Semiconductor device and method of manufacturing the same
A method of manufacturing a semiconductor device includes forming an interlayer insulating film over a main surface of a semiconductor substrate, forming a first conductive film pattern for a first pad and a second conductive film pattern for a second pad over the interlayer insulating film, forming an insulating film over the interlayer insulating film such that the insulating film covers the first and the second conductive film patterns, forming a first opening portion for the first pad, the first opening portion exposing a portion of the first conductive film pattern, and a second opening portion for the second pad, the second opening portion exposing a portion of the second conductive film pattern, in the insulating film, and forming a first plated layer by plating over the portion of the first conductive film pattern exposed in the first opening portion, and a second plated layer.
1. A method of manufacturing a semiconductor device, the method comprising:
(a) forming an interlayer insulating film over a main surface of a semiconductor substrate;
(b) forming a first conductive film pattern for a first pad and a second conductive film pattern for a second pad over the interlayer insulating film;
(c) forming an insulating film over the interlayer insulating film such that the insulating film covers the first and the second conductive film patterns;
(d) forming a first opening portion for the first pad, the first opening portion exposing a portion of the first conductive film pattern, and a second opening portion for the second pad, the second opening portion exposing a portion of the second conductive film pattern, in the insulating film; and
(e) forming a first plated layer by plating over the portion of the first conductive film pattern exposed in the first opening portion, and a second plated layer by plating over the portion of the second conductive film pattern exposed in the second opening portion,
wherein an area of the second opening portion is smaller than an area of the first opening portion,
wherein the semiconductor substrate is kept still without swinging when the first plated layer and the second plated layer are formed by plating, and
wherein a thickness of the second plated layer in a center of the second opening portion is greater than a thickness of the first plated layer in a center of the first opening portion.
2. The method of manufacturing the semiconductor device according to claim 1 , wherein the first and the second conductive film patterns include a conductive material containing aluminum as a main component.
3. The method of manufacturing the semiconductor device according to claim 1 , wherein the first plated layer includes a first nickel plated layer,
wherein the second plated layer includes a second nickel plated layer,
wherein the (e) includes:
(e1) forming the first nickel plated layer over the portion of the first conductive film pattern exposed in the first opening portion, and the second nickel plated layer over the portion of the second conductive film pattern exposed in the second opening portion, and
wherein a thickness of the second nickel plated layer is greater than a thickness of the first nickel plated layer.
4. The method of manufacturing the semiconductor device according to claim 3 , wherein, in the (e1), a film-forming speed of the second nickel plated layer is larger than a film-forming speed of the first nickel plated layer.
5. The method of manufacturing the semiconductor device according to claim 3 , wherein the thickness of the second nickel plated layer is 1.2 times or more the thickness of the first nickel plated layer.
6. The method of manufacturing the semiconductor device according to claim 3 , wherein the first plated layer includes the first nickel plated layer, and a first gold plated layer formed over the first nickel plated layer,
wherein the second plated layer includes the second nickel plated layer, and a second gold plated layer formed over the second nickel plated layer, and
wherein the (e) further includes:
(e2) after the (e1), forming the first gold plated layer over the first nickel plated layer, and the second gold plated layer over the second nickel plated layer.
7. The method of manufacturing the semiconductor device according to claim 3 , wherein the first plated layer includes the first nickel plated layer, a first palladium plated layer formed over the first nickel plated layer, and a first gold plated layer formed over the first palladium plated layer,
wherein the second plated layer includes the second nickel plated layer, a second palladium plated layer formed over the second nickel plated layer, and a second gold plated layer formed over the second palladium plated layer, and
wherein the (e) includes:
(e2) after the (e1), forming the first palladium plated layer over the first nickel plated layer, and the second palladium plated layer over the second nickel plated layer; and
(e3) after the (e2), forming the first gold plated layer over the first palladium plated layer, and the second gold plated layer over the second palladium plated layer.
8. The method of manufacturing the semiconductor device according to claim 3 , wherein, in the (e1), the first nickel plated layer and the second nickel plated layer are grown in a state where a concentration of a reducing agent in a plating solution in a vicinity of the portion of the first conductive film pattern exposed in the first opening portion is lower than that in a vicinity of the portion of the second conductive film pattern exposed in the second opening portion.
9. The method of manufacturing the semiconductor device according to claim 1 , further comprising:
(a1) before the (a), forming a semiconductor element in the semiconductor substrate; and
(f) after the (e), forming a back surface electrode over a back surface opposite to the main surface of the semiconductor substrate.
10. The method of manufacturing the semiconductor device according to claim 9 , wherein the semiconductor element includes a power MISFET, and the first conductive film pattern includes a source conductive film pattern, the second conductive film pattern includes a gate conductive film pattern, and the back surface electrode includes a drain back surface electrode.
11. The method of manufacturing the semiconductor device according to claim 1 , wherein the first conductive film pattern and the first plated layer include a bonding pad for connecting a metal plate, and
wherein the second conductive film pattern and the second plated layer include a bonding pad for connecting a wire.
12. The method of manufacturing the semiconductor device according to claim 1 , wherein, in the (e), a flow rate of a plating solution is lowered.
13. The method of manufacturing the semiconductor device according to claim 12 , wherein, in the (e), the flow rate of the plating solution is lowered from 18 L/min to 10 L/min.
14. The method of manufacturing the semiconductor device according to claim 12 , wherein a temperature of the plating solution is 80° C. to 90° C.
15. The method of manufacturing the semiconductor device according to claim 14 , wherein a PH of the plating solution is in a range from 4 to 5.
16. The method of manufacturing the semiconductor device according to claim 15 , wherein the plating solution contains nickel sulfate, and
wherein a Ni concentration is in a range from 5 g/L to 6.5 g/L.
17. The method of manufacturing the semiconductor device according to claim 1 ,
wherein, in the (e), the first plated layer and the second plated layer are formed by immersing the semiconductor substrate in a plating solution stored in a treatment tank.
18. A method of manufacturing a semiconductor device, the method comprising:
(a) forming an interlayer insulating film over a main surface of a semiconductor substrate;
(b) forming a first conductive film pattern for a first pad and a second conductive film pattern for a second pad over the interlayer insulating film;
(c) forming an insulating film over the interlayer insulating film such that the insulating film covers the first and the second conductive film patterns;
(d) forming a first opening portion for the first pad, the first opening portion exposing a portion of the first conductive film pattern, and a second opening portion for the second pad, the second opening portion exposing a portion of the second conductive film pattern, in the insulating film; and
(e) forming a first plated layer by plating over the portion of the first conductive film pattern exposed in the first opening portion, and a second plated layer by plating over the portion of the second conductive film pattern exposed in the second opening portion,
wherein an area of the second opening portion is smaller than an area of the first opening portion,
wherein a thickness of the second plated layer is greater than a thickness of the first plated layer,
wherein the semiconductor substrate is kept still without swinging when the first plated layer and the second plated layer are formed by plating,
wherein the first plated layer includes a first nickel plated layer,
wherein the second plated layer includes a second nickel plated layer,
wherein the (e) includes:
(e1) forming the first nickel plated layer over the portion of the first conductive film pattern exposed in the first opening portion, and the second nickel plated layer over the portion of the second conductive film pattern exposed in the second opening portion,
wherein a thickness of the second nickel plated layer is greater than a thickness of the first nickel plated layer, and
wherein, in the (e1), a film-forming speed of the second nickel plated layer is larger than a film-forming speed of the first nickel plated layer.
19. A method of manufacturing a semiconductor device, the method comprising:
(a) forming an interlayer insulating film over a main surface of a semiconductor substrate;
(b) forming a first conductive film pattern for a first pad and a second conductive film pattern for a second pad over the interlayer insulating film;
(c) forming an insulating film over the interlayer insulating film such that the insulating film covers the first and the second conductive film patterns;
(d) forming a first opening portion for the first pad, the first opening portion exposing a portion of the first conductive film pattern, and a second opening portion for the second pad, the second opening portion exposing a portion of the second conductive film pattern, in the insulating film; and
(e) forming a first plated layer by plating over the portion of the first conductive film pattern exposed in the first opening portion, and a second plated layer by plating over the portion of the second conductive film pattern exposed in the second opening portion,
wherein an area of the second opening portion is smaller than an area of the first opening portion,
wherein a thickness of the second plated layer is greater than a thickness of the first plated layer,
wherein the semiconductor substrate is kept still without swinging when the first plated layer and the second plated layer are formed by plating,
wherein the first plated layer includes a first nickel plated layer,
wherein the second plated layer includes a second nickel plated layer,
wherein the (e) includes:
(e1) forming the first nickel plated layer over the portion of the first conductive film pattern exposed in the first opening portion, and the second nickel plated layer over the portion of the second conductive film pattern exposed in the second opening portion,
wherein a thickness of the second nickel plated layer is greater than a thickness of the first nickel plated layer, and
wherein, in the (e1), the first nickel plated layer and the second nickel plated layer are grown in a state where a concentration of a reducing agent in a plating solution in a vicinity of the portion of the first conductive film pattern exposed in the first opening portion is lower than that in a vicinity of the portion of the second conductive film pattern exposed in the second opening portion.