (ΔT u , ΔT d ) between said surface modification step and said material detachment step.
16. Method according to claim 15 , wherein the temperature change (ΔT u , ΔT d ) between said surface modification step and said material detachment step is greater than +/−100 K/s.
17. Method for at least partial removing a contamination layer from an optical surface of an optical element that reflects extreme ultraviolet (EUV) radiation, comprising:
taking the optical element from a selected optical arrangement, in which the optical surface of the optical element is exposed to EUV radiation, into a process chamber of an atomic layer etching apparatus, which process chamber is external to the selected optical arrangement;
subsequent to said taking step performing, an atomic layer etching process in the process chamber, for at least partially removing the contamination layer from the optical surface, wherein said performing step comprises:
in a surface modification step, exposing the contamination layer to a surface-modifying reactant, and
in a material detachment step, exposing the contamination layer to a material-detaching reactant, wherein, in said surface modification step, the surface-modifying reactant comprises oxygen (O 2 ) and wherein, in said material detachment step, the material-detaching reactant comprises hydrogen (H 2 ); and
subsequent to said performing step, installing the optical element in a further optical arrangement.
18. Method for at least partially removing a contamination layer from an optical surface of an optical element that reflects extreme ultraviolet EUV radiation, comprising:
taking the optical element from a selected optical arrangement, in which the optical surface of the optical element is exposed to EUV radiation, into a process chamber of an atomic layer etching apparatus, which process chamber is external to the selected optical arrangement;
subsequent to said taking step, performing an atomic layer etching process in the process chamber, for at least partially removing the contamination layer from the optical surface, wherein said performing step comprises:
in a surface modification step, exposing the contaminnation layer to a surface-modifying reactant, and
in a material detachment step, exposing the contamination layer to a material-detaching reactant,
wherein, in said surface modification step, the surface-modifying reactant comprises an organic compound, and wherein, in the material detachment step, the material-detaching reactant comprises oxygen (O 2 )); and
subsequent to said performing step, installing the optical element in a further optical arrangement.
19. Method according to claim 18 , wherein the organic compound comprises acetylacetone.
20. Method for at least partially removing a contamination layer from an optical surface of an optical element that reflects extreme ultraviolet (EUV) radiation, comprising:
taking the optical element from a selected optical arrangement in which the optical surface of the optical element is exposed to EUV radiation;
subsequent to said taking step, performing an atomic layer etching process for at least partially removing the contamination layer from the optical surface,
wherein said performing step comprises:
in a surface modification step, exposing the contamination layer to a surface-modifying reactant, and
in a material detachment step, exposing the contamination layer to a material-detaching reactant; and
subsequent to said performing step, installing the optical element in a further optical arrangement,
wherein either: (i) in said surface modification step, the surface-modifying reactant comprises oxygen (O 2 ) and, in said material detachment step, the material-detaching reactant comprises hydrogen (H 2 ),
or (ii) in said surface modification step, the surface-modifying reactant comprises an organic compound and, in said material detachment step, the material-detaching reactant comprises oxygen (O 2 ).
21. Method according to claim 20 , wherein the organic compound comprises acetylacetone.
22. Method for at least partially removing a contamination layer from an optical surface of an optical element that reflects extreme ultraviolet (EUV) radiation, comprising:
taking the optical element from a selected optical arrangement in which the optical surface of the optical element is exposed to EUV radiation;
subsequent to said taking step, performing an atomic layer etching process for at least partially removing the contamination layer from the optical surface, wherein said performing step comprises:
in a surface modification step, exposing the contamination layer to a surface-modifying reactant, and
in a material detachment step, exposing the contamination layer to a material-detaching reactant,
wherein at least one of said surface modification step and said material detachment step is plasma-assisted;
generating the plasma in a dielectric barrier discharge plasma source of an atomic layer etching head,
wherein said generating step comprises generating the plasma at a pressure between 100 mbar and 2000 mbar; and
subsequent to said performing step, installing the optical element in a further optical arrangement.
23. Method for at least partially removing a contamination layer from an optical surface of an optical element that reflects extreme ultraviolet (EUV) radiation, comprising:
taking the optical element from a selected optical arrangement in which the optical surface of the optical element is exposed to EUV radiation;
subsequent to said taking step, performing an atomic layer etching process for at least partially removing the contamination layer from the optical surface, wherein said performing step comprises:
in a surface modification step, exposing the contamination layer to a surface-modifying reactant, and
in a material detachment step, exposing the contamination layer to a material-detaching reactant; and
producing a temperature change (ΔT u , ΔT d ) between said surface modification step and said material detachment step; and
subsequent to said performing step, installing the optical element in a further optical arrangement.