Method for forming hybrid-bonding structure

1. A method for forming a packaging structure, comprising:

forming a conductive structure over a first semiconductor substrate;

forming a first dielectric layer over the conductive structure;

partially removing the first dielectric layer to form a first dielectric dummy pattern, a second dielectric dummy pattern and a third dielectric dummy pattern and an opening through the first dielectric layer, wherein the first dielectric dummy pattern, the second dielectric dummy pattern and the third dielectric dummy pattern are surrounded by the opening; and

forming a first conductive line in the opening, wherein the first conductive line is in contact with the conductive structure.

2. The method for forming the packaging structure as claimed in claim 1 , wherein forming the first conductive line in the opening comprises:

depositing a conductive material to fill the opening; and

removing the conductive material outside the opening.

3. The method for forming the packaging structure as claimed in claim 2 , further comprising:

depositing a seed layer to line the opening before depositing the conductive material to fill the opening.

4. The method for forming the packaging structure as claimed in claim 1 , wherein the opening exposes the conductive structure.

5. The method for forming the packaging structure as claimed in claim 1 , further comprising:

forming a second conductive structure over a second semiconductor substrate;

forming a second dielectric layer over the second conductive structure;

partially removing the second dielectric layer to form a fourth dielectric dummy pattern, a fifth dielectric dummy pattern and a sixth dielectric dummy pattern and a second opening through the second dielectric layer, wherein the fourth dielectric dummy pattern, the fifth dielectric dummy pattern and the sixth dielectric dummy pattern are surrounded by the second opening;

forming a second conductive line in the second opening, wherein the second conductive line is in contact with the second conductive structure; and

bonding the first conductive line to the second conductive line.

6. The method for forming the packaging structure as claimed in claim 5 , wherein the first dielectric dummy pattern is in contact with the fourth dielectric dummy pattern, the second dielectric dummy pattern is in contact with the fifth dielectric dummy pattern, and the third dielectric dummy pattern is in contact with the sixth dielectric dummy pattern.

7. The method for forming the packaging structure as claimed in claim 1 , wherein forming the first dielectric layer comprises:

forming a first dielectric sublayer over the first semiconductor substrate; and

forming a second dielectric sublayer over the first dielectric sublayer, wherein the first dielectric sublayer and the second dielectric sublayer are made of different materials.

8. The method for forming the packaging structure as claimed in claim 1 , wherein the second dielectric dummy pattern is located between the first dielectric dummy pattern and the third dielectric dummy pattern, and a maximum distance between the first dielectric dummy pattern and the second dielectric dummy pattern is greater than a maximum distance between the second dielectric dummy pattern and the third dielectric dummy pattern.

9. The method for forming the packaging structure as claimed in claim 8 , wherein the first dielectric dummy pattern, the second dielectric dummy pattern, and the third dielectric dummy pattern are aligned in a straight line in a first direction, and no dielectric material is formed between the first dielectric dummy pattern and the second dielectric dummy pattern and between the second dielectric dummy pattern and the third dielectric dummy pattern along the first direction.

10. A method for forming a packaging structure, comprising:

forming a first dielectric layer over a first seal ring structure;

removing portions of the first dielectric layer to form a first dielectric dummy pattern, a second dielectric dummy pattern and a third dielectric dummy pattern and an opening through the first dielectric layer, wherein the first dielectric dummy pattern, the second dielectric dummy pattern and the third dielectric dummy pattern are surrounded by the opening;

forming a seed layer at a bottom surface and a sidewall of the opening; and

forming a conductive material over the seed layer, wherein the seed layer and the conductive material forms a first conductive line in the opening.

11. The method for forming the packaging structure as claimed in claim 10 , wherein the first seal ring structure comprises:

a plurality of conductive layers; and

a plurality of vias alternately arranged with the plurality of conductive layers, wherein the first conductive line is in contact with a topmost conductive layer of the plurality of the conductive layers of the first seal ring structure.

12. The method for forming the packaging structure as claimed in claim 10 , further comprising:

forming a second dielectric layer over a second seal ring structure;

forming a second conductive line through the second dielectric layer and electrically connected to the second seal ring structure, wherein the second conductive line surrounds a fourth dielectric dummy pattern, a fifth dielectric dummy pattern and a sixth dielectric dummy pattern of the second dielectric layer; and

bonding the first conductive line to the second conductive line.

13. The method for forming the packaging structure as claimed in claim 10 , wherein the second dielectric dummy pattern is located between the first dielectric dummy pattern and the third dielectric dummy pattern, and the first dielectric dummy pattern, the second dielectric dummy pattern, and the third dielectric dummy pattern are aligned in a straight line in a first direction.

14. The method for forming the packaging structure as claimed in claim 13 , wherein a maximum distance between the first dielectric dummy pattern and the second dielectric dummy pattern is greater than a maximum distance between the second dielectric dummy pattern and the third dielectric dummy pattern.

15. The method for forming the packaging structure as claimed in claim 14 , wherein no dielectric material is formed between the first dielectric dummy pattern and the second dielectric dummy pattern and between the second dielectric dummy pattern and the third dielectric dummy pattern along the first direction.

16. A method for forming a packaging structure, comprising:

forming a first dielectric layer over a first substrate;

removing portions of the first dielectric layer to form a first plurality of dielectric dummy patterns and a first opening surrounding the first plurality of dielectric dummy patterns;

forming a first conductive line in the first opening;

forming a second dielectric layer over a second substrate;

removing portions of the second dielectric layer to form a second plurality of dielectric dummy patterns and a second opening surrounding the second plurality of dielectric dummy patterns;

forming a second conductive line in the second opening; and

bonding the first conductive line to the second conductive line, wherein the first plurality of dielectric dummy patterns are in contact with the second plurality of dielectric dummy patterns to form a first dielectric dummy pattern, a second dielectric dummy pattern and a third dielectric dummy pattern after bonding,

wherein the second dielectric dummy pattern is located between the first dielectric dummy pattern and the third dielectric dummy pattern, and a maximum distance between the first dielectric dummy pattern and the second dielectric dummy pattern is greater than a maximum distance between the second dielectric dummy pattern and the third dielectric dummy pattern.

17. The method for forming the packaging structure as claimed in claim 16 , wherein the first dielectric dummy pattern, the second dielectric dummy pattern, and the third dielectric dummy pattern are aligned in a straight line in a first direction, and no dielectric material is formed between the first dielectric dummy pattern and the second dielectric dummy pattern and between the second dielectric dummy pattern and the third dielectric dummy pattern along the first direction.

18. The method for forming the packaging structure as claimed in claim 16 , further comprising:

forming a fourth dielectric dummy pattern next to the first dielectric dummy pattern after bonding, wherein a maximum distance between the first dielectric dummy pattern and the fourth dielectric dummy pattern is equal to the maximum distance between the second dielectric dummy pattern and the third dielectric dummy pattern.

19. The method for forming the packaging structure as claimed in claim 18 , further comprising:

forming a fifth dielectric dummy pattern next to the fourth dielectric dummy pattern after bonding, wherein a lengthwise direction of the fifth dielectric dummy pattern is perpendicular to a lengthwise direction of the first dielectric dummy pattern.

20. The method for forming the packaging structure as claimed in claim 19 , wherein a maximum distance between the fourth dielectric dummy pattern and the fifth dielectric dummy pattern is greater than a maximum distance between the first dielectric dummy pattern and the fourth dielectric dummy pattern.